Mitsubishi Denki Kabushiki Kaisha

Mitsuhiro Nonogaki

Seiji Oka

Junji Fujino

Osamu Hayashi

Hiroyuki Nakajima

Takashi Takahama

Yoshiyuki Morihiro

Fumiyuki Miyamoto

Akira Adachi

Takumi Kikuchi

Makoto Doi

Michio Futakuchi

Kohei Murakami

Hiroyukio Nakajima

A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.

Composition of phenolic resin-modified epoxy resin and straight chain

Flux for soldering comprising inorganic ion-exchanger and activator containing halogen atom, solder composition the flux and solder particles, soldering method comprising coating the solder composition on a portion for soldering, soldering method comprising coating flux containing activator on a portion for soldering, applying inorganic ion-exchanger to the portion and applying solder to the portion, and soldering method comprising mixing inorganic ion-exchanger with creamy solder to give mixture, coating the mixture on a circuit pattern of a wiring plate and heating the wiring plate. The flux for soldering and the soldering composition are excellent in metal ion-migration resistance, corrosion resistance, soldering property and storage stability, and can be preferably used without cleaning and the soldering methods can be preferably used in practical no-clean soldering methods.

Flux for soldering and solder composition comprising the same and

A resin having a low dielectric constant obtained by heat-curing 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain and from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule in the presence of an organic peroxide. Also disclosed is a resin having flame resistance obtained by heat-curing a blend of an organic peroxide with a composition comprising 100 parts by weight of a butadiene polymer containing in its polymer chain at least 50 mol% of a 1,2-butadiene unit having a double bond in its side chain, from 10 to 100 parts by weight of a vinyl compound having at least 3 vinyl groups in one molecule and at least one member selected from the compounds of the formulas I-IV: ##STR1## wherein X is H or CH.sub.3, Y is Br or Cl, A is --, --o--, --CO--, SO.sub.2, --CH.dbd.CH--, --C(CH.sub.3).sub.2 --or --(CH.sub.2 .sub.a --, ad each of m, n and a is an integer of from 1 to 4, in an amount of from 25 to 100 parts by weight in the case of the formulas I to III and from 25 to 200 parts by weight in the case of the formula IV.

Electrical insulating resin

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Amagasaki, Japan

Mitsuhiro Nonogaki