Toyo Boseki Kabushiki Kaisha

Mitsuo Nishida

Kenji Shiga

Osamu Iritani

Takeshi Yatsuka

Akira Nishimoto

Katsuya Emoto

Masaki Murata

Kazunori Komatsu

An object of the present invention is to provide a modifier which improves moldability in melt molding, particularly, injection molding, extrusion molding, profile molding, direct blow molding, or calendar processing molding using a polyester resin and, furthermore, which can improve mechanical physical property while maintaining transparency, and a polyester molded article using the modifier. The present invention relates to a modifier for a polyester resin, comprising an amorphous polyester resin (I), and a reactive compound (II) containing two or more glycidyl groups and/or isocyanate groups per one molecule and having a weight average molecular weight of not less than 200 and not more than 500 thousands.

Modifier for polyester resin and process for producing molded article with the same

In a saturated polyester resin or a composition with the saturated polyester resin as the main component for molding, the melt viscosity at 200&#xb0; C. is at least 5 dPa&#xb7;s and not more than 1000 dPa&#xb7;s, and the product a&#xd7;b is at least 500 where a (N/cm) is the tensile breaking strength and b (%) is the tensile breaking elongation of a film shape formed product. Preferably, the polyester resin has a glass transition temperature of not more than &#x2212;10&#xb0; C., a melting point of at least 70&#xb0; C. and not more than 200&#xb0; C., and an ester group concentration of at least 1000 equivalents/10g and not more than 8000 equivalents/10g. A material superior in water resistance, electrical insulation, durability, working environment and productivity as a molding material for an electric electronic component having a sophisticated configuration is provided.

Polyester resin and resin composition for molding, and formed product thereof

A polyester resin composition for profile extrusion molding comprising an amorphous polyester, at least one component selected from the group consisting of a crystalline polyester and a nucleating agent, and optionally a reactive compound; a polyester resin composition for profile extrusion molding comprising a polyester resin, and a reactive compound having a weight average molecular weight of 200 to 500,000; and a profile shape comprising a resin having a reduced viscosity ratio of 1.01 to 3.00, a reduced viscosity ratio being a ratio of a reduced viscosity of a resin after molding to that of a resin before molding. They do not suffer from sagging in the molding process, they improve the shape accuracy at corners and edges of profile shapes from a die to a sizing step and also resistance to whitening on bending in transparent products, and can provide profile shapes having good solvent resistance and detergent resistance.

Polyester resin composition for profile extrusion molding and molded article comprising the same

Adhesive for inorganic vapor-deposited film

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Otsu, Japan

Mitsuo Nishida