Nippon Telegraph and Telephone Corporation

Ntt Electronics Corporation

Japan Aviation Electronics Industry, Limited

Mitsuo Usui

Shingo Uchiyama

Fusao Shimokawa

Etsu Hashimoto

Toshifumi Konishi

Johji Yamaguchi

Tohru Matsuura

Hiroshi Fukuda

Ken Tsuzuki

Takashi Saida

Shin Kamei

Saburo Imamura

Shunichi Soma

Shuichiro Asakawa

Jun Takeda

Yuichi Suzuki

Toshio Watanabe

Shinji Mino

Yasuhiro Ando

Motohaya Ishii

Nobuaki Matsuura

Kiyofumi Kikuchi

Satoru Tomaru

Yuzo Ishii

Shoichi Hayashida

Toshiki Nishizawa

Yuji Mitsuhashi

Michiyuki Amano

Koichi Hadama

Makoto Hikita

Shigeo Nagashima

Mitsuhiro Makihara

Nobuhiro Shimoyama

Shungo Sugawara

Tomomi Sakata

Ryoko Yoshimura

Teruaki Sato

Keiji Murakami

Tomohiro Nakanishi

Satoru Konno

Makoto Yamashita

Kohsuke Katsura

Nobuo Sato

Kosuke Katsura

An optical module that is connectable to an optical fiber array and that can be packaged in a high density. Two package modules are mounted on a board, and optical waveguides in a Si photonic lightwave circuit mounted on the package module are connected to an optical fiber array fixed to an optical fiber block. Moreover, output end surfaces of the optical waveguides in the Si photonic lightwave circuit are perpendicular to a mount surface of the package module. The optical waveguides in the Si photonic lightwave circuit may be tilted at an appropriate angle with respect to a direction perpendicular to a right end surface. Moreover, the optical fiber block fixes optical fibers with the optical fibers tilted with respect to a direction perpendicular to an end surface connected to the Si photonic lightwave circuit.

Optical module

In a conventional soldering method, an FPC-side electrode pad and a package-side electrode pad are closely joined together with a solder layer, and the soldered state after a joining process has not been easily confirmed visually. The present invention provides a solder joint structure including a side face electrode which is formed on each of the side faces of the end parts of an FPC board and a package or PCB board that are to be soldered, extending vertically relative to the faces constituting each of electrode pads on the boards, and which introduces solder. On the side face electrodes of the board end parts, a part of solder that is formed continuously from the solder joint portion is visible and the state of the solder joint between the electrode pads on the two boards can be confirmed. The efficiency of solder joint tests can be improved.

Solder joint structure of flexible printed circuit board

A light-shielding portion () shields the light spot of output light output toward a shunt position &#x3b1; by a projecting portion (). Hence, the output light output toward the shunt position &#x3b1; does not travel to an output port (). This allows to prevent crosstalk.

Optical switch

A movable beam () and a movable beam () each having one end fixed to a frame portion () of a mirror substrate () are provided inside the frame portion (). The movable beam () and the movable beam () each having one end fixed to a corresponding to one of two opposite inner sides of the frame portion () are aligned at a predetermined distance on the same line in the direction in which the two sides face each other. Each of the movable beam () and the movable beam () has the other end displaceable in the normal line direction of the mirror substrate () and therefore has a cantilever structure. A mirror () is arranged between the movable beam () and the movable beam () and connected to them via a pair of connectors ().

Micromirror device and micromirror array

A MEMS device includes a mirror substrate (), an electrode substrate () arranged so as to face the mirror substrate (), a mirror () serving as a movable member rotatably supported in an opening portion of the mirror substrate () via support members, a driving electrode () arranged on an insulating film () on a surface of the electrode substrate () facing the mirror substrate () so as to face the mirror () across a gap and drive the mirror (), and a lower electrode () made of a metal or a semiconductor and formed under the insulating film () exposed to the gap so as to be in contact with the insulating film ().

MEMS device and method of manufacturing the same

In an optical fiber connector ( ), an outer member ( ) holds a portion of an optical fiber (4A) remote from its connecting end which is connectable to a connecting end of a counterpart optical fiber. An aligning member ( ) is held by the outer member so as to be movable along the optical fiber. The aligning member carries out positioning of the connecting end of the optical fiber. The aligning member is urged by a spring ( ) in a direction to project from the outer member. When connecting the optical fiber to the counterpart optical fiber, the aligning member is moved in a direction opposite to the foregoing direction against an urging force applied by the spring so that the connecting end of the optical fiber is projected from the aligning member.

Optical fiber connector in which an optical fiber is protected even when connection is not made

An optical waveguide of an optical deflector comprising a planar optical waveguide or an optical fiber type optical waveguide is cut while perpendicularly pressing a blade having a blade tip with an angle of inclination against the optical waveguide at a desired location thereof to form an oblique end face serviceable as an oblique end face mirror.

Optical deflector, process for producing the same, and blade for use in

A polymeric optical material which is a mixture of a polysiloxane and at least one compound selected from the group consisting of polyisocyanate, silane, alkoxide and chelate, and an optical waveguide fabricated from the polymeric optical material having high thermal stability and low propagation loss over wide range. The polysiloxane may have, for example, a repeating unit of following formula (I): ##STR1## wherein each of R.sub.1 and R.sub.2 is independently an alkyl, deuterated alkyl or halogenated alkyl group, or a phenyl, deuterated phenyl or halogenated phenyl group. The optical waveguide includes a substrate, a clad layer provided on the substrate and a core layer surrounded by the clad layer. The clad layer is composed of a lower clad layer which is overlaid onto the substrate and an upper clad layer which surrounds the core layer.

Polymeric optical mixtures, polymeric optical materials and polymeric

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Kanagawa, Japan

Mitsuo Usui