Asahi Kasei Chemicals Corporation

Asahi Kasei Kabushiki Kaisha

Asahi Kasei Kogyo Kabushiki Kaisha

Mitsuhiro Horio

Yuuji Yoshinaga

Toshiharu Seyama

Hiroshi Tsukahara

Syuichi Kudou

Takashi Iwamoto

Takaaki Miyoshi

Kazuo Yoshida

Kazuya Noda

Yukiyoshi Sasaki

Seizaburoh Asai

Syuuichi Kudou

Jun-ichi Nakahashi

A polyacetal resin composition and molded article having a high metallic gloss, small change in a color tone according to the viewing angle, high weld performance, and high mechanical properties can be provided in which the amount of formaldehyde to be produced in molding and recycle is suppressed, the mold deposit is improved, and the repeated impact resistance after aging is high. A polyacetal resin composition comprising: (A) 100 parts by mass of a polyacetal copolymer resin, and (B) 0.1 to 10 parts by mass of an aluminum pigment, the aluminum pigment having a coin-like or flake-like flat shape, a volume average particle size Dof 15 to 50 &#x3bc;m, an average surface roughness Ra of 20 to 50 nm, and an average height Rc of depressions and projections in a surface roughness curve of 80 to 200 nm.

Polyacetal resin composition, method for producing the same, and molded article

Provided is a polyacetal resin composition obtained from a raw material composition containing a polyacetal resin, a hydrazine derivative, and a compound for lowering the melting point of the hydrazine derivative, wherein a mixture of the hydrazine derivative and the compound satisfies both of the following conditions: T1&#x3c;T2 and T1&#x3c;T3, in which T1 is an apex temperature of an endothermic peak of the mixture having a maximum endothermic capacity by, with DSC, heating and cooling the mixture in accordance with a predetermined temperature program and then heating it at a predetermined rate until the mixture fuses; and T2 and T3 represent apex temperatures of endothermic peaks of the hydrazine derivative and the polyacetal resin having a maximum endothermic capacity, respectively by the similar treatment.

Polyacetal resin composition and preparation process thereof

A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article. A conductive resin composition comprising a polyamide (A), a polyphenylene ether (B), a partially hydrogenated block copolymer (C) comprising an aromatic vinyl polymer block and a conjugated diene polymer block, a conductive carbonaceous material (D) and wollastonite particles (E).

Resin moldings and conductive resin composition

A ramp for hard discs which is obtained by molding a resin composition containing

Ramp made of polyoxymethylene resin

A ramp for a polyoxymethylene hard resin disk drive, which has an outgas level of not more than 20 &#x3bc;g/g. The ramp for a polyoxymethylene resin hard disk drive comprises the steps of providing an extruder, melt kneading a polyoxymethylene resin with a colorant while degassing through one or more vents under a reduced pressure of &#x2212;0.06 Mpa or less to prepare polyoxymethylene resin pellets, and injection molding the polyoxymethylene resin pellets, washing the molding with a solvent, and drying the molding.

Ramp for polyoxmethylene resin hard disk drive

A polyoxymethylene resin composition, which comprises (A) 100 parts by weight of polyoxymethylene resin, (B) 0.01 to 5 parts by weight of at least one polymer selected from homopolymers of N-vinylcarboxylic acid amides and copolymers of N-vinylcarboxylic acid amides and other vinyl monomers, and (C) 0.01 to 5 parts by weight of at least one compound selected from the group consisting of polyalkylene glycol and its derivatives, fatty acid amides, esters of alcohols and fatty acids, and esters of alcohols and dicarboxylic acids. Such a polyoxymethylene resin composition has a small amount of released formaldehyde gas during production and molding and suppressed scorching generation and is also distinguished in the water resistance and repeated impact resistance of the resulting moldings.

Polyoxymethylene resin composition

Polyoxymethylene resin composition comprising 40 to 99.5 parts by weight of polyoxymethylene resin (A), and 0.5 to 60 parts by weight of resin consisting of a polyamide elastomer (B) and an acid-modified olefinic resin (C) having an acid modification rate of 0.05 to 15 wt. %, a ratio of (B)/(c) being in a range of 10/90 to 90/10 % by weight, has a much distinguished impact resistance and a good antistatic property, while maintaining the heat stability inherent to the polyoxymethylene resin, as compared with the conventional one, and is suitable for use in OA appliances, VTR appliances, music-image-information appliances, communication appliances, automobile interior and exterior furnishings and industrial sundries.

Polyoxymethylene resin composition and molded articles made therefrom

A polyoxymethylene resin composition is provided which comprises a polyoxymethylene resin (A), a silicone compound-grafted polyolefinic resin (B-1) and a silicone compound (B-2), the amount of the silicone compound-grafted polyolefinic resin (B1) being 0.05 to 10 parts by weight on the basis of 100 parts by weight of the polyoxymethylene resin (A), and the ratio of (B1)/(B2) by weight in the composition being 99/1 to 70/30.

Growing community of inventors

Kurashiki, Japan

Mitsuhiro Horio