Kabushiki Kaisha Toshiba

Toshiba Memory Corporation

Kioxia Corporation

Tokyo Electron Limited

Mitsuhiro Omura

Toshiyuki Sasaki

Tsubasa Imamura

Kei Watanabe

Junichi Hashimoto

Hisashi Okuchi

Hisataka Hayashi

Tokuhisa Ohiwa

Shinichi Nakao

Yusuke Oshiki

Kazuhisa Matsuda

Shunsuke Ochiai

Hiroshi Tomita

Eiichi Nishimura

Shigeru Tahara

Nobuaki Yasutake

Fumio Sato

Yuya Matsubara

Takaya Matsushita

Soichi Yamazaki

Kosuke Horibe

Yoshiaki Fukuzumi

Hideaki Aochi

Hiroshi Yamamoto

Atsuko Sakata

Hisashi Kaneko

Yasuhito Yoshimizu

Yutaka Okamoto

Masayuki Kitamura

Junichi Wada

Satoshi Nagashima

Satoshi Wakatsuki

Keisuke Kikutani

Katsunori Yahashi

Shoko Ito

Yasuyoshi Hyodo

Fumiko Yamashita

Kazuhito Furumoto

Makiko Katano

Takamichi Tsuchiya

Tomo Hasegawa

Daina Inoue

Takehiro Kondoh

Satoshi Inada

Kaori Narumiya

Jungo Inaba

Yusuke Kondo

Itsuko Sakai

Chihiro Abe

Yumi Ohno

Junya Fujita

A film processing method includes forming a target film, the target film having an upper surface. The method includes forming a carbon film on the upper surface of the target film. The method includes performing a first etching to format least one recess in the target film, with the carbon film serving as a mask. The method includes performing a second etching, by directing an ion beam through the at least one recess, to increase a depth of the at least one recess.

Film processing method and semiconductor device manufacturing method

An etching method according to one embodiment, includes alternately switching a first step and a second step. The first step introduces a first gas containing a fluorine atom without supplying radiofrequency voltage to form a surface layer on a surface of a target cooled at a temperature equal to or lower than a liquefaction temperature of the first gas. The second step introduces a second gas gaseous at the first temperature and different from the first gas, and supplies the radiofrequency voltage, to generate plasma from the second gas to etch the target by sputtering using the plasma.

Etching method, semiconductor manufacturing apparatus, and method of manufacturing semiconductor device

According to one embodiment, a method of manufacturing a semiconductor device includes forming a first film on a substrate. The method further includes forming a second film on the first film. The method further includes forming a recess in the first film using the second film as a mask. The second film includes a first layer having carbon and a second layer having carbon formed on the first layer. The second layer has a second carbon density lower than a first carbon density of the first layer.

Manufacturing method of semiconductor device

According to one embodiment, a method for manufacturing a semiconductor memory device includes forming a stacked body by alternately stacking an insulating film and a conductive film. The method includes forming a trench in the stacked body. The trench extends in one direction and divides the conductive film. The method includes burying a diblock copolymer in the trench. The method includes phase-separating the diblock copolymer into a plurality of first blocks and an insulative second block extending in a stacking direction of the insulating film and the conductive film. The method includes forming a plurality of holes by removing the first blocks. The method includes forming charge accumulation layers on inner surfaces of the holes. And, the method includes forming a plurality of semiconductor pillars extending in the stacking direction by burying a semiconductor material in the holes.

Semiconductor memory device and method for manufacturing same

A method for manufacturing a semiconductor device includes forming a mask layer including a) one metal from tungsten, tantalum, zirconium, hafnium, molybdenum, niobium, ruthenium, osmium, rhenium, and iridium, b) boron, and c) carbon on a layer to be etched. The mask layer is patterned. A hole or a groove is formed in the layer to be etched by performing dry etching on the layer to be etched using the patterned mask layer. The mask layer includes a first region and a second region. The first region includes boron and the second region includes boron such that a density of boron in the second region is different from a density of boron in the first region, or the first region includes carbon and the second region includes carbon such that a density of carbon in the second region is different from a density of carbon in the first region.

Method for manufacturing semiconductor device

According to one embodiment, a method for manufacturing a semiconductor device includes forming a hole extending in a first direction in a workpiece. The method includes forming a first film on an upper surface of the workpiece and an upper portion of a side wall of the hole. The method includes forming a second film on the first film. The method includes removing portions of the first and second films from the upper surface of the workpiece so that at least a part of the first and second films formed on the upper portion remain. The method includes removing at least a part of a portion of the workpiece which is exposed through the hole using a second etchant. An etching rate of the first etchant for the first film is higher than an etching rate of the first etchant for the second film.

A semiconductor device manufacturing method includes forming a first resist and a second resist on a stacked body that includes a plurality of first films and a plurality of second films, the second resist facing one or more side surfaces of the first resist; forming a third film in a slit between the first resist and the second resist, the third film covering the side surfaces of the first resist and defining exposed surfaces of the first resist not covered by the third film; performing a first etch of the stacked body from an upper surface using the first resist, the second resist, and the third film as a mask; selectively etching the one or more exposed surfaces of the first resist and the second resist; and performing a second etch of the stacked body from the upper surface using the first resist and the third film as a mask.

Semiconductor device manufacturing method

A method for manufacturing a semiconductor device includes forming a resist film on a film to be processed. An upper portion of the film to be processed is processed using the resist film as a first mask. Tungsten or a tungsten compound is selectively formed on the resist film. A lower portion of the film to be processed is processed with a reducing gas using the tungsten or the tungsten compound as a second mask.

According to one embodiment, a method for manufacturing a semiconductor memory device includes forming a mask layer on the stacked body. The method includes forming a stopper film in a part of the mask layer. The method includes forming a plurality of mask holes in the mask layer. The mask holes include a first mask hole overlapping on the stopper film. The method includes, by etching using the mask layer, forming holes in the stacked body under other mask holes than the first mask hole on the stopper film, but not forming holes in the stacked body under the stopper film. The method includes forming memory films and channel bodies in the holes.

Method for manufacturing semiconductor memory device

According to one embodiment, a method for manufacturing a semiconductor device includes forming a mask layer on a layer to be etched, the mask layer containing tungsten and boron, a composition ratio of the tungsten being not less than 30%, patterning the mask layer, and performing a dry etching to the layer to be etched using the mask layer being patterned, and forming a hole or a slit in the layer to be etched.

According to one embodiment, a method for manufacturing a semiconductor device includes forming a mask layer on a layer to be etched. The mask layer contains at least one type of a metal, boron, and carbon. The metal is selected from a group including tungsten, tantalum, zirconium, hafnium, molybdenum, niobium, ruthenium, osmium, rhenium and iridium. A composition ratio of the metal is higher than a composition ratio of the boron and a composition ratio of the carbon. The method includes making a hole or a slit in the layer to be etched by performing a dry etching to the layer to be etched using the mask layer being patterned.

According to an embodiment, a manufacturing method of a semiconductor device includes: forming a first film on a processing target by using a first material; forming a second film on the first film by using a second material; selectively removing the second and first films to provide an opening pierced in the second and first films; selectively forming a metal film on an inner surface of the opening in the first film; and processing the processing target by using the metal film as a mask.

A method of manufacturing a semiconductor device provided with a stack of a first film substantially free of oxygen and a second film disposed above the first film and comprising a metal oxide containing an uneasily etched material is disclosed. The method includes etching the second film by a first process using a first etch gas containing a boron trichloride containing gas and by a second process following the first process using a second etch gas containing an inert gas. In the second process, the second etch gas is used while a bias power is controlled to be equal to or greater than an etching threshold energy of the second film.

Method of manufacturing semiconductor device

Growing community of inventors

Kawasaki, Japan

Mitsuhiro Omura