Fujitsu Corporation

Mitsuo Takeuchi

Yoshiaki Yanagida

Tohru Harada

Hiroaki Tamura

Toru Okada

Hideyuki Kikuchi

Tomokazu Sugiyama

Michinao Nomura

Koji Sudo

Hirokazu Yamanishi

Toshinori Kasuga

Fumihiko Tokura

Fumihiko Tokukra

Tsutomu Sooda

An apparatus for mounting an electronic component includes a heating head that moves relative to the electronic component placed on a printed board, inclines according to the inclination of the electronic component, comes into contact with the electronic component, and heats a joining material that joins the printed board and the electronic component; a first sensor that measures the position and the inclination of the heating head; a second sensor that measures the position and the inclination of the printed board; and, a control unit that calculates the position and the inclination of the electronic component based on a measurement result of the first sensor in a state where the heating head is in contact with the electronic component, and determines the melted state of the joining material based on the measurement result of the second sensor and the position and the inclination of the electronic component.

Apparatus for mounting electronic component

An electronic component repair method for removing an electronic component soldered on a substrate, the method includes: mounting a heat transfer plate on the electronic component to be removed, the heat transfer plate being formed by bonding a plurality of heat transfer members via a heat insulating member, heating the heat transfer plate mounted on the electronic component by a heating unit, the heating unit heating individually each of the heat transfer members by different heat amount; and removing the electronic component from the substrate after the heating.

Electronic component repair method

A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.

Cleaning apparatus and cleaning method

A polishing apparatus to simultaneously polish both surfaces of a work, and includes a pair of stools rotating in opposite directions, a pair of detecting units to detect rotation rates of the stools, a pressurizing unit to compress the work between the pair of the stools, a slurry supply unit to supply a slurry to the stools, and a control unit to reduce, when determining that a frictional force between the polishing surface and the work exceeds a threshold, at least one of a load applied by the pressurizing unit, the rotation rate of the stools, and a supply amount of the slurry.

Polishing apparatus cofigured to simultaneously polish two surfaces of a work

A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a carrier having a hole configured to house the work, and a fixing member that contacts and fixes the work located in the hole.

Polishing apparatus for polishing a work having two surfaces

A method of manufacturing a molded product includes forming a coat film for covering and concealing particles with the surface of a board while filling the gaps among the particles, and separating the coat film for holding the particles on the reverse side from the board. The coat film and the particles are etched from the reverse side of the separated coat film, the particles are removed from the coat film, and an array of dents carved by the particles is formed on the reverse side of the coat film. A film is formed on the reverse side of the coat film, and a molded product having an array of protrusions on the surface is formed from the film.

Method of manufacturing molded product and method of manufacturing storage medium

A pad of an embedding tool is received on a faceplate. The pad is supported on a support member. When the embedding tool is urged against the surface of the faceplate, the pad is allowed to change the attitude relative to the support member in response to undulation generated on the surface of the faceplate. The movement of the flat surface follows the undulation of the faceplate. When a relative movement is induced between the embedding tool and the surface of the faceplate, the surface of the faceplate thus reliably receives the uniform or constant contact of the flat surface. When grains are supplied between the flat surface of the pad and the surface of the faceplate, the grains are uniformly pushed into the surface of the faceplate. In this manner, the grains are uniformly and constantly embedded into the surface of the faceplate.

Embedding tool designed to embed grains into faceplate for lapping apparatus

The apparatus for lapping a magnetic head slider includes a lapping plate to which a bar of the magnetic head slider makes a contact by a predetermined lapping pressure, a primary oscillating mechanism that makes a primary oscillating of the bar in a radial direction of the lapping plate, and a secondary oscillating mechanism that makes a secondary oscillating of the bar in a direction perpendicular to a direction of the primary oscillating. A coarse lapping of the bar is performed by a combined oscillating of the primary oscillating and the secondary oscillating, and upon completion of the coarse lapping, the apparatus switches to the primary oscillating to finish lapping of the bar.

Method of and apparatus for lapping magnetic head slider

In the substrate processing method in which substrates are immersed in processing baths holding chemicals and pure water for processing, when a substrate carrier is moved from a first processing bath to a second processing bath, the substrate carrier is moved to a second processing bath with a chemical or pure water from the first processing bath held in the substrate carrier. In subjecting substrates to chemical processing and water rinse, the substrates in the substrate carrier are carried to a next processing bath with the chemical or pure water in the first processing bath held in the substrate carrier.

Process for immersing a substrate in a plurality of processing baths

A substrate processing method includes the steps of accommodating a plurality of substrates within a carrier, where the carrier has a bottom that is open and has a function of stopping inclination of the substrates, transporting the substrates and the carrier to a processing chamber by a transport mechanism having a function of supporting weights of the substrates, and carrying out a process on the substrates within the processing chamber.

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Kawasaki, Japan

Mitsuo Takeuchi