Denso Corporation

Mitsuhiro Sugiura

Ataru Ichikawa

Misao Tanaka

Kenji Arai

Atsushi Furumoto

Tatsuya Kubo

Shinichiro Shiraishi

Chisato Ozawa

Tatuya Kubo

Atushi Furumoto

A soldering apparatus has a soldering iron unit having a soldering tip for carrying out a soldering process to a printed circuit board, a heater unit for heating the soldering iron unit, and a gas supply device for operatively supplying a burning-assist gas to the soldering iron unit, when a cleaning process is carried out for the soldering iron unit. The cleaning process for the soldering iron unit is carried out when the soldering process to the printed circuit board is stopped. In the cleaning process, the soldering iron unit is heated by the heater unit and the burning-assist gas is supplied to the soldering iron unit, so that material attached to the soldering iron unit can be easily burnt out.

Soldering apparatus and method for manufacturing electronic unit

In a method of soldering a work-piece in a state where the work-piece contacts a wave molten solder, a soldering process is performed while controlling an immersion depth of the work-piece into the wave molten solder to be constant. The immersion depth control is performed by changing one of a height position of the work-piece and a wave height of the wave molten solder based on a displacement amount of the work-piece in a height direction thereof. Accordingly, the soldering process can be performed with high quality even when the work-piece is thermally warped.

Wave soldering method and system used for the method

In a flow soldering apparatus, a substrate is clamped by a pair of nails of a chuck mechanism and transferred over a molten solder barrel while being held in contact with a molten solder. The nails are held resiliently to each other, so that the substrate is allowed to expand thermally between the nails without bowing. The chuck mechanism has a scraper nail which extends transversely over the entire lateral length of the substrate at the front side of the substrate in a substrate transfer direction to push away an oxide film formed on the molten solder. The chuck mechanism is constructed to allow the molten solder to enter underneath the substrate in the lateral direction with respect to the substrate transfer direction. After completing one soldering operation, the nails change the set of the opposing two sides to another set of two opposing sides of the substrate, so that the substrate is subjected to the soldering operation from a direction different from the preceding soldering operation.

Flow soldering apparatus having resilient substrate clamping mechanism and solder oxide film removing mechanism

In a jet soldering method, a substrate is held by an actuator and pre-heated by a pre-heater. The pre-heater has a shield member or the substrate is swung to equalize temperature distribution in the substrate. The substrate is then transferred over a primary jet soldering bath while dipping a treatment surface of the substrate in a primary solder jet, so that solder stick to the treatment surface of the substrate. Then, the substrate is transferred over a secondary jet soldering bath while dipping the treatment surface in a secondary solder jet, so that the solder sticking to the substrate is shaped. The transfer conditions of the substrate are differentiated between transfers over the primary jet soldering bath and the secondary jet soldering bath.

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Kariya, Japan

Mitsuhiro Sugiura