Sekisui Chemical Co., Ltd.

Mitsuo Matsumoto

Yasunari Kusaka

Nami Nakajima

Ryota Yamasugi

Yoshito Arai

Tomohiro Horinouchi

The present invention aims to provide a resin composition for molding that makes it possible to achieve excellent continuous productivity and to produce a molded article having high surface smoothness, capable of reducing defective molding, less likely to crack during use, and also having excellent shock resistance. The present invention also aims to provide a molded article including the resin composition for molding. Provided is a resin composition for molding, containing: a chlorinated polyvinyl chloride resin; and a melt additive, the resin composition containing three components including a Acomponent, a Bcomponent, and a Ccomponent, and having a percentage of the Ccomponent [Ccomponent/(Acomponent+Bcomponent+Ccomponent)] of 30% or less, the three components being identified by measuring the resin composition by a solid echo method using pulse NMR at 100° C. to give a free induction decay curve ofH spin-spin relaxation, and subjecting the free induction decay curve to waveform separation into three curves derived from the Acomponent, the Bcomponent, and the Ccomponent in order of shorter relaxation time using the least square method.

Molding resin composition and molded article

The present invention provides a resin composition for molding having excellent thermal meltability and capable of providing a molded article that is less likely to crack from a resin weld during use and has excellent surface gloss, and a molded article including the resin composition for molding. Provided is a resin composition for molding, containing: a chlorinated polyvinyl chloride resin; a polyvinyl chloride resin; and a melt additive, the resin composition having an area ratio of a peak B observed in a range of 0.6 to 1.0 ppm to a peak A observed in a range of 9.5 to 10 ppm (Area of peak B/Area of peak A) of 1 to 1,000 when aH NMR spectrum is measured by solution NMR.

Resin composition for molding and molded article

The present invention provides a chlorinated polyvinyl chloride resin that provides a molded article having excellent heat cycle characteristics and excellent weather resistance, as well as a resin composition for molding and a molded article each including the chlorinated polyvinyl chloride resin. Provided is a chlorinated polyvinyl chloride resin, containing two components including a Acomponent and a Bcomponent, the Acomponent and the Bcomponent being determined by measuring the resin by a solid echo method using pulse NMR at 30° C. to give a free induction decay curve ofH spin-spin relaxation, and subjecting the free induction decay curve to waveform separation into two curves derived from the Acomponent and the Bcomponent in order of shorter relaxation time using the least square method, and having a ratio of T5to T[T5/T] of 96% or more and 120% or less, where Tis a relaxation time of the Bcomponent and T5is a relaxation time of the Bcomponent after heating at 200° C. for five minutes.

Chlorinated vinyl chloride-based resin

The present invention provides a chlorinated polyvinyl chloride resin that enables the production of a molded article that maintains high adhesion strength even when used in a form subjected to high pressure and is less susceptible to defects such as cracks due to insufficient strength, as well as a resin composition for molding and a molded article each including the chlorinated polyvinyl chloride resin. Provided is a chlorinated polyvinyl chloride resin, containing two components including a Acomponent and a Bcomponent, the Acomponent and the Bcomponent being determined by measuring the resin by a solid echo method using pulse NMR at 30° C. to give a free induction decay curve ofH spin-spin relaxation, and subjecting the free induction decay curve to waveform separation into two curves derived from the Acomponent and the Bcomponent in order of shorter relaxation time using the least square method, and having a ratio of T5to T[T5/T] of 76% or more and less than 96%, where Tis a relaxation time of the Bcomponent and T5is a relaxation time of the Bcomponent after heating at 200° C. for five minutes.

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Yamaguchi, Japan

Mitsuo Matsumoto