Hitachi, Ltd.

Hitachi Computer Electronics Co., Ltd.

Mitsukiyo Tani

Hiroshi Hasegawa

Hideaki Sasaki

Hideo Shiraishi

Koichi Sugimoto

Takeji Shiokawa

Akira Gotoh

Mamoru Kobayashi

Seiichi Kawashima

Tositada Netsu

Takeshi Yano

Toshimitsu Nakagawa

Kanji Ishige

Tosaku Kojima

Toshiyuki Amimoto

Tamotu Kirino

Yashuhiko Kawakami

A present invention provides a locking mechanism capable of preventing a bolt from loosening. A bolt has a head provided with a first part which comprises openings . A locking washer is provided with a second part which includes outer projections and a third part which includes insertion projections on an outer edge. A taper piece has a portion provided with a fourth part which comprises openings . The first part and the second part can engage with each other and the third part and the fourth part can engage with each other when said bolt fastens at least two members and trough said washer and said taper piece . Accordingly, the bolt is prevented from rotating in an loosening direction.

Bolt and a nut locking mechanism

A wire bonding method and apparatus for welding a wire with at least one end formed with a ball and a pad of a printed wiring board. A bonding head moves downward slowly to crush the ball to form a flat surface, and will move upward once to adjust a relative position of the pad and the ball. The bonding head will move downward again, and an ultrasonic wave is applied to heat the ball and the bonding head so that the ball and the pad are welded. If necessary, a portion of the wire to be bent is moved to a desired position of the wiring board, by a supporting apparatus. A free end of the wire which is not welded is moved by a jig to bend the portion of the wire for routing.

Wire bonding method and apparatus

A bonding method and apparatus for bonding a wire material having a ball-like end on a bonding pad is disclosed. While the ball of the wire material on the bonding pad is being pressed by a bonding tip, an ultrasonic wave and a high frequency current are applied in combination to the bonding tip so as to improve strength of the bonding portion.

Bonding method and bonding apparatus

A method for wiring an electronic device including a plurality of electronic components and a plurality of connector elements for interconnecting the plurality of electronic components, the connector elements being arranged on the same plane in spaced relation to each other so as to define passages includes a number of steps. A first discrete line is connected to a surface of a first connector element such that the first discrete line extends on a first passage extending along the first connector element. Two pins are positioned along the first passage, substantially perpendicular thereto. The first discrete line is bent along the two pins, a distance between the at least two pins is then reduced, and the at least two pins are then moved away from the first passage. Similar, steps can be used to provide multiple discrete line between two connector elements or along the same passage between different connector elements.

Wiring method and apparatus for electronic circuit boards or the like

The invention relates to joining of fine wires, and more particularly to a wire bonding method suitable for connecting a number of wires within a narrow area. A first wire is bonded on a pad, and a second wire is bonded on the position where the first wire has been bonded. Bonding of a subsequent wire is performed in that the wire is stacked and bonded in similar manner mentioned above. Thus a plurality of repair wires can be bonded within one pad even if the pad area is very small.

Wire stacked bonding method

A small-sized light-weight resistance reflow soldering apparatus for modifying the wiring pattern on a printed circuit board, with the soldering apparatus including a heating device with an adjustable weight, a supporting mechanism for a vertically movably supporting the heating device, a welding power supply for making the heating device produce heat enough to melt the solder for a predetermined time length, and a case accomodating these constituents. The soldering is effected by the heating device which produces the heat while being pressed against the jointing surface.

Resistance reflow soldering apparatus

A machine for automatically wiring an insulated fine wire as thin as a hair on the printed circuit board of wiring patterns are set up between adjacent conductor printed circuit board to be applied with wirings is carried by an X-Y table which is movable in X and Y directions, and the X-Y table is moved in accordance with wiring sites. A wire guide unit, a bonding unit and a wire cutter unit mounted, above the X-Y table, to a head rotatably supported about an axis perpendicular to the X-Y table surface are rotated along with the head so as to be oriented in various directions an optical device is supported for optical monitoring of the operations from above along the rotational axis of the bonding head. The wire guide unit sequentially pays out the insulated fine wire onto the printed circuit board carried by the X-Y table, the bonding unit exposes the core of the payed-out insulated wire and fuses the wire for connection thereof to the conductor pad of the printed circuit board by heating and depressing the payed-out wire, and the wire cutter unit cuts away the wire after completion of wiring.

Growing community of inventors

Odawara, Japan

Mitsukiyo Tani