Murata Manufacturing Co., Ltd.

Mitsuhiro Matsumoto

Tadashi Nomura

Koji Tanaka

Nobuaki Ogawa

Tomoya Bando

Kazuhiro Iida

Yoichi Takagi

Ryo Tatsumi

Teruhisa Tsuru

Masato Yoshida

Akihiko Kamada

Kensei Nishida

To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.

Module, module component composing the module, and method of manufacturing the module

A low profile module is provided that has a high functionality achieved by increasing the component mounting density. In spite of achieving high functionality in a moduleby respectively mounting components such as a semiconductor substrateand chip componentson the two main surfacesandof a wiring substrate, the low-profile modulecan be provided which has a high functionality as a result of increasing its component mounting density by forming a thickness Ha of a first component layerformed by mounting only the semiconductor substrateface down on one main surfaceof the wiring substrateso as to be smaller than the thickness of a second component layerformed by mounting a plurality of chip componentson the other main surfaceof the wiring substrate

Low profile semiconductor module with metal film support

A mixer, which is a single balanced mixer, includes an LO port for inputting an LO signal, an RF port for inputting an RF signal, an IF port for outputting an IF signal, a balun for converting an unbalanced signal into a balanced signal, and a pair of mixer diodes connected in series. The mixer further includes a high-pass filter for blocking LO and IF signals and passing an RF signal and a low-pass filter for blocking LO and RF signals and passing an IF signal.

Mixer and converter using same

A delay line comprising a dielectric substrate including a pair of main surfaces; a transmission line disposed on one of the main surfaces of the dielectric substrate; a ground conductor disposed on the other of the main surfaces of the dielectric substrate; and at least one of a variable capacitor and a diode being disposed on the dielectric substrate and connected in parallel to the transmission line for setting a desired delay time of the delay line. In the above delay line, the delay time can be adjusted even after the delay line is mounted on a printed circuit board, and further, the delay time can be continuously adjusted. The delay line can also be formed in a multilayer structure rather than on the above dielectric substrate.

Delay line with a parallel capacitance for adjusting the delay time

A small-sized superimposed circuit module has reduced spurious electromagnetic wave emission and small variations in circuit parameters. A resonance circuit portion of an oscillator and a portion of a noise rejection filter are embedded in a multilayer ceramic substrate, and the remaining circuit components are mounted on the surface of the multilayer substrate. The upper surface of the multilayer substrate is covered with a metal case.

Superimposing circuit module for reducing spurious electromagnetic wave emissions and small variations in circuit parameters

A phase shifter includes a comb-line defined by first and second transmission lines that are electromagnetically coupled with each other and a plurality of variable-capacitance diodes connected to the first and second transmission lines defining the comb-line. In the phase shifter, one end of the first transmission line is connected to an input terminal, one end of the second transmission line is connected to an output terminal, and the variable-capacitance diodes are connected between the other ends of the first and second transmission lines and the corresponding grounds.

Growing community of inventors

Shiga-ken, Japan

Mitsuhiro Matsumoto