Hitachi, Ltd.

Mitsuhiro Shikida

Kazuo Sato

Yoshio Kawamura

Akira Koide

Shinji Tanaka

Yasuaki Horiuchi

Toshimitsu Miyada

Yukio Honda

Shigeo Ohashi

Takeshi Harada

Toshio Hatada

Noriyuki Ashiwake

A cooling device according to the present invention, in which a space is formed by means of flat electrodes and side plates disposed on the ends of the flat electrodes, and a flexible film fastened in that space in a shape of the letter S, is fixed to a semiconductor package so that one of the flat electrodes is fitted on the semiconductor package. The respective flat electrodes are alternately powered to move the S shaped section of the flexible film.

Cooling device for semiconductor packages, having flexible film heat

Disclosed is a gas valve capable of switching gases to be introduced within a vacuum chamber with high speed thereby enhancing the controllability of the composion of a semiconducting thin film growing on a substrate and shortening the time required for growth of the thin film. The gas valve comprises a bendable film between a pair of parallel plate electrodes whereby operating the film by an electrostatic force and opening and closing a port for releasing gas to a substrate mounted on the wall surface of a gas chamber and a port for exhausting an unnecessary gas to an exhaust passage. The gas valve is mounted in the vicinity of the substrate within the vacuum chamber for supplying a working gas in a minimum amount required for the film growth.

Valve and semiconductor fabricating equipment using the same

Growing community of inventors

Kokubunji, Japan

Mitsuhiro Shikida