Hitachi Chemical Company, Ltd.

Other

Hitachi, Ltd.

Mitsuo Yokota

Akio Takahashi

Masao Suzuki

Tokihito Suwa

Satoru Amou

Mineo Kawamoto

Shiro Kobayashi

Kazuyuki Tanaka

Masashi Miyazaki

Akinori Hanawa

Hiroyuki Fukai

Etsuji Iwami

Masanori Nemoto

Akira Shimizu

Yoshiyuki Mukoyama

Jun Matsuzawa

Yutaka Yamaguchi

Yukihiko Yamashita

Kenji Tsukanishi

Masaki Kamiya

Norihiko Shibata

Masao Asaoka

Takao Sugawara

Masatoshi Narahara

A multilayer circuit board having a resolution in the range of 25-80 &mgr;m, and blind via-holes between layers, the blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer having the blind via-holes between the layers has a glass transition temperature in the range of 150-220&deg; C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process are reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes are suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.

Multilayer circuit board having insulating layer with via-holes

Photosensitive resin composition, and multilayer printed circuit board using the same

A multilayer circuit board having a resolution in the range of 25-80 .mu.m, and blind via-holes having an aspect ratio in the range of 2.0-0.6 for effecting access between the layers, wherein an insulating layer between said layers having the blind via-holes has a glass transition temperature in the range of 150-220.degree. C., and an epoxy group photosensitive resin composition is used therefor. A photosensitive resin composition having a preferable resolution and heat resistance is obtained. A multilayer circuit board is provided in which the thermal stress generated in the steps of a reflow process, a gold wire bonding process and a repairing process in a bare chip mounting process was reduced, and peeling off of the conductor wiring and deformation of the multilayer circuit board caused by mechanical stresses during the heating processes were suppressed. Accordingly, a decrease in the size and weight of an electronic apparatus is possible.

Multilayer circuit board and photosensitive resin composition used

A thermosetting resin composition comprising (A) a dibasic acid modified epoxy (meth)acrylate resin obtained by reacting a bromine-containing epoxy resin with a dibasic acid of 4 or more carbon atoms followed by further reacting with acrylic acid or methacrylic acid, (B) a thermosetting resin having an unsaturated group, the unsaturated group being copolymerizable with the resin (A), and (C) a polymerizable monomer; and an electrical laminate produced by using the thermosetting resin composition are disclosed.

Electrical laminate with dibasic acid-modified epoxy (meth)acrylate

A resin composition comprising a copolymer (A) having carbon-carbon unsaturated bonds in its side chains, particularly that obtained by reacting a copolymer of alkyl (meth)arylate (0-50 mole %), hydroxy (meth)acrylate (10-50 mole %) and ethylenic unsaturated monomer (0 to 90 mole %) with an unsaturated carboxylic acid or an anhydride thereof, and a monomer (B) copolymerizable with (A) is suitable for producing a laminate for electrical use.

Resin composition and electrical laminate obtained therefrom

A flame retardant electrical laminate prepared by impregnating a base material with a halogen-containing unsaturated polyester resin which is prepared by dissolving a halogen-containing unsaturated polyester into a polymerizable monomer; and then curing the halogen-containing unsaturated polyester resin; wherein the halogen-containing unsaturated polyester has a molecular weight per 1 mole of unsaturated group of 350 to 1,000, and the cured halogen-containing unsaturated polyester resin has a glass transition temperature of 30.degree. to 90.degree. C. Such electrical laminates not only have excellent flame redardancy but also excellent puching quality at wide temperature range including room temperature.

Flame retardant electrical laminate

A substrate for high-frequency circuits best suited as a substrate for a flat antenna to receive satellite-broadcast microwaves or as a similar substrate, the substrate comprising (i) a porous insulator layer wherein the proportion by volume of open cells to all the cells is at least 50% and (ii) a metal foil laminated over at least one side of the insulator layer through (iii) a water-impermeable film, and a process for making such substrates.

Substrate for high-frequency circuit and process for making the same

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Yuuki, Japan

Mitsuo Yokota