Renesas Electronics Corporation

Sony Semiconductor Solutions Corporation

Nec Compound Semiconductor Devices, Ltd.

Mitsuhito Kanatake

Hirohisa Yasukawa

Hiroyuki Shigeta

Kosuke Hareyama

Daisuke Chino

Kiyohisa Sakai

Atsushi Tsukada

Hirotaka Kobayashi

Yutaka Ootaki

Shigekazu Ishii

Ninao Sato

Yuki Yamane

Koyo Hosokawa

To arrange a protective material horizontally with respect to a substrate plane without the protective material coming into contact with wires in a wire-bonded semiconductor package. The semiconductor package includes a protective material, a substrate, bumps, and a semiconductor chip. The bumps are provided on a chip plane of the semiconductor chip and are connected to the substrate via wires. The semiconductor chip is laminated on the substrate. A support is provided on the chip plane to support the protective material at a position where the height from the chip plane of the semiconductor chip is higher than the bumps.

Semiconductor package, semiconductor package manufacturing method, and electronic device

A semiconductor device includes a semiconductor chip, a circuit board, a heat releasing plate, an adhesive member, and a conductive member. The circuit board transmits a signal of the semiconductor chip. The heat releasing plate has the semiconductor chip disposed thereon, and has an opening in a region on the outer side of a semiconductor chip placement region that is a region in which the semiconductor chip is disposed. The adhesive member is disposed in a region on the outer side of the opening on a different surface of the heat releasing plate from the surface on which the semiconductor chip is disposed, and bonds the circuit board and the heat releasing plate to each other. The conductive member connects the semiconductor chip and the circuit board to each other via the opening.

Semiconductor device, imaging apparatus, and method for manufacturing semiconductor device

An optically coupled device includes a light emitting element and a light receiving element which are electrically isolated from each other, and an optical waveguide allowing therethrough transmission of light from the light emitting element to the light receiving element, wherein the optical waveguide is covered with an encapsulation resin containing a light reflective inorganic particle which is typically composed of titanium oxide, the light emitting element and the light receiving element are respectively provided on a base (for example, package terminals), and the entire portion of the outer surface of the optical waveguide, brought into contact with none of the light emitting element, the light receiving element and the base, is covered with the encapsulation resin.

Method of manufacturing an optically coupled device

Optically coupled device with an optical waveguide

A semiconductor package has a base member made of a wiring board or a lead frame, a wall member fixed onto the base member to define a cavity, and a cured-resin cap member for encapsulating a semiconductor chip in the cavity. The curable-resin cap member is fixed onto the wall member by the curing process for the curable-resin cap member.

Semiconductor package having a resin cap member

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Kanagawa, Japan

Mitsuhito Kanatake