Somar Corporation

Tdk Corporation

Mitsuhiro Seki

Fumio Hamamura

Shigeo Sumi

Yasuhiro Nagafuchi

Sigeo Sumi

Ichio Fukuda

Masaaki Iwakura

Noriyasu Sawada

Kazunori Ishibashi

Takashi Goto

A ferrite core includes an end face portion, a pair of outer legs protruding from the end face portion, and a center leg protruding from the end face portion between the pair of outer legs. A width Wclose to one end portion of the center leg in a Y-axis direction perpendicular to a facing direction of the outer legs is smaller than a width Wclose to the other end portion. According to this configuration, a circuit component may be positioned close to the end portion. A transformer includes the ferrite core.

Ferrite core and transformer using the same

A film peeling apparatus is disclosed wherein a base plate stuck with the films is conveyed to a film peeling position, where a contact tightness of leading edges of the films to the base plate is reduced by a film contact tightness reducer while relative moving speed of the base plate and the reducer is decreased by slowing down the conveyance speed of the base plate or by moving the reducer in synchronism with the conveyance of the base plate without stopping the conveyance of the base plate.

Film peeling method and apparatus for practicing same

An apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.

Apparatus for bonding continuous thin film to discrete base plates and

Film remover

A method and apparatus for bonding thin film supplied from a continuous roll to at least one bonding surface along the entire length of a discrete printed surface base plate and efficiently cutting the film to a proper length which covers an entire planar surface of the board. Each board is conveyed to a film bonding position and the leading end of the continuous film is transported to the film bonding position that is held by suction. A compression bonding roller moves across the surface of the board and automatically feeds film and bonds the film to the board while leaving a portion of the film loose over the trailing end of the board. A cutter comprising a rotary blade and a fixed blade disposed across the direction of movement of the film and the board is mounted on a slide bed which is moveable towards and away from the film. The rotary blade is obliquely oriented in order to permit the cutting of the film when the blade is rotated in opposition to the fixed blade. The compression bonding roller then completes the bonding of the loose end of the film through the remaining portion of the board. This structure permits a wide film to be rapidly and positively cut and bonded to the board.

A thin film laminating apparatus which is operative to bond a continuous thin film to the surface of a base plate, using heat and pressure applied by a pressure laminating roller, and to cut the film to a length corresponding to that of the base plate. The apparatus has an adjustable film cut-off unit having a fixed cutter and a rotary cutter, both of which extend across the width of the thin film, transverse to the direction of continuous film feed. The fixed cutter and the rotary cutter are independently supported by members which are movable and convey the respective cutters into and out of a film cutting position. The support members are movable manually, to permit initial insertion of the thin film into a cutoff position, and automatically during continuous operation of the thin film laminating apparatus.

Adjustable film cutoff unit

A film guide device for film bonding in which a movable guide roller support and guides the film and swing roller arms prevent the slackening of the film while the film is being fed. Also, a driving action of a rotation-drive source, which controls the movement of the movable guide roller support arms, is synchronized with the braking of the film supply role and the movement of the leading edge of the film towards the bonding surface. This device prevents longitudinal wrinkles in the film, misplacement on the bonding surface, and excessive tension on the film.

Film guide device for a film bonding apparatus

A film sticking method is disclosed in which the tip of the cutting portion of a sharp-pointed cutting member is caused to pierce a continuous film. The member is moved rightward and leftward across the direction of the feed of the film so that the film is cut off to a prescribed length. The cut-off film is stuck to a base plate. Also, a film sticking apparatus is disclosed which includes a film cutter for cutting off a continuous film to a prescribed length by moving a cutting member across the direction of the feed of the film and sticks the cut-off film to a base plate. The cutting member is formed so that it is sharp-pointed and has a cutting edge at least one side of edges of the member. The cutting edge can be moved backward and forward relative to the surface of the continuous film.

Film sticking method and apparatus

The apparatus for bonding a film, having a length corresponding to the length of a board, to a film bonding surface of the board by compression bonding rollers which comprises a conveying device for conveying the board, a board clamp and guide device for clamping and guiding said board at a predetermined position, a film feed member for holding the leading end of the film by suction and feeding the leading end of the film to a film bonding position, a film leading end-holding member provided in the vicinity of the film bonding position, and having a holding surface for face-to-face contact with the leading end of the film fed by the film feed member to the film bonding position, the film leading end-holding member having film suction apertures connected to a vacuum system so as to cause the leading end of the film to be held on the holding surface by suction, compression bonding rollers for bonding the film, held at the film bonding position by the film feed member, from its leading toward trailing end to the film bonding surface of the board from the leading end to trailing end of the board, and a cutting device for cutting the continuous film at its trailing side into a length corresponding to the length of the board in the direction of feed thereof.

Film bonding method and apparatus for performing same

A thin film peeling apparatus in which a portion of a thin film adhered to a base plate is initially lifted and subsequently peeled therefrom. The film peeling apparatus includes a conveying device for conveying the base plate along a base plate conveyance path, a first thin film conveyance device for conveying the lifted portion of the thin film and a second thin film conveyance device for subsequently conveying the thin film. The first thin film conveyance device is disposed so that the thin film is peeled in a direction substantially perpendicular to the direction of conveyance of the base plate. The second thin film conveyance device includes at least one fluid ejector for ejecting fluid against the thin film such that the thin film is conveyed in a direction parallel to the surface of the base plate and substantially perpendicular to the direction of conveyance of the base plate.

Thin film peeling apparatus

A thin-film coating method for laminating thin-films to opposing surfaces of a substrate and an apparatus for accomplishing the same. A pair of tack members 10E are respectively disposed on opposite sides of the substrate and are moveable in a direction perpendicular to the direction of conveyance of the substrate so as to temporarily tack forward and portions of the thin-films to the substrate. Compression rollers 16 are movably disposed with respect to the substrate such that the compression rollers can respectively contact forward end portions of the thin-films after the tack members have been removed from the substrate. The compression rollers are rotatable to thereby convey the substrate and to cause the thin films to adhere to the opposing surfaces of the substrate. A void-space preventing agent device 30 is provided in a position upstream to the tacking position. The device 30 deposits a void-space preventing agent in the form of mist on the substrate so as to prevent void spaces from developing on the contacting surfaces between the substrate and each of the films.

Thin-film coating method and apparatus therefor

A thin film adhering apparatus and method in which a thin film whose length corresponds to that of a substrate is adhered to the substrate by applying pressure using a pressure adhering roller. The apparatus includes a substrate conveyance mechanism for conveying the substrate to a thin film adhering position and conveying the substrate from that position; a thin film feeding member for suctioning the leading edge portion of the continuous thin film and supplying the leading edge portion to the adhering position; a leading edge portion holding member having a holding side which comes into surface contact with the leading edge portion of the thin film, the holding side having suction holes communicating with a vacuum suction system for suctioning the leading edge portion of the film, the continuous thin film held in the thin film adhering position by the holding member being adhered to the thin film adhering side of the substrate to the trailing edge portion thereof by the pressure adhering roller; and a cutter for cutting the continuous thin film at the trailing edge portion thereof to the length corresponding to that of the base.

Thin film adhering method and thin film adhering apparatus

A thin-film releasing apparatus in which a portion of a thin-film is released from a surface of a substrate on which the thin film is stuck, the remaining portion of the thin film is then released starting from the released portion thereof and the thus released thin film is then removed. The apparatus comprises a first thin film conveyange system for releasing the remaining portion of the thin film from the thin film by nipping the thin film at the intitially released portion thereof and for conveying the thus released thin film upwardly from the surface of the substrate simultaneously, and a second thin-film conveyance system for mounting thereon the thin film conveyed by the first thin film conveyance system and for conveying the mounted thin film in a direction intersecting a conveyance direction of the substrate.

Growing community of inventors

Tokyo, Japan

Mitsuhiro Seki