Kaneka Corporation

Mitsuhiro Hori

Takao Manabe

Makoto Seino

Kazuaki Kanai

Satoshi Sugiyama

Takahisa Iwahara

Tomokazu Tozawa

Shuhei Ozaki

Hiroshi Ogoshi

Kazuhiko Hirabayashi

Yasushi Kakehashi

Satoaki Iba

Ryoichi Narita

A molded resin body for surface-mounted light-emitting device has a cured resin body integrally molded with a plurality of leads and a concave portion to which the plurality of leads are exposed at the bottom portion, in which the ten-point average roughness (Rz) of the opening surface of the concave portion is 1 &#x3bc;m to 10 &#x3bc;m, the glass transition temperature of the cured resin body is 10&#xb0; C. or higher and the glass transition temperature is a value measured using a thermomechanical analyzer (TMA) under the conditions of a temperature range of &#x2212;50 to 250&#xb0; C., a temperature elevation rate of 5&#xb0; C./min, and a sample size length of 1 to 5 mm, and the optical reflectance at 460 nm of the opening surface of the concave portion is 80% or more and the optical reflectance retention rate on the opening surface after heating the molded resin body at 180&#xb0; C. for 72 hours is 90% or more.

Molded resin body for surface-mounted light-emitting device, manufacturing method thereof, and surface-mounted light-emitting device

A polysiloxane composition having high transparency, while being excellent in heat resistance and light resistance is provided. The polysiloxane composition is composed of (A) a polysiloxane which is a polysiloxane compound having a polyhedral skeleton having 6 to 24 silicon atoms in its molecule and which has at least one group containing a hydrolyzable silyl group bonded to a Si atom constituting the polyhedral skeleton, and (B) a photoacid generator. The hydrolyzable silyl group is preferably an alkoxysilyl group.

Polysiloxane composition

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Settsu, Japan

Mitsuhiro Hori