Senju Metal Industry Co., Ltd.

Sony Corporation

Mitsuo Zen

Satoshi Ozawa

Hirokazu Ichikawa

Sanae Taniguchi

Takenori Azuma

Hisashi Suwa

Hideyuki Yoshino

Kenichi Tomitsuka

Hidetoshi Nakamura

Masaaki Goto

Fumiaki Nishiuchi

Misao Nakajima

Kinjiro Takayama

Tatsuo Fujita

In a conventional wave soldering bath, molten solder spouted from a second discharge nozzle did not have a uniform height, oxides were spouted from the nozzle opening and adhered to printed circuit boards, and constituent parts of the wave soldering bath were eroded. In a wave soldering bath according to the present invention, a cylinder is disposed at one end of a duct, a spiral pump is installed in the cylinder, and the width of a nozzle opening is made narrower than the width of the duct.

Wave soldering bath

In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of the bottom surface of the bath body is a vortex (T) of molten solder formed below the duct inlet accompanying rotation of an impeller pump (), and the vortex rubs the bottom surface of the bath body. In the present invention, a shielding member () is installed between the duct inlet () and the bottom surface () of the bath body such that the vortex is prevented from affecting the bottom surface.

In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump and the casing was wide, so there was reverse flow through the gap. It is conceivable to narrow the gap, but if the gap is made narrow, the screw pump ends up contacting the casing if the screw pump becomes eccentric. A wave soldering tank according to the present invention makes the diameter of the inlet in the bottom of the casing smaller than the diameter of the screw pump so that reverse flow does not take place even if the gap between the screw pump and the casing is wide. Flow is made more stable by providing outwardly flaring guide walls on the outlet of the casing.

Wave soldering tank

A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. The wave soldering tankhas a tank bodywhich houses molten solder S, a discharge pumpwhich pumps molten solder S, a discharge nozzlewhich spouts molten solder S which was sent to it by the discharge pumpupwards, a ducthaving the discharge pumpinstalled at one of its ends and the discharge nozzleinstalled at its other end, an oxidation preventing memberwhich has a prescribed size and which floats on the surface of the molten solder S, and an engaging meanswhich controls rotation of the oxidation preventing memberin a horizontal plane. The oxidation preventing memberhas a surrounding memberwhich extends downwards at its center and which surrounds the rotating shaftwith a gap between it and the rotating shaft, and a hollow spacein its interior for providing buoyancy.

A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn&#x2014;Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a package. The lid can be joined to a base of a package at a low temperature, thereby reducing vaporization of solder components and adhesion thereof to electronic devices within the package.

Solder coated lid

A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surface of the wall structure by 10&#x2013;500 &#x3bc;m and has solder on an inner surface thereof. The lid can be soldered to a plate-shaped base to form a package. The lid can be conveniently formed by performing drawing of a metal strip coated with solder to define a recessed shape, and then severing a flange of the recessed shape to define the lip.

Lid for use in packaging an electronic device and method of manufacturing the lid

The present invention is a solder coated material having a large amount of solder adhered to a difficult to solder material such as Kovar or Alloy 42 and a method which can adhere a sufficient amount of solder to a difficult to solder material without using flux. An electroplated coating is applied to a portion to be soldered of a difficult to solder material, the difficult to solder material is then passed through molten solder to which ultrasonic waves are applied, and a large amount of solder is adhered only to solder plated portions.

Solder coated material and method for its manufacture

A wave soldering apparatus includes a solder reservoir adapted to contain molten solder, and a solder nozzle disposed in the solder reservoir and extending up above the molten solder. The nozzle provides a substantially turbulent free solder wave under a printed circuit board while the board is moved in a predetermined path. A tray is pivotably mounted to the nozzle and angularly moved to vary the flow rate of the molten solder. A shroud is mounted adjacent to and associated with the tray to define a contained space into which an inert gas is supplied to provide an inert gas atmosphere. The shroud includes a canopy extending over a portion of the tray. The canopy extends substantially parallel to the predetermined path and is adjustably positioned in response to angular position of the tray to ensure that the board exits from the solder wave within the inert gas atmosphere.

Automatic wave soldering apparatus and method

A jet solder bath is comprised of a bath unit which contains a molten solder, a nozzle member provided within the bath unit and constructing a nozzle mouth, a tank provided in at least one side of the nozzle member along the nozzle mouth and temporarily accumulating a solder jetted from the nozzle mouth, and a molten solder outlet provided on the lower portion of the tank and communicating the tank with a molten solder still area provided within the solder bath unit under the liquid level of the molten solder. According to the above-mentioned arrangement, the molten solder can be suppressed from being oxidized as much as possible and the removal of a resultant oxide can be facilitated.

Jet solder bath

A fountain-type soldering apparatus is disclosed, which comprises:

Fountain-type soldering apparatus

There is provided a flush type sprinkler head to be installed in the ceiling of a building, the sprinkler protruding out of the ceiling by a small distance. The sprinkler head comprises a main body defining a nozzle having a valve seat at the lower end, a cylindrical frame having a radially inwardly extending flange at the lower end, a valve member normally abutting against the valve seat to close the nozzle, a slidable deflector assembly fitting on the valve member and including a guide ring having slide bars extending downwardly from the guide ring and a deflector slidable along the slide bars, a coil spring interposed between the main body and guide ring and a break-up closure assembly adapted to break into pieces at rise in the temperature at the installation area of the sprinkler head and including a thermally responsive element.

Growing community of inventors

Souka, Japan

Mitsuo Zen