Asahi Glass Company, Limited

Mitsuo Takabatake

Jiro Chiba

Kazuo Sunahara

Kazunari Watanabe

Katumasa Nakahara

Keiichi Kawakami

Naosi Irisawa

Shinichi Watanabe

Kenji Oda

Yoshinori Kokubu

Masanobu Ogawa

Michio Ono

Toshihiko Saito

Hijiri Ichihara

A hybrid package comprising a glass ceramic substrate and an aluminum nitride substrate bonded thereto, said glass ceramics substrate has a thermal expansion coefficient substantially the same as that of the aluminum nitride substrate.

Hybrid package, glass ceramic substrate for the hybrid package, and

A hybrid package comprising a glass ceramic substrate and an aluminum nitride substrate bonded thereto, said glass ceramic substrate has a thermal expansion coefficient substantially the same as that of the aluminum nitride substrate.

A glass antenna device for an automobile comprises a glass plate fitted to an opening for a window, an antenna conductor having a power feeding point arranged on the glass plate and a matching circuit electrically connected to the power feeding point.

Glass antenna device for an automobile

A composition for a ceramic substrate comprising from 30 to 70% by weight of glass powder, from 28 to 70% by weight of refractory filler powder and an oxidizing agent, said glass powder consisting essentially of from 38 to 48% by weight of SiO.sub.2, from 1 to 8% by weight of Al.sub.2 O.sub.3, from 0 to 10% by weight of MgO, from 18 to 28% by weight of BaO, from 1 to 8% by weight of CaO, from 0 to 15% by weight of SrO, from 0.5 to 15% by weight of B.sub.2 O.sub.3, from 0 to 20% by weight of PbO, from 10 to 20% by weight of ZnO, from 0 to 7% by weight of TiO.sub.2 plus ZrO.sub.2 and from 0 to 5% by weight of Li.sub.2 O plus Na.sub.2 O plus K.sub.2 O, and said refractory filler powder comprising from 20 to 60% by weight of alumina, from 0 to 40% by weight of zircon, from 0 to 30% by weight of cordierite and from 0 to 30% by weight of forsterite.

Composition for ceramic substrate and substrate

A composition for a multilayer printed wiring board, consisting essentially of from 25 to 65% by weight of glass powder, from 0 to 60% by weight of alumina powder and from 5 to 60% by weight of forsterite powder, said glass powder consisting essentially of from 25 to 70% by weight of SiO.sub.2, from 4 to 15% by weight of Al.sub.2 O.sub.3, from 25 to 45% by weight of B.sub.2 O.sub.3 and from 0.5 to 30% by weight of BaO.

Composition for multilayer printed wiring board

Aluminum titanate composition being stable at high temperature comprises 1.5 to 20 wt. % of Sn component as SnO.sub.2 and/or 0.5 to 10 wt. % of rare earth element component as rare earth oxide.

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Yokohama, Japan

Mitsuo Takabatake