Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Mitsunori Inoue

Tomohiko Mori

Hironobu Kubota

Kenji Nishiyama

Gota Shinohara

Yoshiyuki Nomura

Yoshihito Okutomi

Mikiko Noguchi

Naoko Nishimura

Shoichiro Furukawa

An electronic component includes a body made of an insulator, a coating film covering the body, a conductor located in the body, and outer electrodes each of which is connected to the conductor. The insulator contains a magnetic metal powder. The coating film is composed of resin and cations of a metal which is a cationic element contained in the insulator and which has a standard electrode potential E0 of less than about 0 V.

Method for manufacturing electronic component

A method of manufacturing a ceramic electronic component such that Voids of the ceramic element and voids at the interfaces between the ceramic element and the external electrodes are filled with a resin composition by applying, to the ceramic electronic component, a resin-containing solution that has the function of etching the surface of the ceramic element to ionize constituent elements of the ceramic element. The resin composition includes a resin, and cationic elements among the constituent elements of the ceramic elements, which are ionized and deposited from the ceramic element.

Ceramic electronic component and manufacturing method therefor

A method for producing an electronic component includes a step of preparing a porous base body containing a ceramic and including an inner conductor disposed in the body; and a step of impregnating the base body with a resin emulsion.

Method for producing electronic component

An electronic component includes a main body made from a metal magnetic powder and an insulating resin, a coating film covering the surface of the main body, a conductor disposed inside the main body, inorganic particles adhering to the surface of the coating film, and outer electrodes which are electrically connected to the conductor and which cover portions of the surface of the coating film while inorganic particles adhere to the portions, wherein the coating film contains a resin and metal cations.

Electronic component and method for manufacturing electronic component

Electronic component comprising magnetic metal powder

An electronic component includes a main body composed of an insulator, a coating film covering the main body, a circuit element located inside the main body, and outer electrodes. The insulator contains a metal magnetic powder. The coating film is composed of a resin and a cationic element contained in the insulator.

Method for manufacturing an electronic component

Electronic component and method for manufacturing the same

A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes that are provided on the surface of the ceramic element. The coating film is selectively formed on the surface of the ceramic element by applying, to the ceramic electronic component, a resin-containing solution containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid, and a hydrofluoric acid.

A ceramic electronic component that includes a ceramic main body, a coating film and external electrodes on the surface of the ceramic main body. The coating film is selectively formed on the surface of the ceramic main body by applying, to the surface of the ceramic main body, a resin-containing solution that etches the surface of the ceramic main body so as to ionize constituent elements of the ceramic main body. The coating film includes a resin and the constituent elements of the ceramic main body, which were ionized and deposited from the ceramic main body.

A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes on a surface of the ceramic element. The coating film includes cationic elements from a constituent element of the ceramic element, which are ionized and deposited from the ceramic element, and a resin. The surface of the coating film is recessed relative to a surface of wrapping parts of the external electrodes on the surface of the ceramic element.

Ceramic electronic component

A ceramic electronic component that includes a ceramic element, and baked electrodes on a surface of the ceramic element. A resin film is formed at boundary sites between the ceramic element and the baked electrodes. The resin film includes a resin, and a cationic element that is a constituent element of the glass component in the baked electrodes.

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Nagaokakyo, Japan

Mitsunori Inoue