Nec Corporation

Japan Aviation Electronics Industry, Limited

Mitsuo Komoto

Shoji Umesato

Yoshiaki Ichimura

Atsuhito Noda

Takao Suzuki

Osamu Hashiguchi

Hiroshi Endo

Yoshinori Mizusawa

Kouzou Uekido

Tetsuro Tokaichi

Toshifumi Sano

Hiroshi Endoh

Youichi Matsuo

Shinichi Ishizuka

Katumi Takegawa

An LSI package structure with high efficiency of the power supply and fast transmission of the signal is provided in which: adjacent to a pin 8 side surface of an LSI package 1, a power supply member 2 having an electrically conductive portions 6 and 7 for power supply bus and ground bus respectively, and a flexible interconnection board 3 having a power supply pattern layer 3b and a ground pattern layer 3a connected to the portions 6 and 7 respectively via a pin 9, are disposed; the pins 8 and 9 each extend through a through hole 3c formed on the interconnection board 3, the power supply pattern layer 3b and the pins 8 and 9 for power supply being interconnected within the through hole, the ground pattern layer 3a and the pins 8 and 9 for grounding being interconnected within the through hole; and the signal input/output pin 8 and a connector 5 of a signal input/output coaxial cable 5a are interconnected at the side of the interconnection board 3 oppsite the LSI package 1.

Large scale integrated package structure

In an electronic circuit module, an array of male connectors (41, 46) are arranged on a ceramic substrate (40) to establish contact with external female connectors (20) and an array of LSI packages (5) is provided. Conductive layers (43) of power distribution pattern are embedded in the substrate and are coupled to the male connectors (41). Each LSI package includes a conductive housing (52), an LSI chip (50) secured thereto in a thermally conductive relationship and a base plate (51) which establishes source/ground current conduction paths between the chip and the housing and drain/source current conduction paths between the chip and appropriate layers of the ceramic substrate. An array of conductive springs (68) are supported by a lattice structure (60, 64) to establish a pressure contact with the housing of successive LSI packages to allow power currents to be supplied from an external source voltage terminal to all LSI packages. An array of cooling surfaces (73) are in thermal contact with the respective package housings through the apertures (62) of the lattice structure.

Electronic circuit module with power feed spring assembly

An apparatus for carrying out connection and disconnection of circuit member to an electrical connector has an inner frame for regulating a space for a circuit to be mounted, an outer frame, disposed outside the inner frame, for supporting the inner frame in such a manner as to move the inner frame in a predetermined direction only, a wedge member which is disposed between the outer frame and the inner frame in such a fashion as to be movable in a direction normal to the predetermined direction, and which moves the inner frame in the predetermined direction when the wedge member is moved, and a drive apparatus for externally driving the wedge member.

Apparatus for carrying out connection and disconnection of a circuit

For facilitating an electrical connection of a conductive connection pin (7) to a conductive contact (11) held to a base insulator (13), an electrical connector includes a preload pin (23) which is for carrying out beforehand displacement of a contact portion (21) of the conductive contact at a first position. The preload pin is held to a slider (19) which is placed between the base insulator and a cover insulator (17) and which is movable in a predetermined direction. The cover insulator and the slider have guide and elongated holes (15, 25), respectively, for passing the connection pin therethrough. The elongated hole is greater than the connection pin in a size of the predetermined direction. Therefore, it is possible without movement of the connection pin to move the preload pin in the predetermined direction to a second position at which the preload pin does not carry out the displacement of the contact portion.

Electrical connector

A thin-type coaxial connector and a coaxial multicore receptacle used together with the thin-type coaxial connectors are disclosed herein. The thin-type coaxial connector comprises a female central contact mechanically and electrically connected to a central conductor of coaxial cable by press-deforming, an insulator holder of a discrete sleeve fitted onto the central contact and an insulator sheath layer of the coaxial cable, a ferrule fitted onto an outer surface of the coaxial cable and covered with an outer conductor of the coaxial cable folded thereon, and an outer conductor sleeve closely fitted onto the insulator body and said folded outer conductor to clamp the outer conductor by the outer conductor sleeve and the ferrule. The receptacle comprises a substrate having a plurality of ground pins and power source pins set at cross points of a matrix pattern thereon and a plurality of signal pins, a guide plates overlaid on the substrate having guide holes for the ground pins, the power source pins, and the signal pins. The guide plate further comprises insulator caps covering the power source pins. A plurality of pairs of ground contacts are disposed over the guide plate for making contacts with the ground pins and outer conductor sleeves of coaxial connectors mating with the signal pins, and for clamping insulator caps, respectively.

Thin-type coaxial connector and receptacle for mating with the coaxial

A top housing, which has formed therein arrays of first housing chambers and first pin insertion holes respectively communicating therewith, and a bottom housing, which has formed therein arrays of second housing chambers and second pin insertion holes respectively communicating therewith, are assembled together so that the corresponding first and second housing chambers intercommunicate. A socket contactor is housed across the corresponding first and second housing chambers. The top and bottom housings are held together by a frame so that they are slidable relative to each other. Terminal pins of an IC are inserted into the first housing chambers through the first pin insertion holes and pin conductors of a printed board are inserted into the second housing chambers through the second pin insertion holes. By sliding the top and bottom housings relative to each other, each socket contactor is bent, and by its spring force, the socket contactor is urged against the terminal pin and the pin conductor.

Connector

A socket for an IC, which is made up of a cover having an insulating protrusion and an insulating housing having a recess for receiving the protrusion. The cover includes a flat member which has made therethrough a plurality of arrays of pin insertion holes for insertion of pins of the IC or the like, and the insulating protrusion provided on the underside of the cover and extending along the arrays of pin insertion holes, guide grooves communicating with the pin insertion holes, respectively, being formed in side wall surfaces of the insulating protrusion. Contact pieces are held on side walls of the insulating housing.

Socket

A cooling system for integrated circuit chips comprises a substrate, a plurality of integrated circuit chips mounted on a first surface of the substrate and a second surface opposite to the first surface thereof, a heat conductive means having a first surface and a second, flat surface opposite to the first surface, a layer of thermally conductive bonding material between the second surface of the substrate and the first surface of the heat conductive means, and a heat exchanger having a flat surface and provided with inlet and outlet means to permit liquid coolant to flow through the heat exchanger in contact with the flat surface. The heat exchanger is removably mounted to the heat conductive means with the flat surface thereof being in close proximity to the second surface of the heat conductive means. The thermally conductive bonding material allows a low thermal resistance contact to be made between the substrate and the heat conductive means and allows the latter to present a flat plane to the heat exchanger so that a low thermal resistance contact can also be established therebetween.

Liquid cooling system for integrated circuit chips

For electrically connecting a conductive terminal member (13) to an electric circuit board (12), an electrical connector includes a contact member (30) which comprises a terminal pin element (31) and a mating contact element (32) as individual parts. The terminal pin element is inserted into a through hole (14) and secured to the electric circuit board by soldering. The mating contact element is mated with the terminal pin element within an insulator housing (16) so that it is possible to correct position error of a contact portion (42) of the mating contact element. The conductive terminal member is inserted into the insulator housing and is then moved by a driving member (17) which is slidable along the insulator housing. Therefore, the conductive terminal member is brought into contact with a contract portion of the mating contact element. As a result, electrical connection is reliably made between the terminal member and an electrical circuit on the electric circuit board.

Growing community of inventors

Tokyo, Japan

Mitsuo Komoto