Tokyo Shibaura Denki Kabushiki Kaisha

Fuji Electric Co., Ltd.

Kabushiki Kaisha Toshiba

Denki Kagaku Kogyo Kabushiki Kaisha

Shibaura Institute of Technology

Fujitsu Corporation

Asahi Kasei Chemicals Corporation

Jx Nippon Mining Metals Corporation

Nihon Handa Co., Ltd.

Toshiba Kikai Kabushiki Kaisha

Tohoku Electric Power Company, Inc.

Jx Advanced Metals Corporation

Nitivy Co., Ltd.

Shakou Shoukai Co., Ltd.

Nalot Co.. Ltd.

Mitsuo Yamashita

Akira Miura

Tadao Miura

Kiyoshi Tomimori

Takashi Takaoka

Masahiko Mochizuki

Kazuhiro Obae

Shinji Tada

Masayuki Kakizawa

Kunio Shiokawa

Kenji Yamamoto

Shinji Nakagawa

Tomohisa Yoshimaru

Jiro Egawa

Goro Oda

Tomoaki Goto

Akio Mikogami

Masashi Hasegawa

Hiroshi Oizumi

Keiji Kurosawa

Takeshi Asagi

Hitoshi Suzuki

Kenji Nakamura

Osamu Saito

Kiyoshi Hashimoto

Hideo Kato

Masayoshi Nagashima

Masashi Kamiya

Shinji Matsui

Masaji Ishii

Kaneo Mohri

Hiromi Nakamura

Yukio Miyazaki

Hiroshi Yamane

Hidehiko Fujisaki

Yasuhiro Sato

Yoshihiro Sakai

Takayoshi Hanabusa

Yoshizo Watanabe

Ichiro Nagashima

Hisami Mitsui

Masashi Takada

Akihisa Shirasaka

Takayoshi Imura

Kiyotaka Miyagawa

Ayako Miyabara

Junichi Daigo

Nobuo Kato

Naokatsu Sakuma

Terutsugu Watanabe

Yosizo Komiyama

Osamu Kondo

Shinzi Umemoto

Koji Nakamura

Masami Nakajyoh

Akinori Koda

Katunosin Isogai

Provided is a method for selecting arsenic-containing minerals. A peptide comprising an amino acids sequence according to the following formula:(T,S,N,Q)-(L,I,V,F,A)-(E,D)-(R,K,N,M,D,C,P,Q,S,E,T,G,W,H,Y)-(L,I,V,F,A)-(R,K,N,M,D,C,P,Q,S,E,T,G,W,H,Y)-(L,I,V,F,A)-(L,I,V,F,A)-(L,I,V,F,A)-(R,H,K)-(T,S,N,Q)-(T,S,N,Q)wherein one amino acid is respectively selected from each group defined by paired parentheses.

Peptide and method for using same

A printing sheet is formed of a base material film, a toner fixing layer formed on one principal surface of the base material film, a planarization layer formed on the other principal surface of the base material film, an adhesive layer formed on the surface of the planarization layer, and a peeling film stuck on the surface of the adhesive layer. The base material film has a laminated structure composed of a white foamed PET film layer on the toner fixing layer side and a transparent non-foamed PET film layer on the adhesive layer side, and the strength of the printing sheet is improved by the combined use of the non-foamed PET film. The planarization layer is formed of a colored ink layer, e.g. white ink layer, and increases the bonding area of the adhesive layer with the base material film side, thereby achieving smooth peeling from an adherend.

Printing sheet

This cellulose powder has: an average degree of polymerization of 100 to 350; a weight average particle size of over 30 &#x3bc;m, but less than 250 &#x3bc;m; an apparent specific volume of 2 to less than 15 cm/g; and an organic carbon content from residual impurities, which is defined by the total organic carbon content (%) during 1% NaOH extraction to the total organic carbon content (%) during pure water extraction, of over 0.07 to 0.3%.

Cellulose powder

Providing a method for selecting minerals containing arsenic. A peptide comprising an amino acids sequence according to the following formula: (T, S, N, or Q)-(H, P, or W)-(E, or D)-(H, P, W, R, or K)-(L, I, V, F, or A)-(L, I, V, F, or A)-(L, I, V, F, or A)-(T, S, N, or Q)-(H, P, or W)-(L, I, V, F, or A)-(T, S, N, or Q)-(L, I, V, F, or A) wherein one amino acid is respectively selected from each group defined by paired parentheses.

Peptide binding to arsenic-containing mineral and use thereof

(Technical problems to be solved) Providing a method for selecting an mineral of molybdenum. (Means for solving the problems) A peptide comprising an amino acids sequence according the following formula (1) and/or (2): (1) (ALRKNMD-FCPQSETGWHYIV)-(LIVFA)-(HPWRK)-(TSNQ)-(TSNQ)-(LIVFA)-(TSNQ)-(TSNQ)-(LIVFA)-(FYW)-(LIVFA)-(HPWRK) (2) (LIVFA)-(RHK)-(TSNQ)-(LIVFA)-(LIVFA)-(TSNQ)-(LIVFA)-(LIVFA)-(LIVFA)-(RHK)-(RHK)-(HPW) wherein one amino acid is respectively selected from each group defined by paired parentheses.

Peptide and use thereof

Improved methods and compositions for refining molybdenum mineral are provided, in particular for isolating a substance containing molybdenum which comprises contacting the substance containing molybdenum with a composition comprising a M13 phage. The M13 phage provides selectivity and recovery of the substance containing molybdenum.

Methods and compositions for refining molybdenum mineral

An object of the present invention is to provide a method for efficiently recovering solid selenium or gaseous selenium from wastewater/waste using a microorganism. The present invention provides a method for recovering selenium, comprising reducing a water-soluble selenium compound so as to produce elemental selenium or gaseous selenium by allowing a sample containing a water-soluble selenium compound to come into contact at a temperature which is more than 35&#xb0; C. and is 40&#xb0; C. or less at pH 7.0 to 9.4 with a microorganism capable of producing elemental selenium or gaseous selenium through reduction of a water-soluble selenium compound.

Method for recovering selenium

This cellulose powder has: an average degree of polymerization of 100 to 350; a weight average particle size of over 30 &#x3bc;m, but less than 250 &#x3bc;m; an apparent specific volume of 2 to less than 15 cm/g; and a particle size distribution sharpness of 1.5 to 2.9.

A cream solder obtained by kneading an Sn&#x2014;Ag&#x2014;Cu alloy together with a flux, wherein the Sn&#x2014;Ag&#x2014;Cu alloy includes a mixture of a first powdery alloy and a second powdery alloy, the first powdery alloy is represented by an Sn&#x2014;Ag phase diagram having a solid-liquid coexistence region and has a given silver amount which is larger than that in the eutectic composition (3.5 wt. % silver), and the second powdery alloy has a silver amount which is that in the eutectic composition (3.5 wt. % silver) or which is close to that in the eutectic composition and is smaller than that in the first powdery alloy. This cream solder has excellent strength and thermal stability, and satisfactory bonding properties. It is based on an inexpensive Sn&#x2014;Ag&#x2014;Cu solder alloy. It is suitable for use as a high-temperature-side lead-free solder material conformable to temperature gradation bonding. Also provided is a method of soldering.

Method of soldering electronic part

Provided are corrosive environment monitoring systems and methods whereby corrosive factors are measured in a steam turbine and a corrosive environment is correctly monitored. A corrosive environment monitoring system measures corrosive factors having a part in damaging and deteriorating structural members in a steam turbine and is configured in such a way that steam in the steam turbine is permitted to flow into the corrosive environment monitoring system. Furthermore, in the steam turbine, a condensing mechanism condenses steam that has flowed in and a corrosive factor measuring device is equipped with corrosive factor sensors that measure corrosive factors in condensed water generated by the condensing mechanism.

Corrosive environment monitoring system and corrosive environment monitoring method

Cream solder and method of soldering electronic part

The imaging device displays an image under imaging at present and also past images picked up before it on the display means, thus at the time of continuous imaging, even when the next imaging is started immediately after end of imaging, an image after the framing process is displayed, for example, as an image picked up just prior, so that the imaging condition, for example, whether closing of eyes is caused in the image picked up already can be checked. Therefore, the next imaging can be started without waiting for the time required for the framing process after imaging, so that the imaging can be speeded up.

Imaging device for ID card preparation and associated method

A novel lead-free Sn&mdash;Bi based alloy having an improved wettability in comparison to conventional Sn&mdash;Bi based alloys, a melting point lower than 221&deg; C., the eutectic point of an Sn&mdash;Ag alloy, and proper bonding and heat-resistant properties is provided. This alloy is an Sn&mdash;Bi based alloy containing tin as a major component, and 21 wt.% or less bismuth, 4 wt.% or less silver, 2 wt.% or less copper (inclusive of zero), and 0.2 wt.% or less nickel.

Solder alloy

A solder alloy which is lead free, consists essentially of, in weight %: Sn; 0<Ag&lE;4.0; 0<Cu&lE;2.0; 0<Ni&lE;1.0; and 0<Ge&lE;1.0, wherein addition of Ni and Ge to the solder alloy enhances wettability and tensile strength, and prevents formation of an oxide film. Additionally, a solder alloy which is lead free, consists essentially of, in weight %: Sn; 0<Sb&lE;3.5; 0&lE;Ag &lE;4.0; 0<Ge&lE;1.0; and at least one first additive selected from the group consisting of (a) 0<Ni&lE;1.0 and (b) a combination of 0<Ni&lE;1.0 and 0<Cu&lE;1.0; wherein addition of Ni and Ge to the solder alloy enhances wettability and tensile strength, and prevents formation of an oxide film.

Solder alloys

Growing community of inventors

Tokyo, Japan

Mitsuo Yamashita