Daikin Industries, Ltd.

Mitsuhiro Tanaka

Junichi Teraki

Noriyuki Okuda

Yoshitsugu Koyama

Akio Yoshimoto

Rei Kondou

An electric component box installed in an outdoor unit of an air conditioner includes: an electronic component accommodation unit that accommodates an electronic component; an intake port through which air is drawn in from outside the electric component box; a discharge port through which air is discharged from inside the electric component box; and a cooler disposed in an airflow path extending from the intake port to the electronic component accommodation unit and that cools air.

Electrical component box

An electric component includes a printed circuit board with each of a pair of surfaces serving as a component mounting surface. The component mounting surface has a predetermined region on which electronic components are coated with a resin. A predetermined one of the electronic components in the region is not covered with the resin at a portion above a predetermined height from the component mounting surface.

Electronic component and method for manufacturing electronic component

A magnetic refrigeration system includes a plurality of heat transporters, a magnetic field application unit, and a drive mechanism. Each heat transporter is switched between a heat generating and heat absorbing states in response to magnetic field application and cancellation of the magnetic field application. The heat transporters are arranged between low and high temperature side heat exchangers. The magnetic field application unit applies a magnetic field to the heat transporters so that a heat transporter to which a magnetic field is applied and a heat transporter to which a magnetic field is not applied are alternately arranged. The drive mechanism periodically moves at least the plurality of heat transporters so that a heat transporter to which the magnetic field is applied is periodically switched and so that a state of thermal contact is periodically switched. An end portion of at least one heat transporter is a heat transfer accelerator.

Magnetic refrigeration system

A cooling member includes a heat-transfer member, a refrigerant introducing pipe and a covering material. The heat-transfer member has a surface with a groove opened to the surface of the heat-transfer member. The refrigerant introducing pipe is pressed into the groove. The covering material coats the surface of the heat-transfer member and the refrigerant introducing pipe.

Cooling member with pressed pipe

For an electronic circuit apparatus including a shunt resistor, provided is a measure for improving the heat dissipation performance of the shunt resistor. The shunt resistor includes electrodes at both ends. One of the two electrodes is connected to a surface-mounting pattern on which the shunt resistor is surface-mounted. A current-generating-side pattern and a current-receiving-side pattern are arranged separately from the surface-mounting pattern. The current-generating-side pattern and the surface-mounting pattern are connected together via a connection member which creates a space between itself and a substrate.

Electronic circuit apparatus

A substrate includes a pair of surfaces opposing to each other in a direction. First electronic components are provided on one surface. Second electronic components lower than a maximum value of the height of the first electronic components in a direction are provided on the other surface. Insulating resin includes a covering part adhering and covering the second electronic components and the other surface, and side surface part extending from the periphery of the substrate to a side of the second electronic components along the direction. A lid covers the first electronic components from an opposite side of the substrate, and is fixed to the side surface part from the opposite side of the substrate.

Electrical equipment unit

A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply circuit for performing power conversion. Both the power semiconductor and the non-power semiconductor are mounted on the resin substrate. The cooling device is disposed in order to cool the power semiconductor.

Growing community of inventors

Kusatsu, Japan

Mitsuhiro Tanaka