Kyocera Corporation

Mitsuo Yanagisawa

Daisuke Sakumoto

Shingo Matsuura

Satoru Tomie

Yuki Mori

Fumiaki Sekine

Hisaki Masuda

Kenichi Ura

Daisuke Sakamoto

A package includes a base body having a mounting portion for mounting a light-emitting device, a frame-shaped first reflection member attached to the upper surface of the base body, an inner peripheral surface of which is shaped into a first light reflecting surface and surrounds the mounting portion, and a frame-shaped second reflection member attached to the upper surface of the base body, with a spacing secured between an inner peripheral surface of the second reflection member and an outer peripheral surface of the first reflection member, the inner peripheral surface surrounding the first reflection member and having a second light reflecting surface at a location above an upper end of the first reflection member.

Package for light-emitting device, light-emitting apparatus, and illuminating apparatus

A light-emitting chip includes a base, a transparent material layer and a light-emitting chip. The base has an upper surface including a conductive pattern. The transparent material layer is disposed on the upper surface of the base and has an opening part which is located on region at least part of the conductive pattern. The light-emitting chip is mounted on the conductive pattern and located in the opening part of the transparent material layer.

Light emitting device and method for manufacturing the same

To provide a light emitting device and a light emitting module which can suppress deterioration caused by light emitted from a light emitting chip, even in the case of using a light emitting chip emitted light of which has a short wavelength and in which deterioration of emission brightness and the like does not easily occur even if used for a long period of time. The device is characterized by including a container () which is formed of a transparent inorganic material and has a recessed opening, a light emitting chip () which is disposed in the recessed opening of the container () with a glass bonding member () interposed therebetween and in which a first conduction type layer (), a light emitting layer (), and a second conduction layer () are formed on a substrate (), and a lid () which is formed of a transparent inorganic material and blocks the recessed opening of the container. The container () and the lid () are formed of quartz glass, optical glass containing boric acid and silicic acid, crystal, sapphire, fluorite or the like.

Light emitting device and light emitting module

A package for housing a photosemiconductor element comprises a substrate having a mounting portion on a top surface of which a photosemiconductor element is mounted, a frame attached onto the substrate to surround the mounting portion and having a through hole on a side thereof, a cylindrical fixing member attached around the through hole of the frame and having a space therein for transmitting an optical signal, a light transmitting member attached to the cylindrical fixing member, for clogging the inside of the fixing member and a lid attached onto a top surface of the frame, hermetically sealing the photosemiconductor element. The fixing member is made of an alloy of from 40 to 60 wt % iron and from 40 to 60 wt % nickel. The coefficient of thermal expansion of the fixing member is about 9.5&times;10 /&deg; C. (room temperature to 400&deg; C.), which is close to that of the light transmitting member of amorphous glass, so that no thermal stress caused by the difference in coefficient of thermal expansion occurs in attaching the two. Because there is no thermal stress, which causes the double-refraction of the light excited by the photosemiconductor element, the excited light is received by the optical fiber member without being double-refracted in the light transmitting member, and the transmission efficiency of optical signal is enhanced.

Package for housing photosemiconductor element

The invention relates to an optical semiconductor device housing package comprising a base having a mounting portion on an upper surface of which an optical semiconductor device is mounted; a frame attached to the base so as to encircle the mounting portion, the frame having a through-hole in one side thereof; a cylindrically shaped fixing member into which an optical fiber is inserted, the cylindrically shaped fixing member being fixed to the through-hole of the frame; a light-transmitting member attached to one end portion of the fixing member; and a lid member mounted on an upper face of the frame, for hermetically sealing the optical semiconductor device, wherein the light-transmitting member is formed of amorphous glass.

Growing community of inventors

Higashiomi, Japan

Mitsuo Yanagisawa