Shin-etsu Chemical Co., Ltd.

Mitsuo Muto

Michihiro Sugo

Kenichi Fukuda

Mikio Shiono

Shohei Tagami

Takashi Matsuda

A temporary adhesive material for wafer processing temporarily bonds a support to a wafer having a circuit-forming front and back surface for processing, including a composite temporary adhesive material layer having at least a two-layer structure of first and second temporary adhesive layers, the first layer including a thermoplastic resin layer that is releasably adhered to the wafer's front surface; and the second layer including a photo-curing siloxane polymer layer laminated on the first layer. A wafer processing laminate, a temporary adhesive material for wafer processing, and a method for manufacturing a thin wafer using the same, which suppress wafer warpage at the time of heat-bonding, have excellent delaminatability and cleaning removability, allow layer formation with uniform film thickness on a heavily stepped substrate, are highly compatible with steps of forming TSV, etc., have excellent thermal process resistance, and are capable of increasing productivity of thin wafers.

Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer

The present invention provides: a temporary adhesive for wafer processing, said temporary adhesive being used for the purpose of provisionally bonding a wafer to a support, while being composed of a photocurable silicone resin composition that contains a non-functional organopolysiloxane; a wafer processed body; and a method for producing a thin wafer, said method using a temporary adhesive for wafer processing.

Temporary adhesive for wafer processing, wafer laminate and method for producing thin wafer

A photo-curable composition having superior curability at room temperature and storage stability, and also offer a rubber-like cured product thereof having a good profile of properties including heat resistance, low-temperature performance, chemical resistance, solvent resistance and oil resistance. Specifically, A photo-curable composition which includes (A) 100 parts by mass of a linear polyfluoro compound having at least two alkenyl groups in a molecule and a linear perfluoropolyether structure in a backbone of the molecule, (B) a fluorine-containing organohydrogenpolysiloxane having at least two hydrogens bonded to a silicon atom in a molecule, and (C) 0.1 to 500 ppm of a photoactive hydrosililation catalyst relative to the mass of component (A) in terms of metal atom, wherein an amount of component (B) is 0.5 to 3.0 mol of Si&#x2014;H groups in component (B) relative to 1.0 mol of alkenyl groups in component (A).

Method for producing a cured product

A curable perfluoropolyether based gel composition is provided comprising (A) a linear fluorinated polymer containing at least two alkenyl groups, (B) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone, (C) a cyclic organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms and at least one perfluoroalkyl group or perfluoropolyether structure-containing group, and (D) a hydrosilylation reaction catalyst. The composition cures into a gel having improved acid resistance as well as heat resistance, solvent resistance, chemical resistance, weatherability, parting property, and water/oil repellency.

Curable perfluoropolyether based gel composition and gel product using cured composition

A fluoropolyether base rubber composition comprising (a) a linear fluoropolyether compound containing at least two ester groups in a molecule and a divalent perfluoroalkyl ether structure in its backbone, and having a Mn of 3,000-100,000, and (b) a siloxane polymer containing at least three amino groups in a molecule cures at room temperature into a product having heat resistance, low-temperature performance, chemical resistance, solvent resistance and oil resistance.

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Annaka, Japan

Mitsuo Muto