Shin-etsu Chemical Co., Ltd.

Toyota Jidosha Kabushiki Kaisha

Shin-etsu Chemical C O., Ltd.

Mitsuhiro Iwata

Toshiyuki Ozai

Yukito Kobayashi

Hironao Fujiki

Takafumi Sakamoto

Masayuki Ikeno

Hiroyuki Imanishi

Yoshifumi Inoue

Tomoyuki Goto

Hidenori Mizushima

Koji Nakanishi

Shigeru Ubukata

Keita Kitazawa

Takahiro Yamaguchi

Kenichi Tsuji

Hikohito Yamazaki

Wataru Toya

Shota Akiba

Satoshi Onai

Toko Takahashi

Masami Kobayashi

A thermally-conductive two-part addition-curable silicone composition including a first liquid and a second liquid and a method of producing the same. The first liquid includes a heat-treated mixture including an organopolysiloxane having two or more alkenyl groups and aluminum oxide having Naion content equal to or lower than 100 ppm, a platinum-group metal catalyst, and an ion-trapping agent of a cation-exchange type and/or a cation-and-anion-exchange type. The second liquid includes a heat-treated mixture including an organopolysiloxane having two or more alkenyl groups, an organohydrogenpolysiloxane having three or more SiH groups, aluminum oxide having Naion content equal to or lower than 100 ppm, and an organohydrogenpolysiloxane having two SiH groups.

Thermally-conductive two-part addition-curable silicone composition and method for producing the same

With respect to an addition-curable thermally conductive silicone composition in which a silver filler is blended, a catalyst having a specific structure and an organohydrogen polysiloxane having a specific structure are used for the purpose of extending the working life at room temperature, while maintaining the flexibility, so that a thermally conductive silicone composition which is able to have a good balance between flexibility after curing and storage stability in one pack, while having extremely low thermal resistance and excellent reliability is achieved.

Thermally conductive silicone composition

Provided is a thermally conductive silicone grease composition that comprises: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) a spherical aluminum oxide powder which has a specific average sphericity, a specific number of surface hydroxyl groups, and a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 &#x3bc;m is within a specific range; and (D) a spherical and/or amorphous zinc oxide powder which has a specific average particle size, and for which the proportion of coarse particles in a laser diffraction type particle size distribution of 25 to 45 &#x3bc;m is within a specific range. The composition has a thermal conductivity measured by the hot disk method conforming to ISO 22007-2 of 2 W/m&#xb7;K or more and less than 5.5 W/m&#xb7;K, has a coefficient of viscosity measured by a spiral viscometer at a rotation frequency of 10 rpm of 5 to 800 Pa&#xb7;s, has insulation properties and high thermal conductivity, and has excellent flowability, workability, and heat dissipation properties.

Thermally conductive silicone grease composition

A low heat resistance silicone composition, including: (A) an organopolysiloxane having a specific kinematic viscosity; (B) an organopolysiloxane having a specific kinematic viscosity; (C) an &#x3b1;-aluminum oxide powder, &#x3b1;-aluminum oxide having a specific crystal structure and a particle shape with a D/H ratio in the predetermined range when a maximum particle diameter parallel to a hexagonal lattice face of the hexagonal close-packed lattice is taken as D and a particle diameter perpendicular to the hexagonal lattice face is taken as H, and the &#x3b1;-aluminum oxide powder having a specific average particle diameter, a specific content of coarse particles, and a specific purity; and (D) a spherical and/or irregular-shaped zinc oxide powder having a specific average particle diameter, and a specific content of coarse particles, in which the low heat resistance silicone composition has a specific heat conductivity and a specific viscosity.

Low heat resistance silicone composition

Addition one-part curing-type heat-conductive silicone grease composition containing: (A) an organopolysiloxane containing at least one alkenyl group per molecule and having a viscosity of 50-100,000 mPa&#xb7;s at 25&#xb0; C.; (B) an organohydrogenpolysiloxane containing at least two silicon-bonded hydrogen atoms per molecule, having no RSiO unit, having no silicon-bonded hydrogen atom at any terminal end, having the silicon-bonded hydrogen atoms only in a side chain or chains, and being in a substantially straight chain form, in an amount such that the ratio of {the number of Si&#x2014;H groups}/{the number of alkenyl groups in the composition} is 0.1-5.0; (C) a photoactive-type platinum complex curing catalyst; and (D) a heat-conductive filler, wherein the composition has a viscosity at 25&#xb0; C. of 30-800 Pa&#xb7;s as measured by a Malcom viscometer at a rotational speed of 10 rpm. The composition has high shape-retention properties, is low in hardness, and can be stored at normal temperature.

Addition one part curing type heat-conductive silicone grease composition

The present invention provides an addition-curable silicone composition comprising: (A) a linear organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups and CF&#x2014;(CF)&#x2014;(CH)&#x2014; groups; (B) an organopolysiloxane having silicon atom-bonded aliphatic unsaturated groups and CF&#x2014;(CF)&#x2014;(CH)&#x2014; groups, and having a branched structure represented by SiOand RSiO; (C) an organosilicon compound having silicon atom-bonded hydrogen atoms and represented by the following general formula (1); and (D) a platinum group metal-based catalyst. There can be provided an addition-curable silicone composition that provides a cured product having low refractive index, high transparency, excellent light extraction efficiency, good rubber properties and strength properties, and no tack after curing, and in particular, has good transmittance of light with a wavelength of 400 nm at 25&#xb0; C. 

Addition-curable silicone composition and optical device

A thermally conductive silicone adhesive composition for a reactor, having good fluidity even when containing a large amount of thermally conductive filler to obtain a thermally conductive silicone adhesive composition, permitting potting of fine substrates, having good properties after curing, having little change in properties even with heat or moist-heat aging, and giving good adhesiveness to metals and organic resins, and a reactor potted by this composition, can be provided by making a thermally conductive silicone adhesive composition having a viscosity of 100 mPa&#xb7;s at 25&#xb0; C. and containing a liquid organohydrogenpolysiloxane having 2-10 hydrogen atoms bonded with silicon atoms in the molecule, containing no alkoxy groups, having at least one epoxy group bonded with a silicon atom via an alkylene group, having a polysiloxane degree of polymerization of 15 or lower, and containing a polysiloxane skeleton having a cyclic structure.

Thermally conductive silicone adhesive composition for reactor and reactor

The present invention is curable silicone resin composition which is an addition-curable silicone composition, and comprises:  Thereby, there can be provided a curable silicone resin composition having high light extraction efficiency and useful as, for example, an encapsulant, a cured product thereof and a photosemiconductor apparatus.

Curable silicone resin composition, cured product thereof and photosemiconductor apparatus

An addition-curable silicone composition that provides a cured product having a particularly high transparency, an excellent light extraction efficiency and a favorable strength characteristic by subjecting the cured product to a lower refractive index by using a specific composition. The present invention was accomplished by an addition-curable silicone composition, including at least: 

Addition-curable silicone composition and optical element

A method of reducing a surface glossiness of an organopolysiloxane-cured article is provided. The method comprises preparing the liquid organopolysiloxane composition for matting comprising: (A) 100 parts by weight of a thermosetting liquid organopolysiloxane composition having a specific gravity larger than the component (B), and (B) 0.1 to 100 parts by weight of a hollow filler having a melting point of at least 150&#xb0; C., and a particle size of up to 200 &#x3bc;m, casting the liquid organopolysiloxane composition as a potting material or coating material; and curing the liquid organopolysiloxane composition at a temperature of 10 to 160 C for 30 to 180 minutes, whereby the hollow filler floats to the surface of the organopolysiloxane and forms surface irregularities on the surface of the cured article during curing to provide a surface glossiness of up to 40 in a cured article having a matted surface.

Method for reducing a surface glossiness of an organopolysiloxane-cured article

A liquid silicone rubber coating composition comprising (A) an organopolysiloxane containing at least two silicon-bonded alkenyl radicals, (B) an organohydrogenpolysiloxane containing at least two SiH radicals, (C) an addition reaction catalyst, optionally (D) finely divided silica, (E) triallyl isocyanurate, (F) an organosilicon compound containing an epoxy radical and a silicon-bonded alkoxy radical, and (G) a titanium or zirconium compound is coated on a surface of an airbag base fabric and cured to form a rubber coating layer thereon. The composition is suited for curtain airbags.

Liquid silicone rubber coating composition, curtain airbag and making method

A curable organopolysiloxane composition is provided, which is capable of generating a silicone rubber mother mold with improved mold release durability. The composition includes (A) 100 parts by mass of an organopolysiloxane containing at least two Si-bonded alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane containing at least two Si-bonded hydrogen atoms atoms within each molecule, in sufficient quantity to provide 0.4 to 5.0 mols of Si-bonded hydrogen atoms within the component (B) for each 1 mol of Si-bonded alkenyl groups within the composition, (C) 5 to 50 parts by mass of a finely powdered silica with a specific surface area measured by nitrogen gas absorption of at least 50 m/g, (D) 0.1 to 50 parts by mass of heavy calcium carbonate with a specific surface area measured by air permeability of 0.5 to 2.5 m/g, the surface of which has been treated with a paraffin-based compound, and (E) an effective quantity of a platinum group metal-based catalyst.

Curable organopolysiloxane composition and mother mold for cast molding

A heat-conductive silicone rubber composition is provided. This composition comprises (A) an organopolysiloxane with an average of at least 0.1 alkenyl groups bonded to silicon atoms within each molecule, (B) an organopolysiloxane with an average of at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a heat-conductive filler, (D) a platinum catalyst, and (E) a methylpolysiloxane with a hydrolyzable group and a vinyl group, as represented by a general formula shown below. This composition displays superior molding workability and adhesion, even if a large quantity of a heat-conductive filler is added to the composition

Heat-conductive silicone rubber composition

An organopolysiloxane composition comprising (A) an organopolysiloxane, (B) a silane compound having at least two hydrolyzable groups or a partial hydrolyzate thereof, and (C) the addition reaction product between a vinyl group-bearing bisphenol A skeleton compound and an organoxy group-bearing silicon compound is curable at room temperature to a variety of resins including PBT, HIPS and acrylic resins.

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Annaka, Japan

Mitsuhiro Iwata