Other

Tomoegawa Paper Co., Inc.

Mitsukazu Ochi

Toshio Tagami

Osamu Kiyohara

An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to 400; n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material is useful as a cationic electrodeposition coating.

Epoxy resin reacted with phenolic OH-aramide/ban

An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material and a carboxyl-terminated polybutadiene-acrylonitrile copolymer is useful as a cationic electrodeposition coating.

Epoxy resin/phenolic OH-aramid/ban block copolymer product with CTBN

An epoxy resin modified material is disclosed, which is obtained by reacting an epoxy resin and a phenolic hydroxyl group-containing aramid/polybutadiene-acrylonitrile block copolymer represented by formula (I): ##STR1## wherein Ar.sup.1 and Ar.sup.3 each represent a divalent aromatic group; Ar.sup.2 represents a phenolic hydroxyl group-containing divalent aromatic group; x represents an integer of from 3 to 7; y represents an integer of from 1 to 4; y/(x+y) is from 0.1 to 0.3; z represents an integer of from 5 to 15; m represents an integer of from 1 to 400; n represents an integer of from 1 to 400; n/(m+n) is from 0.01 to 0.50; and l represents an integer of from 1 to 50. An epoxy resin composition containing the epoxy resin modified material is also disclosed.

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Osaka, Japan

Mitsukazu Ochi