Hitachi Chemical Company, Ltd.

Hitachi, Ltd.

Mitsumasa Kojima

Yasunori Kojima

Makoto Kaji

Hideo Hagiwara

Haruhiko Kikkawa

Hidetaka Satou

Takayuki Saito

Hiroshi Suzuki

Tohru Kikuchi

Hitoshi Yokono

Nobuyuki Hayashi

Yasuo Miyadera

Masami Yusa

Fusaji Shoji

Shigeki Katogi

Tokio Isogai

Daisuke Makino

Fumio Kataoka

Toshiaki Ishimaru

Issei Takemoto

Hidetaka Sato

Masataka Nunomura

Katsuji Shibata

Shigeo Tachiki

Toshiyuki Fujita

Kuniaki Sato

Isao Obara

Shun-ichiro Uchimura

Masatoshi Yoshida

Toshihiko Kato

Dai Kawasaki

Toul Kikuchi

A polyimide precursor having repeating units of the formula:

Polyimide precursor, polyimide and their use

A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.

A polyimide precursor having repeating units of the formula: wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.

Photosensitive resin composition containing a photosensitive polyamide

An N-aryl-.alpha.-amino acid (I), which is a novel compound, is effective as a photoinitiator. The photoinitiator composition including this photoinitiator is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation. Further, a photoinitiator composition (A) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and/or an azabenzalcyclohexanone (III), or a photoinitiator composition (B) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and a titanocene (IV), or a photoinitiator composition (C) comprising a 3-substituted coumarin (II), a titanocene (IV) and an oxime ester (V), is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation.

Photoinitiator compositions including amino acids, coumarin and

A photosensitive resin composition comprising (A) a polymer obtained by reacting an isocyanate compound having an ethylenic unsaturated group with a polymer which is a reaction product of a tetracarboxylic acid dianhydride and a diamine, and (B) a photoinitiator, can provide a thick film excellent in heat resistant, adhesiveness, flexibility, electrical and mechanical properties, and is particularly suitable for producing a photosensitive element.

Photosensitive resin composition and photosensitive element using the

Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.

Processes for preparation of polyimide-isoindroquinazolinedione and

A polyimide obtained from a polyamide-acid or polyamide-acid ester prepared by reacting dicyclohexyl-3,4,3', 4'-tetracarboxylic acid or dinanhydride with a diamine is excellent in transparency, heat resistance and mechanical properties, said polyimide being able to be obtained at a lower temperature, and particularly suitable for an orientation film used in a liquid crystal display device.

Dicyclohexyl-3,4,3',4'-tetracarboxylic acid or dianhydride thereof and

There are disclosed a process for producing a polyamide acid having at least one siloxane bond, which comprises carrying out the reaction of:

Process for producing polyamide acid having siloxane bonds and polyimide

A light-sensitive polymer composition comprising a poly(amic acid), a special bisazide compound and an amine compound can give a film which has high sensitivity and in which portions exposed to light are not easily released by a developing solution at the time of development.

Light-sensitive polymer composition with poly(amic acid), bisazide, and

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Hitachi, Japan

Mitsumasa Kojima