Ulvac, Inc.

Mitsunori Henmi

Koukou Suu

Isao Kimura

Hiroki Kobayashi

Mitsutaka Hirose

Kazuya Tsukagoshi

Shinnosuke Mashima

A multi-layered film includes a first electroconductive layer, a dielectric layer, and a second electroconductive layer, which are sequentially layered and disposed on a main surface of a substrate. A lower surface of the dielectric layer comes into contact with an upper surface of the first electroconductive layer, an upper surface and an side surface of the dielectric layer is coated with the second electroconductive layer, and an side end of a portion at which the first electroconductive layer directly overlaps the second electroconductive layer is located inside a side end of the substrate on the main surface of the substrate.

Multi-layered film, method of manufacturing the same, and manufacturing apparatus of the same

A multi-layered film includes an electroconductive layer made of platinum (Pt), a seed layer including lanthanum (La), nickel (Ni), and oxygen (O), and a dielectric layer being preferentially oriented in a c-axis direction, which are at least sequentially disposed on a main surface of a substrate made of silicon.

Multi-layered film and method of manufacturing the same

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Chigasaki, Japan

Mitsunori Henmi