Fujitsu Corporation

The Furukawa Electric Co., Ltd.

Mitsuo Inagaki

Yutaka Higashiguchi

Toshiaki Amano

Yasuhiro Teshima

Makoto Totani

Yoshikazu Kamei

Hajime Mochizuki

Toshio Kumai

Ryoichi Ochiai

Hiroshi Iimura

Noriyuki Kohma

Takeyasu Maeda

Yasushi Kobayashi

Kenichi Fuse

Yasuhiro Ichihara

Hirokazu Shiroishi

Mamoru Niishiro

Shuzo Igarashi

Hidehiro Mishiro

Hideaki Tamura

Fumio Mitamura

Hirotaka Kashiwabara

Yukio Sekiya

Kouroh Mekata

Hidenori Tanizawa

Kohichi Kamei

Seishi Chiba

A wiring board to be provided between a packaged electronic component having an integrated circuit and a mother board on which the packaged electronic component should be mounted, includes a base made of an insulating material, a first circuit pattern which is provided on a first surface of the base and has terminals connectable to terminals of the packaged electronic component for external connections, and a second circuit pattern which is provided on a second surface of the base opposite to the first surface thereof and has terminals connectable to terminals provided on the mother board.

Wiring board and semiconductor device

A semiconductor device includes a wiring board, an electronic component supported by the wiring board, a heat conduction layer provided in the wiring board so as to be in contact with the electronic component, and terminals provided on the wiring board and thermally connected to the heat conduction layer through thermal vias provided in the wiring board. Heat generated by the electronic component conducts to the terminals through the heat conduction layer and then conducts to a circuit board on which the semiconductor device is placed.

Semiconductor device having terminals for heat radiation

A wiring substrate has a semiconductor device mounted thereonto, the semiconductor device having ball-shaped externally connecting parts. The wiring substrate includes through holes at positions corresponding to the ball-shaped externally connecting parts and electric conductors provided inside and around the through holes. Land portions of the electric conductors, at which the electric conductors are engaged with the externally connecting parts, includes sectional tapering portions, respectively. Further, the through holes have sectional tapering portions at edge portions in proximity to the land portions, respectively. The ball-shaped externally connecting parts of the semiconductor device are engaged with the land portions provided around the through holes of the wiring substrate and having the sectional tapering portions, respectively.

Wiring substrate and semiconductor device

A semiconductor device includes a package having opposing surfaces, a first terminal for an outer connection supported by said package and electronic components supported by said package, and the opposing surfaces of the package having slits so that a shape of the package can be changed in a mounted state. Therefore, stress applied to soldered junctions of the first and second terminals is decreased.

Semiconductor device and semiconductor device mounting board

An antenna module capable of finely adjusting the resonant frequency and having an antenna element exclusively used for radio transmission and reception to provide a broad frequency band characteristic. This antenna module is composed of a dielectric substrate molded in a predetermined shape, a grounding conductor in the form of sheet provided on one surface of the dielectric substrate, and antenna element conductor in the form of sheet provided on the opposite surface to the above one surface and having end portion being almost V-shaped end folded, and an adjusting member inserted into the almost V-shaped folded end portion.

Antenna module for a portable radio equipment with a grounding conductor

An antenna module suitable for a reduction in size and weight of equipment and improved in manufacturability. The antenna module includes a ground element formed from a planar conductor, an antenna element formed from a planar conductor and arranged in parallel to the ground element, and a loop element formed from a tubular conductor and arranged between the ground element and the antenna element in predetermined positional relationship with both elements so as to be connected with the antenna element. The loop element has a first hollow portion passing therethrough in a given direction. The antenna module further includes an element support formed from an insulator and arranged so as to fill a space between the ground element and the antenna element and substantially fully cover an outer surface of the loop element. The element support is formed with a second hollow portion passing therethrough in the same direction as that of the first hollow portion of the loop element.

Antenna module for incorporation in wireless terminal equipment such as

A manufacturing method for plural antenna modules which is suitable for mass production. Each antenna module includes a ground element, an antenna element, a loop element, and an element support. The manufacturing method for the antenna modules includes a first step of setting in a mold a first conductive base material including a plurality of the ground elements integrally connected together, a second conductive base material including a plurality of the antenna elements integrally connected together, and a third conductive base material including a plurality of the loop elements integrally connected together; a second step of filling a cavity defined in the mold with a curing fluid and then curing the curing fluid to thereby form an element support base material including a plurality of the element supports integrally connected together; and a third step of cutting the element support base material together with the first, second and third conductive base materials to thereby obtain a plurality of the antenna modules.

Manufacturing method for antenna module

A circuit unit is used in an electronic instrument having a key-pad arrangement, such as a portable telephone, and comprises a printed circuit board, a flexible switch circuit sheet attached to the printed circuit board and having a plurality of switch pads arranged thereon, and at least one circuit pattern formed in the flexible switch circuit sheet so as to construct a switch circuit together with the switch pads. The circuit pattern includes a plurality of line sections extended between the switch pads, and a plurality of terminals provided along a peripheral edge of the flexible switch circuit sheet for establishing an electrical connection between the printed circuit board and the flexible switch circuit sheet.

Circuit unit for electronic instrument having key-pad arrangement

A ground conducting layer and an antenna element conducting layer are set at a predetermined position in a cavity of a molding die, and molten resin is injected into the cavity, thereby molding a resin-formed member in which said ground conducting layer and said antenna element conducting layer are integrated. As a result of this, there can provided an antenna module comprising a resin member formed by molding to be a predetermined shape, a sheet-like ground conducting layer adhered to one surface of the resin member, a sheet-like antenna element conducting layer adhered to another surface opposing to the one surface of said resin member, and a feeder for feeding electricity to the antenna element conducting layer.

P-type antenna module and method for manufacturing the same

Growing community of inventors

Kawasaki, Japan

Mitsuo Inagaki