Nec Corporation

Nec Tokin Corporation

Nec Tokin Toyama, Ltd.

Mitsunori Sano

Takashi Kono

Kazunori Watanabe

Makoto Tsutsui

Isao Tochihara

Osamu Yamashita

Hideaki Sato

Masako Inagawa

Tomoyuki Takahashi

Makoto Nakano

Kazuhiro Mine

Kazuto Yoshida

Takashige Suzuki

In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.

Method of making chip type solid electrolytic capacitor having a small size and a simple structure

Chip type solid electrolytic capacitor having a small size and a simple structure

In a solid electrolytic capacitor, an anode terminal (in FIG.) has a T-shaped section in which two plate pieces intersect at right angles. One of the two plate pieces is exposed to the mounting surface of the solid electrolytic capacitor, while the other is perpendicularly erected to an anode lead (). The two plate pieces are made of a series of continuous members.

Solid electrolytic capacitor

A chip type capacitor which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability, and a method for preparing the chip type capacitor and an anode terminal. The chip type capacitor has a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body. An anode terminal is electrically connected to the portion of the anode lead wire extending from the anode body. This extending portion of the anode lead wire has about% or more of its periphery, in the direction substantially perpendicular to the extending direction of the anode lead wire, covered with solidified matter resulting from solidification of a melt, thereby bonding the anode terminal and the anode lead wire to each other.

Chip type capacitor, method for preparing the same and anode terminal used for preparing the same

An anode lead extending from a capacitor body of a capacitor element is mounted on a connecting portion of an anode terminal and the anode lead and the connecting portion are welded together by laser light B. The welding operation is performed by laser light B in a state where the anode lead is urged to the connecting portion in a region between said anode lead and said connecting portion. Alternatively, the welding operation is performed by laser light B in a state where a reflection plate having a slot and functioning to reflect reflected laser light is arranged in a region between the connecting portion and the capacitor body while the anode lead is received in said slot.

Method for fabricating chip type solid electrolytic capacitor and apparatus for performing the same method

A chip capacitor has capacitor component having anode lead and sintered body of a metal having a valve action in which anode lead is embedded so as to project from embedding surface resin-based insulating film layer containing a white pigment and disposed on the embedding surface of capacitor component water-repellent layer disposed on resin-based insulating film layer anode terminal having a portion bent into joint tongue with anode lead being placed on joint tongue joint tongue and anode lead being welded to each other into anode terminal and antireflection member extending from a proximal end of joint tongue of anode terminal toward sintered body . When joint tongue and anode lead are welded to each other by a laser beam, antireflection member prevents the laser beam from being reflected from the welded region.

Chip capacitor and method of manufacturing same

The present invention provides a chip capacitor, a fabrication method for the same, and a metal mold that can prevent the occurrence of the chip standing phenomenon even when carrying out soldering using reflow soldering, and that be applied to further down-sizing an decreasing of weight. Curved parts and that extend beyond the connecting tongue pieces and of side piece parts and rising in an upward diagonal direction with respect to the connecting tongue pieces and are formed by press bending processing, and thereby the side piece parts and are exposed in an upward rising direction relative to the connecting tongue pieces and at the external end surfaces and of the external resin packaging.

Chip capacitor having external resin packaging

A piezoelectric actuator has a housing having a top portion with an opening. A Y-shaped member comprising a bottom arm and divided two top arms. The bottom arm is fixed on a bottom portion of the housing and the divided two top arms are placed in a movable state. A detachable member is so fitted into the opening of the housing as to be detachable from the opening of the housing. A piezoelectric device has one end being fixed to the detachable member and the opposite end being in contact with a valley portion of the Y-shaped member so that when the piezoelectric device extends in a longitudinal direction by a voltage application then the opposite end presses down the alley portion thereby a distance between the tops of the divided two top arms of the Y-shaped member is enlarged. A beam has opposite ends being fixed to topes of the divided top arms and a center portion displaceable in a vertical direction when a distance between the tops of the divided top arms of the Y-shaped member is changed.

Piezoelectric actuator with a displacement enlarging feature

A strain generating element for generating a strain in accordance with an externally provided driver voltage, a diaphragm secured to one end surface of the strain generating element and having a projecting portion, a case for encasing the strain generating element therein, a first coupler attached to the case, and a second coupler attached to the other end. A first coupler of a first piezoelectric actuator is connectable to a second coupler of a second piezoelectric actuator so that an elongation of the first actuator is transferred to the second actuator through a projecting portion of the first actuator to thereby add the elongation of the first actuator to an elongation of the second actuator in a uniform direction of elongation.

Encased piezoelectric actuator

A positioning mechanism includes a housing, at least one holding member inserted into a lateral opening formed in the housing at the side wall, thereof and an electrostrictive effect element mounted on the holding member. When the electrostrictive effect element is energized, it expands to urge the holding member against a moving member which is to be stopped and held a desired location.

Positioning mechanism

Piezoelectric actuator

The invention relates to a device using a leverage mechanism for amplifying a mechanical displacement produced by applying a voltage to a piezoelectric element. The device has a central support part, a pair of lever arms which are arranged oppositely and symmetrically with respect to a center axis of the support part and each connected to the support part by a hinge section, a piezoelectric element which has a longitudinal axis normal to the center axis of the support part and is fixed at two opposite ends to root ends of the two lever arms, respectively, and a resilient metal sheet beam which is fixed at its two oposite ends to the tip ends of two lever arms, respectively. A displacement of each end of the piezoelectric element is transmitted to the adjacent lever arm and amplified by lever action of each lever arm. As the amplified displacement is transmitted to the beam from the lever arms the beam makes a buckling motion, and a maximal displacement of the beam with respect to an end face of the support part becomes the output of the device. According to the invention a middle section of the beam is fixed to a protruding end of the support part, so that the device provides two simultaneous outputs one of which is a maximal displacement of the beam in a segment on one side of the fixed middle section and the other another maximal displacement in a segment on the opposite side of the middle section.

Growing community of inventors

Kurobe, Japan

Mitsunori Sano