Mitsubishi Denki Kabushiki Kaisha

Mitsumasa Mori

Atsushi Tanaka

Hayato Takasago

Mitsuyuki Takada

Masanobu Kohara

Eishi Gofuku

Yoshiyuki Morihiro

Kohei Adachi

Toru Kokogawa

Takanori Takaki

Kurumi Miyake

A drive circuit module comprises a board formed of a hard base material having no flexibility, a circuit pattern formed on the board and having a plurality of input terminals and output terminals supported by a flexible insulation film, and a carrying section for carrying a drive LSI and the like on the circuit pattern; characterized in that the board is provided with at least one cutout on a surface opposite to the surface on which the circuit pattern of the board is formed, thereby making flexible the board in a direction in which the output terminal surface and the carrying section surface are different from each other.

Rigid circuit board for liquid crystal display including cut out for

Disclosed herein is a wiring panel constructed with a substrate; an electrically conductive member laminated on the substrate and principally composed of copper; and an insulating member composed of an organic substance, wherein a very small amount of a non-metallic element is incorporated into the electrically conductive member, and a very small amount of a metal element is incorporated into the insulating member. Also disclosed herein is a method for producing a wiring panel constructed with a substrate, an electrically conductive member provided on the substrate and composed of copper as the principal constituent, and an insulating layer of an organic substance covering the conductive member, which comprises steps of: applying onto the surface of the electrically conductive member a surface-reforming layer which functions to suppress electron transfer through the surface of the electrically conductive member, and thereafter forming the organic insulating layer on the electrically conductive member.

Wiring panel including wiring having a surface-reforming layer and

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Amagasaki, Japan

Mitsumasa Mori