Sumitomo Chemical Company, Limited

Mitsuhiro Shibata

Yasuhiro Endo

Shuichi Kanagawa

Yutaka Shiomi

Shinichiro Kitayama

Youichi Ueda

Yasuhiro Hirano

Masatsugu Akiba

Kazuo Takebe

Kaori Yamasaki

Katsuya Watanabe

Kunimasa Kamio

Toshiaki Hayashi

Mika Shirasaki

Hisashi Watabu

Yoichi Ueda

Yasuhisa Saito

Saito Yasuhisa

An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure accelerator. When cured, the resulting product has low dielectric constant and a low dielectric loss tangent. A copper-clad laminate formed using the described composition has a low dielectric constant and a low dielectric loss tangent. The copper-clad laminate exhibits excellent adhesiveness characteristics and is suitable for use in multilayer printed wiring boards in high speed operations, particularly in the high frequency region.

Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition

A cyanate resin composition comprising as essential components a cyanate compound represented by formula (1) or its prepolymer and a curing agent: ##STR1## wherein each of R.sub.1 and R.sub.2 represents a hydrogen atom or an alkyl group having 1 to 5 carbon atoms; A represents an alkyl group having 1 to 3 carbon atoms; i represents an integer of 0 to 3 alone or together with a brominated epoxy compound or a maleimide compound or its prepolymer, said cyanate resin composition giving a cured product having a low-dielectric constant, and a copper-clad laminate composed of a prepreg of said cyanate resin composition and a copper foil.

Cyanite composition and copper-clad laminate using the composition

A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.

Copper-clad laminate with prepreg of epoxy resin and aryl ester

An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

Unsaturated imide compounds containing alicyclic structure, process for

The polyimide film of this invention is formed from a polyimide, which is prepared by reacting a diamino compound represented by the general formula (1): ##STR1## wherein X represents a hydrocarbon group having 1 to 20 carbon atoms or a sulfur atom; R represents each independently a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; a represents each independently an integer of 0 to 4; with a tetracarboxylic dianhydride represented by the general formula (2) ##STR2## wherein Y represents a tetravalent organic group having 2 or more carbon atoms. The polyimide film obtained can be applied favorably to a flexible printed circuit board without adhesion layer, a protective coating for electronic parts and electric wires, or a heat resistant adhesive.

Polyimide film

An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: ##STR1## with a carbonyl compound represented by the general formula: ##STR2## which aryl ester compound can give, when used as a curing agent for an epoxy resin, a cured product having a low dielectric constant and a low dielectric loss tangent; an epoxy resin composition comprising as the essential components an epoxy resin, said aryl ester compound and a cure accelerator; and a copper-clad laminate using the epoxy resin composition. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent and is excellent in adhesiveness as compared with conventional ones, and hence, is suitable for multilayer printed wiring board for high speed operation, especially at high-frequency region.

Esterified resorcinol-carbonyl compound condensates and epoxy resins

A cyanate resin composition suitable for a copper-clad laminate comprises components (A) and (B).

Cyanate resin composition and copper-clad laminate

A polyimide represented by the general formula (1): ##STR1## wherein Y represents a hydrocarbon group having 4 to 20 carbon atoms or a sulfur atom; each of R.sub.1 to R.sub.4, R.sub.i and R.sub.j represents a halogen atom, a hydrocarbon group having 1 to 6 carbon atoms or a halogen-containing hydrocarbon group having 1 to 6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4; and X represents a tetravalent organic group having 2 or more carbon atoms.

Polyimide and process for producing the same

The present invention provides an improved epoxy resin composition comprising an epoxy resin and a novel imide compound represented by the formula ##STR1## wherein X represents an --NH.sub.2 group and/or --OH group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represent a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or hydroxyl group, and each of m and n represents a number of from 0 to 30.

Imide compound and composition containing the same

The present invention provides an improved epoxy resin composition comprising an epoxy resin and a novel imide compound represented by the formula ##STR1## wherein X represents an --NH.sub.2 group and/or --OH group, Ar.sub.1 and Ar.sub.2 independently represent an aromatic residue, R.sub.1 represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms, R.sub.2 represents a hydrogen atom, an alkyl or alkoxy group having from 1 to 20 carbon atoms or hydroxyl group, and each of m and n represents a number of from 0 to 30.

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Tsukuba, Japan

Mitsuhiro Shibata