Hitachi, Ltd.

Hitachi Research Institute

Other

Hitachi Chemical Company, Ltd.

Hitachi Vlsi Engineering Corp.

Hitachi-ge Nuclear Energy, Ltd.

Hiachi, Ltd.

Mitsuo Usami

Kunihiro Tsubosaki

Kazuo Takaragi

Kazutaka Tsuji

Chikashi Okamoto

Chizuko Yasunobu

Kunihiko Nishi

Hiroyuki Yagi

Yasuhiro Tsunemi

Toshio Yamada

Tohru Kobayashi

Masato Hamamoto

Akira Sato

Noboru Shiozawa

Kaoru Koyu

Takashi Tase

Atsushi Shimizu

Tatsuya Kimura

Masaru Ohki

Masaru Miyazaki

Toshio Miyamoto

Asahiko Isobe

Hiromasa Katoh

Kazuyoshi Satoh

Akiko Horiguchi

Hideo Miura

Takeshi Saito

Hiroyuki Ohta

Hiroyuki Itoh

Masatsugu Kametani

Yasuko Fukuzawa

Masayoshi Yagyu

Akira Masaki

Noriaki Okamoto

Kenji Sameshima

Munetoshi Zen

Hideki Tokuyama

Asahiko Sobe

Hideki Kambara

Takeo Yamada

Ken Takei

Takeshi Kato

Ken Takahashi

Masao Kamahori

Kanji Otsuka

Masanori Odaka

Takashi Yoshida

Tetsuo Nakazawa

Yoshiaki Yazawa

Tomoji Oishi

Mitsugu Kusunoki

Hirokazu Inoue

Minoru Yamada

Keiichirou Nakanishi

Masakazu Yamamoto

Takayuki Okinaga

Toshio Suzuki

Shigeo Kuroda

Hiroichi Shinohara

Kazuhisa Miyamoto

Masahide Tokuda

Keijiro Uehara

Yoshikatsu Mikami

Ryosuke Shigemi

Masao Kato

Kunizo Sahara

Yuuji Fujita

Seiji Miyamoto

Takashi Kumagai

Yuuji Shirai

Hiroshi Tachi

Masakatsu Suzuki

Yutaka Miyazaki

Masaki Fukuoka

Kazutoshi Kubo

Masayuki Kawashima

Mararu Osanai

Masaru Osanai

Masaya Miura

An object of the invention is to prevent a human error, greatly reducing man-hours and to securely identify a core. To achieve the object, a request for a serial number is first made via a conductor of a core from a recognition unit that functions as a master to a recognition unit that functions as a slave. Next, the recognition unit as the slave reads a serial number for an IC tag and transmits the serial number via the conductor of the core. The recognition unit as the master receives the serial number transmitted from the recognition unit as the slave and collates the serial number and a serial number stored in an IC tag. It is ascertained by the collation that the conduction of the core is correctly made and it is displayed on a display of the recognition unit as the master and others that no disconnection on the way and no error in selecting an end of wiring are caused.

Core recognition system and core recognition method

Transmission and reception of the identification number to/from an interrogator includes an interrogator that reads a recognition number from a responder by radio. When a clock pulse is modulated on a high-frequency carrier and transmitted to the responder from the antenna of the interrogator, there are a first case when the clock pulse interval is short and a second case when the clock pulse interval is long. By combining the clock pulse of the first case and the clock pulse of the second case so as to control the read of the recognition number from the interrogator, it is possible to realize reduction of the semiconductor chip size of the responder and suppress the cost of the semiconductor chip.

Reading method, responder, and interrogator

An IC tag inlet () is configured by: an upper side antenna () and a lower side antenna () sandwiching a semiconductor chip () that includes an upper electrode () and a lower electrode () from both upper and lower directions; and a support resin () covering the semiconductor chip (). The semiconductor chip () is a micro chip having an outer size of 0.15 mm square or smaller, and a thickness of 10 &#x3bc;m or smaller. In a manufacturing process of the IC tag inlet (), in order to make the handling of the semiconductor chip () easy, prior to a step of sandwiching the semiconductor chip () between the upper side antenna () and the lower side antenna (), the whole surface of the semiconductor chip () is covered by the support resin (), so that an effective volume is made large.

Method for manufacturing IC tag inlet

In order to extend the communication distance of an electronic tag chip, it is required to reduce power consumption of the electronic tag chip. After having formed capacitors and diodes on an SOI (Silicon on Insulator), remove a silicon substrate of the SOI. It becomes possible to reduce the capacitors and diodes of the electronic tag chip in parasitic capacitance relative to the ground, which makes it possible to reduce the power consumption of the electronic tag chip, thereby enabling the electronic tag chip to increase in communication distance thereof.

Electronic tag chip

A wireless IC tag is provided with a memory circuit including a ROM in which an identification number is written, and a pulse width detection circuit having divided resistors and a capacitor for detecting a signal waveform from a reader. In order to prevent the increase in the number of process steps and photomasks, a resistance value of the pulse width detection circuit is adjusted by an electron beam writing method while utilizing a step of writing an identification number unique to the wireless IC tag into the ROM of the memory circuit.

Wireless IC tag and method for manufacturing same

There is a problem related to radio wave interference, e.g. the shade of radio wave of a radio IC tag, when a plurality of radio IC tags are present in a region of electromagnetic wave. When a plurality of antennas each having a large area are present in the vicinity of the radio IC tag, the radio IC tag easily receives the affect of an antenna conductor. In a plurality of radio IC tags present in a radio wave area, width of the antenna conductor of the radio IC tag is set at 1.0 mm or less. Furthermore, in order to realize an antenna conductor having a small width, an IC tag chip of both side electrode structure having electrodes on the front surface and rear surface of a chip is sandwiched between antennas.

Wireless IC tag and process for manufacturing the same

An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.

Electronic device and method of manufacturing the same

An issue of reducing a product manufacture unit cost exists in wireless IC chips which are required to be disposable because the wireless IC chips circulate in a massive scale and require a very high collection cost. It is possible to increase the communication distance of a wireless IC chip with an on-chip antenna simply contrived for reduction of the production unit cost by increasing the size of the antenna mounted on a wireless IC chip or by increasing the output power of a reader as in a conventional way. However, because of the circumstances of the applications used and the read accuracy of the reader, the antenna cannot be mounted on a very small chip in an in-chip antenna form. When an AC magnetic field is applied to an on-chip antenna from outside, eddy current is produced in principle because the semiconductor substrate is conductive. It has been fount that the thickness of the substrate can be used as a design parameter because of the eddy current. Based on this finding, according to the invention, the thickness of the substrate is decreased to reduce or eliminate the energy loss due to the eddy current to utilize the electromagnetic wave energy for the semiconductor circuit operation as originally designed. With the thickness reduction, it is possible to increase the communication distance by preventing ineffective absorption of energy and thereby increasing the current flowing through the on-chip antenna.

Semiconductor device including an on-chip coil antenna formed on a device layer which is formed on an oxide film layer

In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.

Method of mounting electronic circuit chip

A compact wireless IC tag incorporating a pressure sensor in an IC chip. The IC chip of the wireless IC tag has SOI structure comprising a silicon sheet layer, a silicon device layer which is formed on the upper side of the silicon sheet layer, and a thin silicon oxide layer having about 0.01 &#x3bc;m to 5 &#x3bc;m thickness sandwiched between the silicon sheet layer and silicon device layer. In the silicon device layer, a capacitive element of a pressure sensor comprising of a gap, and a first metal wiring and a second metal wiring respectively disposed on the upper and lower sides of the gap, is formed. In the silicon sheet layer on the lower side of the capacitive element, an aperture filled with rubber-like elastic material is formed.

Wireless IC tag and manufacturing method of the same

The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings each of which has a size fit with a semiconductor device, providing a plurality of semiconductor devices on said jig to house the devices into the openings, and fixing on a substrate then cutting the substrate to provide independent electronic devices. When the semiconductor device is in a form of chip, a support member attached to the chip will facilitate the handling of chips.

Method of manufacturing an electronic device

An electronic device includes a semiconductor chip storing an identification number of N-bits and an antenna coupled to the semiconductor chip that sends out the identification number of N-bits. In order to provide a secure and efficient data storage arrangement, the identification number of N-bits is stored in accordance with the presence or absence of through holes that connect wirings to transistors included in the semiconductor chip through an insulating film formed over the transistors.

Semiconductor device having identification number, manufacturing method thereof and electronic device

The technology includes the steps of: associating material-object identification code identifying each individual material object with material-object information representing information about material object identified by identification code and storing identification code and material-object information in material-object information database in each of business categories; sending code and information stored in database in each business category; integrating items of information having same code with each other among codes and items of information received from database in each business category to generate integrated material-object information, associating identification code with integrated material-object information identified by code and storing identification code and integrated material-object information in integrated database; requesting to send integrated material-object information associated with given identification code; reading requested integrated material-object information from integrated database and sending integrated information to requester of integrated material-object information; and receiving and outputting sent integrated material-object information.

Database integration management method and apparatus and processing program, medium therefor

A method of checking a sheet as to forgery thereof, the sheet being provided with an electronic circuit chip from or in which information can be read out or written and having visible information. The method includes a step of encrypting the visible information of the sheet and storing the encrypted visible information in the electronic circuit chip, and a step of determining discriminatively the authenticity of the sheet by comparing the visible information of the sheet with the information stored in the electronic circuit chip.

Method of checking authenticity of sheet with built-in electronic circuit chip

Growing community of inventors

Tachikawa, Japan

Mitsuo Usami