Hitachi, Ltd.

Mitsuo Tanabe

Yoshinori Nakayama

Hidetoshi Satoh

Teruyuki Kagami

Sakae Yaita

Niro Katane

A semiconductor substrate has a plurality of chip portions and chip separating portions for partitioning the plurality of chip portions into each other. The plurality of chip portions and the separating portions are etched on one side of the semiconductor substrate so that each of the plurality of chip portions is provided with stencil patterns. Furthermore, the plurality of chip portions and chip separating portions are etched on the other side of the semiconductor substrate so that the stencil patterns are exposed and the plurality of chip portions are capable of being substantially separated from each other.

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Hitachioota, Japan

Mitsuo Tanabe