Fujitsu Corporation

Fujitsu Semiconductor Limited

Disco Corporation

Fujitsu Microelectronics Limited

Mitsuhisa Watanabe

Eiji Yoshida

Yuzo Shimobeppu

Kazuo Teshirogi

Kazuhiro Yoshimoto

Yoshiaki Shinjo

Noboru Hayasaka

Akira Takashima

Masataka Mizukoshi

Takao Nishimura

Yoshito Akutagawa

Takao Ohno

Koji Sawahata

Takashi Mori

Yusuke Kimura

Koichi Yajima

Yoshikazu Kumagaya

Yoshito Konno

Kazou Teshirogi

Kyouhei Tamaki

A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.

Semiconductor device suitable for a stacked structure

The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame, and a rubber filmarranged within the outer frameand having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber filmincreases, the wafer-fixing jigdeforms the rubber film and allows the tapesandarranged between the waferand the rubber filmA to be pushed toward the wafergradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Vacuum fixing jig for semiconductor device

The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame, and a rubber filmarranged within the outer frameand having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber filmincreases, the wafer-fixing jigdeforms the rubber film and allows the tapesandarranged between the waferand the rubber filmA to be pushed toward the wafergradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Jig for a semiconductor substrate

Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig

A method of making a semiconductor device includes a back-grinding step of grinding a back surface of a semiconductor substrate, a dicing step of dicing the semiconductor substrate along predetermined dicing lines so as to make pieces of semiconductor devices after the back-grinding step, and a laser exposure step of shining laser light on the back surface of the semiconductor substrate after the back-grinding step so as to remove grinding marks generated by the back-grinding step.

Method of making semiconductor device that has improved structural strength

A high-contrast image recognition can be performed by recognizing an image of a recognition mark from a back surface of a wafer by a visible-light camera by irradiating a visible light from a circuit pattern surface of a silicon substrate. A thickness of the silicon substrate is set to 5 &#x3bc;m to 50 &#x3bc;m. A white or visible light having a wavelength equal to or less than 800 nm is irradiated onto the circuit-pattern forming surface of the substrate. A visible light that has transmitted through the silicon substrate is received by a visible-light camera on a side of a back surface of the silicon substrate. An image of a recognition mark formed on the circuit-pattern forming surface of the silicon substrate is recognized by the visible-light camera.

Recognition method of a mark provided on a semiconductor device

A flat-object holder can hold a flat object-and-frame assembly, and the holder has the flat object fixed to the frame with protection tape. The flat-object holder includes at least a flat object supporting area for fixedly holding the flat object via the protection tape by applying a suction force, and a frame fixing area for fastening the frame. The flat-object holder bearing the flat object-and-frame assembly can be fixedly held by a selected chuck table by applying a negative pressure to the flat object supporting area. The flat-object holder can transfer and put the flat object-and-frame assembly in a container. Thus, no matter how thin the flat object may be, it can be handled without the fear of breaking.

Flat-object holder and method of using the same

The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame , and a rubber film arranged within the outer frame and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film increases, the wafer-fixing jig deforms the rubber film and allows the tapes and arranged between the wafer and the rubber film A to be pushed toward the wafer gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Semiconductor chips are formed on a wafer. The wafer is diced, while a dicing tape applied to the wafer is kept intact. Each of the semiconductor chips is fixed by suction and then removed from the dicing tape. Each of the semiconductor chips is unfixed by ceasing the suction and picked up and conveyed.

Semiconductor chip removing and conveying method and device

Growing community of inventors

Kawasaki, Japan

Mitsuhisa Watanabe