Hitachi, Ltd.

Other

Hitachi Micro Eng. Ltd.

Mitsuo Miyamoto

Shizuo Zushi

Fumiyuki Kobayashi

Kuninori Imai

Takeji Shiokawa

Chikakazu Ninomiya

Mitsuya Mikawa

Michihito Watarai

Yutaka Hayashi

Takahiro Daikoku

Takashi Yamamoto

Toshiyuki Utsuki

Kenta Kumagai

Tamotsu Tsukaguchi

Takashi Ohwada

Sayuri Hashizume

Tetsuo Ogata

Hiroshi Go

Tetsuya Tanaka

Hiroyuki Kojima

Yoshihiro Iwama

Shinji Shibuya

Toshio Hatada

Yoshihiro Takada

Noriyuki Ashiwake

Atsushi Morihara

Takayuki Atarashi

Tsutomu Imai

Shigeyasu Tsubaki

Shigeki Masatsugu

Norio Sengoku

Fumio Kishida

Keizou Kawamura

Toshio Mori

Nobuo Kawasaki

Koushirou Adachi

Akihiro Sakurai

Koushiro Adachi

Katsuhiko Nishiwaki

Koji Nakayama

Kazuhiro Matsuo

Eiji Kadomoto

Hiroshi Gou

Motoake Sakamoto

Yoshiaki Horita

A fastener structure for fastening a first member and a second member using a taper implant having a threaded hole therein. The taper implant has a frusto-conical outer surface, a projecting portion connected to a larger diameter end and a threaded hole passing therethrough. The first member has a wall portion with a tapered hole extending therethrough and a counterbored portion adjacent a larger diameter end to receive the projection portion of the taper implant. The taper implant is inserted into the hole of the first member and held therein by frictional contact. The second member has a wall portion with a hole therethrough. The second member is positioned in contact with the first member and the two members are fastened together by inserting a male screw through the hole of the second member and threading the male screw into engagement with the threaded hole of the taper implant.

Fastening structure using a taper implant

A method of fastening a first member and a second member using a taper implant having a threaded hole therein includes providing a taper implant having a frusto-conical outer surface, a projecting portion connected to a larger diameter end and a threaded hole passing therethrough and providing a first member having a wall portion with a tapered hole extending therethrough and having a counterbored portion adjacent a larger diameter end to receive the projection portion of the taper implant. The taper implant is inserted into the hole of the first member and held therein by frictional contact. A second member is provided having a wall portion with a hole therethrough. The second member is positioned in contact with the first member and the two members are fastened together by inserting a male screw through the hole of the second member and threading the male screw into engagement with the threaded hole of the taper implant.

Taper implant and a screw-fastening structure using a taper implant with female threads

A method of fixing a taper implant to a receiving member includes providing a taper implant having a frusto-conical outer surface, a projecting portion connected to a larger diameter end and a smaller diameter end. A receiving member is provided which has a wall portion with a passing-through hole therein with at least a portion of the passing-through hole being tapered to form a frusto-conical shape whereby the taper portion has a larger diameter end and a smaller diameter end and the passing through hole has a cylindrical counterbored portion adjacent to the larger diameter end in which the projecting portion of the taper implant is received. A taper rate of the taper portion of the passing through hole is the same as a taper rate of the taper portion of the taper implant. The larger diameter end of the taper portion of the passing through hole has a diameter which is smaller than a diameter of the larger end of the taper portion of the taper implant whereby there is a tight-fit allowance when the taper implant is inserted into the passing through hole. The taper implant is fixed in the passing through hole of the receiving member by the outer surface of the taper portion of the taper implant being in contact with a surface of the taper portion of the passing through hole by applying a force to the taper implant whereby a friction force is generated between the taper portion of the taper implant and the wall portion.

Method for fixing a taper implant to a receiving member

A taper implant includes a taper portion having an outer surface frust-conical in shape. A flange portion is formed at an outermost end of the taper portion on the larger-diameter side to project outwardly with respect to the taper portion and having a flat surface situated perpendicularly to the axial direction of the taper portion, and female threads serving as a fit portion extending in the axial direction of the taper portion. A hole taper portion and a hole step portion are drilled at the same time to bore a hole in one of the members to be fastened, and the taper implant is driven into the hole, thereby providing a screw fastening structure for the fastened members.

An electronic device has a frame and a back board having plural logical units and power supply units mounted thereon. The logical units and the power supply units are alternately located on both sides of the back board in the center of the frame so that the power supply units mounted on one side of the back board may feed a power to the closest logical units mounted on the other side. Further, the air flow paths to be circulated through the logical units and the power supply units are formed so that each unit may be efficiently cooled by the air fed by an air fan unit. As a result, the feeding voltage becomes uniform and the cooling efficiency is improved.

Mounting structure for electronic device

Computer housing

A forced air cooling apparatus having a blower for blowing air taken in from an intake surface or inlet of the blower to be blown against an electronic device in an installation wherein the blower is mounted for operation on a casing or a rack, and in which the apparatus has a flow regulating plate vertically intersecting the intake surface that is installed immediately before the intake surface. With this construction, eddy air current flow in the vicinity of the intake surface is prevented and the cooling ability obtained from the blower is optimized to thereby attain the effect that the electronic devices can be efficiently cooled without requiring the same separation distance between an intake surface of the blower and a wall surface of the frame or casing in which the blower is installed, as compared with a conventional installation of the same equipment in the same casing without the flow regulating plate.

Forced air cooling apparatus having blower and air current regulating

The present invention relates to a cooling apparatus for an electronic device, in which a cooling solid body in close contact through thermal conductive fluid with a heat transfer portion of the electronic device is provided, on its one surface in contact with the electronic device, with a number of grooves communicating with the outside of the heat transfer portion, and a spring member for elastically pressing this cooling solid body on the electronic device is provided for forcing the cooling solid body into close contact with the electronic device by means of the thermal conductive fluid in a third layer.

Cooling apparatus for electronic device

In a liquid cooling system comprising cold plates attached to their respective circuit modules, quick couplers are provided for connecting flexible hoses to these cold plates, a supply duct and a return duct to form strings of cold plates connected between the supply duct and the return duct. Valved quick couplers are used for the connection to the supply duct and the return duct, and valveless quick couplers are used for the connection to the cold plates. When a circuit module is to be serviced, a desired string of cold plates is disconnected from the supply duct and the return duct by disjoining the valved quick couplers for the connection thereto. The disconnected string of cold plates is drained of the coolant, and then the cold plate attached to the desired circuit module is disconnected from the hoses. Subsequently the desired circuit module and the cold plate attached thereto can be detached as one body from an associated connector.

Electronic apparatus cooling system

A cooling structure for cooling a multi-chip module by a heat sink is disclosed in which the heat sink is disposed above the multi-chip module in a state that heat-conductive grease is sandwiched between the heat sink and the module cap of the multi-chip module, and the heat sink, the module cap and the wiring board of the multi-chip module are clamped as one body by clamp member, and in which a heat-sink pushing member for pressing the heat sink against the module cap by a constant force is attached to the clamp members.

Mounting mechanism for mounting heat sink on multi-chip module

A first mother board among a plurality of mother boards is mounted adjacent to a reference mother board and a second mother board among said plurality of mother boards is mounted in a position rotated 180.degree. about the horizontal centerline of the second mother board and mounted back to back to the first mother board, whereby the reference mother board and the first and second mother boards can be interconnected at a minimal distance.

Central processor unit

A cooling system for an electronic apparatus comprises a plurality of mother boards each having a circuit board to be cooled, a blower for causing an air flow from one of the mother boards to the other, and a draft duct for directing the air flow between the mother boards. The draft duct includes an inlet for dividing the air flow into a plurality of partial flows, a partition for changing an air flow direction of the partial flows into some other directions, and an outlet for intermixing the partial flows.

In a cooling structure for electronic apparatus in which cards consisting of electronic components mounted on circuit boards are arranged in parallel on a motherboard. A pressure adjustment device with holes is arranged in a cooling air flow passage of each card. The area of the holes is selected in relation to the pressure loss characteristics of the related card based upon average air-flow sectional area.

Device for adjusting pressure loss of cooling air for an assembly of

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Hadano, Japan

Mitsuo Miyamoto