Hitachi, Ltd.

Mitsuo Katoo

Kazuya Takahashi

Ryoichi Kajiwara

Takao Funamoto

Tomohiko Shida

Hiroshi Wachi

Takeshi Matsuzaka

A semiconductor module cooling structure comprises a housing having a passage through which a cooling fluid flows; a cooling block to which the cooling fluid is supplied from the housing and which has an electrical insulating layer at the bottom portion and is combined with a semiconductor chip through the electrical insulating layer; and a bellows which is connected between the housing and the cooling block. The cooling fluid is supplied to the cooling block through the bellows. The bellows is formed in a manner such that a plurality of substantially plane ring-like metal plates are laminated, pressed, diffused, joined, and thereafter stretched and molded.

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Hitachi, Japan

Mitsuo Katoo