Ibiden Company Limited

Mitsuhiro Kondo

Kiyotaka Tsukada

Masaru Takada

Hiroyuki Kobayashi

Hisashi Minoura

Kenji Chihara

Atsushi Hiroi

Kinya Ohshima

Katsumi Sagisaka

Takeshi Takeyama

Naoto Ishida

Yoshikazu Ukai

Kouji Asano

Atsushi Shouda

Takuji Asai

Osamu Watanabe

Osamu Fujikawa

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board () having a conductor circuit (). The solder resist is then heat-cured to form an insulating film () having a low thermal expansion coefficient. A laser beam () is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (), whereby the conductor circuit () is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

Method of manufacturing printed wiring board

In a printed wiring board, an odd number (n) of conductive layers (-) and insulating layers (-) are alternately laminated upon another. The first conductive layer () is constituted as a parts connecting layer and the n-th conductive layer () is constituted as an external connecting layer which is connected to external connecting terminals (). The second to (n&#x2212;1)-th conductive layers () are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer () is coated with the outermost n-th insulating layer () in a state where the external connecting terminals () are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Printed wiring board and method for manufacturing the same

A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the innerlayer conductor circuit contains a previously formed opening hole located at the bottom of the blind via-hole. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes.

Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit

In a printed wiring board, an odd number (n) of conductive layers (-) and insulating layers (-) are alternately laminated upon each other. The first conductive layer () is a parts connecting layer and the n-th conductive layer () is an external connecting layer which is connected to external connecting terminals (). The second to (n&#x2212;1)-th conductive layers () are current transmitting layers for transmitting internal currents. The surface of the n-th insulating layer () in a state where the external connecting terminals () are exposed on the surface. It is preferable to make the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.

Printed wiring board and method of manufacturing the same

A printed circuit board providing superior adhesion between a substrate and a conductor pattern and preventing damage of the substrate . The width c of the bottom surface of the conductor pattern is greater than the width d of the top surface . Accordingly, the conductor pattern has a trapezoidal cross-section. The two side surfaces of a lower portion of the conductor pattern are coated by a solder resist. The two side surfaces at the upper portion of the conductor pattern are exposed from the solder resist . A solder ball engages the two side surfaces

Printed-circuit board and method of manufacture thereof

In the production of a printed wiring board comprising innerlayer conductor circuits arranged among insulating layers and blind via-holes formed from an outermost surface of the insulating layer toward the innerlayer conductor circuit, an opening hole is previously formed in a central portion of the innerlayer conductor circuit located at the bottom of the blind via-hole , and laser beams are irradiated from the outermost surface of the insulating layer to form the blind via-holes . Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes

Printed wiring board having throughole and annular lands

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board ( ) having a conductor circuit ( ). The solder resist is then heat-cured to form an insulating film ( ) having a low thermal expansion coefficient. A laser beam ( ) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening ( ), whereby the conductor circuit ( ) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

A method for manufacturing a multilayer printed circuit board that shortens the distance between pattern layers and facilitates formation of a minute conductive hole having superior conductive reliability. A core substrate ( ) including ad core pattern ( ), which has a pad ( ), is first prepared. Then, a laminated plate is formed by laminating an insulating layer ( ) on the surface of the core substrate. Afterward, a surface pattern ( ) is formed on the surface of the laminated plate. Further, the conductive hole ( ) is formed by irradiating a laser beam at the laminated plate. The bottom opening of the conductive hole ( ) is covered by the pad ( ).

Multilayer printed wiring board and method for manufacturing the same

A solder resist comprising a thermosetting resin is printed on a surface of an insulating board (,) having a conductor circuit (,). The solder resist is then heat-cured to form an insulating film (,) having a low thermal expansion coefficient. A laser beam (,) is then applied to the portion of the insulating film in which an opening is to be formed, to burn off the same portion for forming an opening (,), whereby the conductor circuit (,) is exposed. This opening may be formed as a hole for conduction by forming a metal plating film on an inner surface thereof. It is preferable that an external connecting pad be formed so as to cover the opening. The film of coating of a metal is formed by using an electric plating lead, which is preferably cut off by a laser beam after the electric plating has finished.

A printed wiring board which has a conductor circuit (,) on an insulating substrate (,) and a surface insulating layer (,) formed on the surface of the substrate (,) including the surface of the conductor circuit (,). Part of the conductor circuit (,) has an exposed conductor section (,) having an exposed surface, and a surface insulating layer (,) around the conductor section (,) forms a recessed section at the same level of the surface of the conductor section (,) or lower than the surface. It is preferable to form a black or white solder resist layer on the surface insulating layer.

An electronic-parts mounting board frame is formed by assembling a plurality of electronic-parts mounting boards into a single frame. The mounting boards may be electrically connected to the frame by separate inner and outer lead frames, the former being formed in the mounting boards and the latter being integral with the frame.

Electronic-parts mounting board and electronic-parts mounting board frame

An electronic component carrier for mounting an electronic component such as a semiconductor element, IC chip or the like comprises a printed wiring substrate having conductor pattern and thorugh-hole, an adhesive layer formed on the substrate, a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection, and a solder layer formed in the through-hole for electrical connection to the conductor pattern of the substrate.

Electronic component carriers and method of producing the same as well

An electronic part mounting board and a semiconductor device which may be easily fabricated and have high reliability by preventing deterioration due to heat at the time of fabrication and the occurrence of internal stress. In the electronic part mounting board and the semiconductor device using such electronic part mounting device: a board fixing pin is provided on a lead frame which is provided to surround a circuit board and which has a plurality of leads, in a manner extended from the frame to be coupled to the circuit board to support the circuit board with respect to the frame; and the circuit board and the board fixing pin are coupled to each other by a fitting pin for connecting the two members. Since the circuit board and the lead frame are coupled, heating and caulking are not required. The thermal deterioration of the resin board to be used and internal stress due to heat between the board and the lead frame do not occur. Fault at the time of mounting the electronic part and reduction in the reliability of the finished products are not caused. Since the coupling position may be selected with relatively less restrictions, the degree of freedom of design is large.

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Ogaki, Japan

Mitsuhiro Kondo