Fujitsu Corporation

Mitsuo Suehiro

Shunichi Kikuchi

Tsuyoshi Yamamoto

Hiroshi Yamada

Yoshinori Mesaki

Kiyokazu Moriizumi

Takahiro Ooi

Kazuhiro Nitta

Michihiro Takamatsu

Naomi Fukunaga

Satoshi Osawa

A photoelectric hybrid board includes: a first board on which a circuit is formed; an optical waveguide layer stacked with the first board; a first optical waveguide section formed in a direction of stacking in the first board and the optical waveguide layer; and a concave part formed, from the optical waveguide layer side, in the optical waveguide layer in an intersection part of the optical waveguide layer and the first optical waveguide section.

Photoelectric hybrid board, information processor, and method for manufacturing photoelectric hybrid board

A semiconductor device includes a semiconductor package, a circuit board, an interconnection electrically connecting the semiconductor package and the circuit board, and a wiring structure. The wiring structure includes a through hole, a contact disposed at the through hole and a lead pattern extending from the contact. The wiring structure is disposed between the semiconductor package and the circuit board. The interconnection passes through the through hole and connects with the contact.

Semiconductor device, semiconductor package and wiring structure

A printed circuit board unit includes an insulated film disposed between a printed circuit board and an electronic component so as to define a through hole. The through hole may be designed to form a constriction in a solder bump. The solder bump is received on an input/output pad located on the printed circuit board. When the electronic component is detached from the printed circuit board, the insulated film is slid along the surface of the printed circuit board while the solder bump is kept at a melting temperature. The sliding movement of the insulated film serves to completely wipe out the melted solder bump from the input/output pad. When the electronic component is thereafter lifted up, the electronic component holding the solder bump can be detached from the printed circuit board. The solder hardly remains on the input/output pad.

Method of detaching electronic component from printed circuit board

A circuit board has a metal pattern that is formed on a surface of the circuit board to be connected with bumps in two-dimensional arrangement for mounting an electronic device that has the bumps. A plurality of the bumps which has even electrical potentials is electrically connected by the metal pattern on the surface of the circuit pattern.

Circuit board, device mounting structure, device mounting method, and electronic apparatus

When an electronic component is mounted on a substrate, the electronic component is first placed on the substrate with a solid support interposed between the electronic component and the substrate. The solid support serves to space a terminal conductor of the electronic component from a corresponding terminal pad on the substrate. A conductive bonding material is then melted on the terminal pad. The melted conductive bonding material gets exposed to the peripheral atmosphere over a larger area. Even if a bubble is generated within the melted conductive bonding material, the bubble is allowed to easily get out of the melted conductive bonding material. Removal of the gas is promoted in the melted conductive bonding material. The solid support is subsequently melted. The electronic component is moved down toward the substrate, thereby contacting the terminal conductor with the melted conductive bonding material on the corresponding terminal pad. Removal of the gas in this manner leads to improvement in the strength of bonding between the substrate and the electronic component.

Method of mounting electronic component on substrate without generation of voids in bonding material

A printed circuit board unit includes an insulated film disposed between a printed circuit board and an electronic component so as to define a through hole for receiving the solder bump. The through hole may be designed to form a constriction in the solder bump. Electric connection can reliably be established between the printed circuit board and the electronic component since the solder bump is allowed to penetrate through the through hole in the insulated film. When the insulated film is brought away from the printed circuit board, the insulated film serves to tear the solder bump in two pieces at the constriction, so that the electronic component can easily be detached from the printed circuit board.

Printed circuit board unit with detachment mechanism for electronic component

There is provided an I/O pin by which an MCM is positively prevented from being damaged by solder flowing from the fore end to the base of the I/O pin when the I/O pin is soldered in the case of mounting the MCM. An I/O pin used for an electrical connection is provided, one end of which is perpendicularly fixed to an MCM and the other end of which is soldered to a predetermined position on the mother board in the case of mounting the MCM on the mother board. In an intermediate portion of the I/O pin, there is formed a solder dam composed of a plated layer of Ni of low solder wettability, a layer of highly heat-resistant resin or a layer of high-temperature solder.

I/O pin having solder dam for connecting substrates

The thin-film multi-layer substrate includes an insulating substrate base plate, and a thin-film structure including a plurality of conducting layers and a plurality of insulating layers formed on the substrate base plate. A via structure is formed in the thin-film structure and connected to one of the conducting layers of the thin-layer structure. Pins are connected to the via structure, such that the bottom of the via structure is directly laminated on the substrate base plate, and the pins are secured onto the via structure.

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Kawasaki, Japan

Mitsuo Suehiro