Nec Corporation

Mitsunori Kanemoto

Taro Kaneko

Tarou Kaneko

Mitsuru Kurihara

Hideki Mizuno

Masahiko Namiwaka

Seiji Kawata

Hiromi Sueda

Keiji Takamura

[Problems] To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely. [Means for Solving the Problems] An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplification element mounted on the carrier through a first sub-carrier, first and second lenses fixed on the carrier through first and second lens holders, an element supporting member and an optical isolator fixed on the carrier, a third lens holder supported by the element supporting member, a third lens and a small carrier individually fixed in the third lens holder, and a semiconductor laser element mounted on the small carrier through a second sub-carrier.

Optical transmission module and manufacturing method of the same

An optical transmission module is provided which has excellent long-term reliability, high manufacturing efficiency and a smaller optical output loss and which facilitate its downsizing, weight saving and high integration. The optical transmission module is provided with a first optical deviceplaced on an output side, a second optical deviceplaced on the first optical devicealigned with an optical axis of the first optical device, a packageincluding the first and second optical devicesand, and an optical fiberconfigured to guide light emitted from the first optical deviceto the outside of the package. The first optical deviceand the second optical deviceare in close contact with each other on the surface perpendicular to the optical axis.

Optical transmission module and manufacturing method thereof

To accommodate a plurality of optical semiconductor elements in one package with their optical axes aligned highly precisely. An optical transmission module includes an optical transmission unit, a carrier to become a base, a semiconductor optical amplification element mounted on the carrier through a first sub-carrier, first and second lenses fixed on the carrier through first and second lens holders, an element supporting member and an optical isolator fixed on the carrier, a third lens holder supported by the element supporting member, a third lens and a small carrier individually fixed in the third lens holder, and a semiconductor laser element mounted on the small carrier through a second sub-carrier.

An optical communication module is fabricated to include a refraction plate made of an inorganic material whose refractive index varies little with temperature. The refraction plate is inserted in the optical path to perform optical axis compensation in a single lens system with long focal length.

Optical communication module using refraction plate for optical axis compensation, and manufacturing method of the same

Disclosed are an optical element holder and an optical communication module. The optical element holder comprises a pedestal having a pair of fixing sections, a pair of holding sections and a stress-suppressing section. The fixing sections are formed in opposing end portions of the pedestal for being welded to a carrier. The holding sections are formed to face the pedestal in an inner position than positions where the fixing sections are formed so as to hold the optical element by pinching it therebetween. The stress-suppressing section prevents a welding stress, which is generated when the fixing sections are welded to the carrier, from affecting the holding sections.

Optical element holder and optical communication module

In a bonding apparatus having an ultrasonic horncoupled to an ultrasonic vibratorand a bonding toolcoupled to the ultrasonic horn, and applying ultrasonic bonding to a work, by providing an ultrasonic detectorand an indicatorfor displaying an output signal from the ultrasonic detector, there is obtained a bonding method that can easily make a good or bad judgment on the bonding state based on the output signal of the ultrasonic detector. With this arrangement, ultrasonic vibration of the bonding tool in the bonding apparatus using ultrasonic waves is constantly monitored, thereby reducing occurrence of bonding failure and making definite the time for replacing the bonding tool.

Bonding apparatus and bonding method having process for judging bonding state

The present invention discloses a semiconductor laser device having: a lead frame; a resin molding provided for sealing a part of said lead frame and including a main body and a flange portion having opposite end faces, said resin molding being formed into such a shape that said flange portion protrudes outwardly from a periphery of said main body; a laser chip having an optical axis and mounted on a surface of said lead frame for emitting laser light; and a heat-radiating fin provided on said lead frame for cooling said laser chip, said heat-radiating fin being disposed in an exposed state on the side of at least one of said two end faces of said flange portion.

Semiconductor laser device and method for manufacturing same

In a semiconductor device, each of a plurality of leads has a chip mounting portion electrically connected to the semiconductor chip through a bump and a lead main body supporting the chip mounting portion. A lead path from the distal end of the lead main body to the bump is bent in X, Y, and Z directions so that the distal end portion of the lead main body and the chip mounting portion are arranged on different levels when viewed from a side surface. The lead main body and the chip mounting portion substantially make a right angle to form an L shape when viewed from an upper side. The semiconductor chip is connected, through bumps, to upper surfaces of distal end portions of the chip mounting portions of the leads on a plane. A molded body seals constituent elements except a part separated from a connection portion between the lead main body and the chip mounting portion, and incorporates a bent portion of the lead main body. Each lead is arranged such that the chip mounting portions are arranged on both sides of a centerline of the semiconductor device in a longitudinal direction to be parallel to the centerline. The L-shaped leads are arranged on one side such that the chip mounting portions oppose each other on a plane. A lead frame and lead bonding are also disclosed.

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Tokyo, Japan

Mitsunori Kanemoto