Panasonic Intellectual Property Management Co., Ltd.

Panasonic Corporation

Socionext Inc.

Mitsumi Itou

Hiroshi Ebihara

Takayuki Yoshida

Fumihiro Kimura

Shinya Tokunaga

Yoichi Matsumura

Wataru Satou

The present disclosure provides a coating method for suppressing variations in a coating amount, a coating apparatus and a method for manufacturing a component. A coating method is employed, which includes: discharging a coating needle adhering to an adhesive from a nozzle; separating the adhesive into the tip of the coating needle and the nozzle; and adhering the adhesive to a first member. A coating apparatus is employed, which includes: a nozzle which holds the adhesive; a coating needle which is discharged from the nozzle in a state where the adhesive is adhered to the tip; and a control unit which controls moving speed of the coating needle to separate the adhesive into the tip of the coating needle and the nozzle.

Coating method, coating apparatus and method for manufacturing component

In a semiconductor device, a lower chip includes a first group of connection terminals provided on a straight region including a corner region and a region extending from the corner region along one side. An upper chip includes a second group of connection terminals. The upper chip and the lower chip are arranged so that the first group of connection terminals at least partially overlaps with the second group of connection terminals. The first group of connection terminals is at least partially electrically connected to the second group of connection terminals.

Semiconductor device

All interface pins for transmitting and receiving a signal having a predetermined function of a semiconductor integrated circuit element are formed on an outer periphery of the semiconductor integrated circuit element along one side of the semiconductor integrated circuit element. The one side of the semiconductor integrated circuit element is adjacent to two of sides of a BGA substrate, the two sides being not parallel to the one side. Of balls provided on the BGA substrate, balls electrically connected to the interface pins for transmitting and receiving a signal having a predetermined function are provided between the one side of the semiconductor integrated circuit element and the two sides of the BGA substrate.

Semiconductor device and electronic device

Growing community of inventors

Kyoto, Japan

Mitsumi Itou