Kokusai Electric Co., Ltd.

Hitachi-Kokusai Electric Inc.

Kokusai Electric Corporation

Mitsuhiro Hirano

Kouji Tometsuka

Tetsuya Marubayashi

Shinya Morita

Satoshi Takano

Tomoshi Taniyama

Hideharu Itatani

Sadayoshi Horii

Masakazu Shimada

Michio Sato

Akihiro Sato

Yuichi Wada

Tetsuaki Inada

Motonari Takebayashi

Makoto Ozawa

Toshimitsu Miyata

Mitsunori Ishisaka

Tomoyuki Matsuda

Mitsunori Takeshita

Hidehiro Yanagawa

Koji Shibata

Hiroyuki Nishiuchi

Kazumi Nikaido

Yoshikazu Hisajima

A substrate processing apparatus, including: a processing chamber having a first and a second processing regions; a substrate mounting table rotatably installed in the processing chamber on which a substrate is mounted, and a rotation instrument configured to rotate the substrate mounting table such that the substrate passes through the first processing region and the second processing region in this order, at least one of the first and the second processing regions including: a gas supply part including a line-shaped opening portion extending in a radial direction of the substrate mounting table and configured to supply a gas from the opening portion into the region; and a gap holding member protruding from a ceiling of the processing chamber opposing the substrate, around the opening portion, toward the substrate such that a space on the substrate has a predetermined gap to serve as a passage of the supplied gas.

Substrate processing apparatus, method of manufacturing semiconductor device, and method of processing substrate

The sizes required for maintenance are reduced and an occupying floor area is reduced. The substrate processing apparatus contains a load lock chamberand a transfer chamberrespectively provided in order from the rear side within a case; and a processing chamberprovided above the load lock chamberfor processing wafers. An opening sectionA, and an opening and closing meansA for opening and closing the opening sectionA are respectively provided in a location at the rear side of the transfer chamberwhere the load lock chamberis not arranged.

Substrate processing apparatus and manufacturing method for a semiconductor device

A substrate processing apparatus comprises a semiconductor wafer processing chamber, a wafer transfer device, a wafer cassette holding unit, a wafer cassette transfer device and a wafer cassette bringing in/out section disposed in this order and a housing. The wafer cassette holding unit is movable between a wafer processing time position and a maintenance time position thereof and the wafer cassette transfer device is movable between a wafer processing time position and a maintenance time position thereof. The wafer cassette bringing in/out section is capable of rotating forward of the housing, whereby the front face of said housing is opened. With the wafer cassette holding unit being positioned at the maintenance time position thereof, the wafer cassette transfer device being positioned at the maintenance time position thereof and the wafer cassette bringing in/out section being rotated forward of the housing to open the front face thereof, maintenance of the wafer transfer device can be performed from the front face of the housing.

Substrate processing apparatus and maintenance method therefor

A substrate processing apparatus comprises a substrate processing chamber for processing a substrate, a load lock chamber, a gas supply line for supplying gas into the load lock chamber, exhaust lines for exhausting the load lock chamber, a moving mechanism provided in the load lock chamber and capable of moving the substrate, local exhaust lines capable of locally exhausting dust generating portions of the moving mechanism, a flow rate controlling device provided in the gas supply line and flow rate controlling devices provided in the local exhaust lines. The flow rates of the flow rate controlling devices are monitored and controlled to control the inside pressure of the load lock chamber to be slightly higher than the atmosphere pressure, thereby preventing the backward flow from the vent line.

Substrate processing apparatus with local exhaust for removing contaminants

A semiconductor manufacturing equipment, which comprises a boat elevator installed below a reaction chamber for loading a boat into the reaction chamber, cassette stocker installed opposite to the boat elevator, a wafer carrier installed between the cassette stocker and the boat elevator and used for transferring wafers between the cassette stocker and the boat, and a load-lock chamber for accommodating the boat elevator, whereby wafers are carried in the atmospheric air within the semiconductor manufacturing equipment, and the transport time is set in such manner that an increase of a natural oxide film formed on the wafers is 2 angstroms or less.

Semiconductor manufacturing equipment and method for carrying wafers in

A plurality of airtight chambers are connected through blocking means, which can communicate or shut off the chambers, and at least one of the airtight chambers is used as a processing chamber. One of the adjacent airtight chambers is replaced by a replacement gas, and the replacement gas is supplied to the other of the adjacent airtight chambers. When pressure difference or pressure in the two adjacent airtight chambers is below a predetermined value, the adjacent two airtight chambers are communicated, and pressure in the two airtight chambers is equalized.

Method for supplying and discharging gas to and from semiconductor

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Toyama, Japan

Mitsuhiro Hirano