Dainippon Screen Mfg. Co., Ltd.

Sokudo Co., Ltd.

Mitsuhiro Masuda

Yasuhiro Fukumoto

Toshihiro Nakajima

Yasuhiro Shiba

Toru Azuma

In a thermal processing unit, a substrate is held by a local transport hand to be transported between a transfer section and a heating unit, and subjected to a heat processing by the heating unit. Also, the local transport hand is cooled by a cooling plate in the transfer section.

Thermal processing apparatus, thermal processing method, and substrate processing apparatus

A thermal processing unit is connected to a substrate position detector, which is in turn connected to a bake unit controller. The thermal processing unit includes a temperature control plate and a lifting device. The temperature control plate and lifting device are connected to the bake unit controller. The operations of the temperature control plate and lifting device are controlled by the bake unit controller. A pressure measuring pipe is provided at a lower part of at least one of a plurality of pin inserting holes in the temperature control plate. The pressure measuring pipe is connected to a low differential pressure sensor. The low differential pressure sensor detects the pressure in an airflow exhausted from a space surrounded by a substrate and an upper face of the temperature control plate via the pressure measuring pipe.

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Kyoto, Japan

Mitsuhiro Masuda