Mitsubishi Jukogyo Kabushiki Kaisha

Nisshin Steel Co., Ltd.

Mitsubishi Heavy Industries Limited

Sumitomo Metal Industries, Inc.

Mitsuo Kato

Kenichi Yanagi

Toshiharu Kittaka

Yoshio Shimozato

Norio Tsukiji

Kanji Wake

Tetsuyoshi Wada

Takuya Aiko

Kazuya Tsurusaki

Heizaburo Furukawa

Yasuji Nakanishi

Arihiko Morita

Toshio Taguchi

Ichiro Yamashita

Keiichi Katayama

Tadashi Rokkaku

Kenji Atarashiya

Mikio Hanamoto

Masaki Kawano

Tatsufumi Aoi

Kazumasa Mihara

Minoru Nishihara

Tetsuaki Tsuda

Toshiro Kobayashi

Shigenari Horie

Atsuyoshi Shibuya

Katsuhiko Yamada

Heisaburo Furukawa

Hiroaki Ogasawara

Kiyoshi Izumi

Kazuo Asano

Teijiro Fujisaka

Shozo Umeda

Takatoshi Eguchi

Mamoru Hiyama

Yoshitaka Tsumoto

An object is providing an electrostatic attraction apparatus and an attracting/releasing method capable of reliably attracting and quickly releasing a glass substrate. An attraction force for attracting a glass substrate is obtained according to the physical properties of the glass substrate. In addition to obtaining an attraction voltage (V(t)) required for obtaining the attraction force, a holding voltage (V(t)) for holding an attraction state and a release voltage (V(t)) for releasing the glass substrate are also obtained (Sto S). Attraction time period (t) is actually measured and if this measured time is different from a preset attraction time (t), the holding voltage (V(t)) and the release voltage (V(t)) are recalculated according to the actually measured attraction time period (t) (Sto S).

Electrostatic attraction apparatus for glass substrate and method of attracting and releasing the same

A DC or high frequency ion source comprising a hollow cathode and a substantially hollow anode for applying a DC or alternating voltage; a gas inlet disposed at a first side of the cathode for supplying a discharge gas into the cathode; a cathode heater disposed between the anode and the cathode; a magnet disposed adjacent the anode to thereby improve the uniformity of a plasma; an ion extraction outlet disposed at a second side of the cathode opposite to the gas inlet and having an elongated rectangular shape; and an ion extraction electrode and an acceleration electrode for controlling the energy of extracted ions. Both the anode and cathode comprise substantially hollow boxes. The cathode includes an elongated rectangular cross section and is disposed inside the substantially hollow anode. The ion extraction electrode and the acceleration electrode have an elongated rectangular shape and an opening coextensive with the ion extraction outlet. The ion extraction electrode and the acceleration electrode are disposed adjacent, and aligned with, the ion extraction outlet. The ion source can be formed with an arcuate shape to accommodate round objects. The ion source can also be formed integrally with a sputtering device.

DC or HF ion source

An induction heating apparatus has a coil or coils which can be opened without using electrical contacts. One continuous electric current passageway is formed by a first coil section, a second coil section, a first connecting conductor and a second connecting conductor. By feeding electric power to this electric current passageway and passing an object through a space at the central portion of the coil sections, the object is induction heated. A gap is provided between the first connecting conductor and the second connecting conductor, or the respective connecting conductors can be opened and closed relative to one another to vary the size of the space therebetween. The object to be heated is carried into the space at the central portion of the coil and is carried out therefrom through the gap or the space between the conductors.

Induction heating apparatus having openable and closable coil

A sputtering apparatus including two electrodes, a sputtering target disposed on one of the electrodes, and a gas supply for supplying a discharge gas in a vacuum to produce an electric discharge between the two electrodes and whereby particles sputtered from the target due to impact thereon of ions produced by the discharge, are deposited on a substrate. The target disposed on one electrode is formed into an elongated band and the other electrode is disposed so as to enclose the target. The other electrode is also provided with a magnet for producing a magnetic field thereon, and further includes a narrow elongated slot which defines a narrow sputter particle outlet. The narrow sputter particle outlet permits a pressure to exist near the electrical discharge which is higher than the pressure near the substrate. According to a preferred embodiment, the sputtering apparatus has an ion source combined integrally therewith.

Sputtering apparatus and an ion source

An induction heating apparatus is disclosed which includes a high frequency power source having a leading phase angle setting circuit, which is supplied with a detection voltage signal from an output side of a high frequency inverter connected to a load circuit, to supply a leading phase angle signal to gates of thyristors of the inverter. The high frequency power source further includes a phase control circuit, provided after the voltage detection circuit, which is supplied with the detection voltage signal from the output side of the inverter to periodically control a phase of the detection voltage signal. The induction heating apparatus further includes a series inductor provided in between the power supply bus line connected to an induction heating coil wherein a magnetic member is provided to be inserted into and taken out of the inductor. A drive device is included for driving the magnetic member. The induction heating apparatus includes a solenoid coil serving as an induction heating coil to which a high frequency current is supplied and into which a steel plate passes to be heated by Joule heat produced by an eddy current generated in the steel plate. Furthermore, magnetic flux density alleviating apparatus is provided in the solenoid coil for alleviating magnetic flux concentrated in an edge portion of the steel plate.

Induction heating apparatus for preventing the formation of stripes on

A continuous vacuum deposition apparatus for coating a metal strip in which a control means for changing the width of the metal vapor channel so that strips of various widths can be deposition-coated with transversally uniform thickness distribution is disclosed.

Continuous vacuum deposition apparatus with control panels for

A vacuum evaporation equipment for continuous vacuum evaporation of a metal onto a band or strip of product including at least one vacuum sealing station, provision of ducts that are disposed surrounding the band product and extending from the point of vapor deposition where the band product is subjected to a vacuum evaporation process an a chamber held at a reduced pressure or vacuum state to the extent that substantially no reevaporation of once deposited metal is effectively prevented from occurring. The ducts are adapted to be heated to a temperature substantially higher than the temperature of the steel band product. In addition, there is provided at least one vacuum sealing station with rolls rotatably mounted in the interior of a casing and a complementary sealing bar mounted in a complementary engagement relationship with the rolls having a close gap therebetween. A side panel is mounted self-adjustably in sliding motion in the longitudinal direction along the axes of the rolls on the opposite ends thereof, and heaters are provided to heat the rolls, sealing bar and side panel, respectively.

Vacuum evaporation coating equipment

Disclosed is a combined continuous plating apparatus for hot-dip plating and vacuum deposition plating characterized in that the outlet of the gas reduction annealing furnace of a conventional continuous hot-dip plating apparatus and the inlet of the seal roll chamber of a known continuous vacuum deposition plating apparatus are connected through a pressurized chamber in order to prevent invasion of hydrogen-containing reduction gas into the vacuum deposition chamber, whereby is prevented the possibility of the hydrogen-containing gas causing an explosion should air leak into the vacuum deposition chamber.

Combined continuous plating apparatus for hot-dip plating and vacuum

In a continuous vacuum deposition plating of a metal strip, thinner coating at the edges can be prevented by maintaining the pressure of the deposition chamber in which an evaporation chamber is housed at a properly higher level than the pressure of the evaporation chamber.

Method of controlling deposition amount distribution in a vacuum

A method and apparatus of continuous electroplating of a strip with an alloy by passing the strip through a plating bath of the immersion type in both down-pass and up-pass with an anode being positioned in each pass so as to face at least one side of the strip are disclosed. Said anode is an insoluble anode which is spaced from the strip by a distance of about 10-50 mm, and the plating solution is blown into the gap between said anode and said strip countercurrently with respect to the movement of said strip.

Method and apparatus for continuous electroplating of alloys

In the continuous vapor deposition coating of a metal strip, the coating amount can be rapidly changed by keeping the vapor flow at acoustic velocity and changing the cross-sectional area of the vapor path.

Method of rapidly changing deposition amount in a continuous vacuum

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Hiroshima, Japan

Mitsuo Kato