Seiko Epson Corporation

Mitsuhiro Tateyama

Hiroki Kawai

Hiroshi Komatsu

Hideo Miyasaka

Norihito Matsukawa

Atsushi Ono

Tsunenori Shibata

A sensor element includes a first reference potential side terminal located between a first signal side terminal and a second signal side terminal along a first axis passing through the first signal side terminal and the second signal side terminal in a plan view from a direction in which a first piezoelectric element and a second piezoelectric element are stacked and a second reference potential side terminal located between the first signal side terminal and the second signal side terminal along the first axis in the plan view from the direction. The first axis is located between the first reference potential side terminal and the second reference potential side terminal in the plain view from the direction.

Sensor element, sensor device, force detection apparatus, and robot

A sensor device includes a base body including a recess, a lid body configured to close an opening of the recess, a force detection element disposed in the recess and configured to output an electric charge according to a received external force, and an electronic component disposed in the recess and electrically connected to the force detection element. A separation distance between the electronic component and the lid body is larger than a separation distance between the force detection element and the lid body in the thickness direction of the lid body.

Sensor device, force detecting device, and robot

A sensor device includes a base body including a recess, a lid body configured to close an opening of the recess, a force detection element disposed in the recess and including a first element that outputs a first signal according to an external force in a first axis and a second element that stacks on the first element and outputs a second signal according to an external force in a second axis; a first circuit disposed in the recess and configured to process the first signal, and a second circuit disposed in the recess and configured to process the second signal.

Sensor device having a force detection element sandwiched by two sensor signal processing circuits

A vibrating device has a package having an accommodating space in the interior thereof and a gyro element and an IC chip accommodated in the accommodating space. The package has a plate-like bottom plate having an IC chip mounting area and a vibrating element mounting area. The IC chip mounting area includes an IC chip mounting surface on which the IC chip is mounted. The vibrating element mounting area is arranged in parallel with the IC chip mounting area and includes a vibrating element mounting surface on which the gyro element is mounted. The thickness of the IC chip mounting area is smaller than that of the vibrating element mounting area. The IC chip mounting surface is located closer to a bottom side than the vibrating element mounting surface.

Growing community of inventors

Minowa, Japan

Mitsuhiro Tateyama