Dainippon Screen Mfg. Co., Ltd.

Matsushita Electric Industrial Co., Ltd.

Mitsuhiro Fujita

Toshio Ishizaki

Masami Ohtani

Kenji Sugimoto

Hikaru Ikeda

Takashi Fujino

Joichi Nishimura

Shigeo Furukawa

Masahiro Hiraka

Masaru Kitagawa

Masahide Ikeda

Nobuyasu Hiraoka

Manabu Yabe

Takanori Kawamoto

Takafumi Ohki

The apparatus for producing glass beads of the present invention comprises a melting potfor heating and melting glass, a nozzleA for dripping molten glassin the melting pot, which is disposed at the bottom of the melting pot, and a liquid glass droplet receiverfilled with cooling solutionfor cooling the liquid glass dropletdripped from the nozzleA, which is disposed under the nozzleA, wherein the cooling solutionis made from a material that forms a bubble layer around the liquid glass dropletas the cooling solutionis vaporized due to the heat of the liquid glass dropletduring a period when the liquid glass dropletis cooled down to a temperature lower than the glass transfer temperature in the cooling solution

Process for producing spherical glass

A method of and apparatus for cleaning a substrate which require shorter processing time with high processing efficiency are disclosed. A cleaning brush pivots about a pivot axis between two positions. An ultrasonic cleaning nozzle pivots about a pivot axis between two positions. To perform a cleaning process, the cleaning brush and the ultrasonic cleaning nozzle are driven in accordance with a processing pattern previously produced by an operator. The processing pattern is produced so that the movement of the cleaning brush between two positions and the movement of the ultrasonic cleaning nozzle between two positions are not caused simultaneously. Any processing pattern desired by the operator may be produced if this requirement is satisfied. Execution of the cleaning process in accordance with the processing pattern allows cleaning of a substrate using the cleaning brush and the ultrasonic cleaning nozzle at the same time.

Method of and apparatus for cleaning substrate

A substrate spin treating apparatus includes a spin chuck for supporting a substrate in a horizontal posture and spinning the substrate about a vertical axis. A nozzle is provided for supplying a treating solution to the substrate supported by the spin chuck, and a scatter preventive cup in disposed to surround the substrate on the spin chuck and has an inclined surface extending around an entire inner circumference of the cup for downwardly guiding sprays of the treating solution and the like formed by a spinning of the substrate. The scatter preventive cup includes an inner skirt extending around an entire circumference adjacent an upper end of the inclined surface The inner skirt has a surface opposed to the inclined surface and bent away from a spin center of the substrate. This construction suppresses the treating solution from adhering to and accumulating on portions, adjacent the upper end of the inclined surface, of the surface of the inner skirt opposed to the inclined surface. During cup rinsing, a rinsing solution spreads well over that surface of the inner skirt.

Substrate spin treating apparatus

A plurality of brush support arms, each having a distal end unit brush attached thereto, stand by in juxtaposition in a standby position. The brush support arm having a desired brush attached thereto is selected from the plurality of brush support arms. Then, the selected brush support arm is connected at its proximal end to a distal end of a swing arm. The brush support arm engaged with the swing arm is swung with the swing arm about a pivotal point at a proximal end of the swing arm. As a result, the brush attached to the distal end of the selected brush support arm is moved between the standby position and the center of a substrate, to clean the substrate with this brush. Upon completion of this substrate cleaning, the brush support arm is returned to the standby position. A different brush support arm is selected in the standby position for use in a subsequent cleaning operation, and the substrate is cleaned with the brush connected to this different brush support arm.

Apparatus for cleaning substrates and methods for attaching/detaching

A dispensing apparatus for delivering a silica coating solution in a fixed quantity from a liquid container to a surface of a substrate to form a silica film thereon. The liquid container storing the silica coating solution is connected to a diaphragm pump through a suction pipe. The diaphragm pump is connected to a nozzle through a delivery pipe. The coating solution in the liquid container is supplied to the nozzle by sucking and delivering action of the diaphragm pump. The coating solution is discharged from the nozzle to a surface of a substrate supported by a spin chuck of a spin coating apparatus.

Apparatus for delivering a silica film forming solution

A small and thin plane type narrow-band dielectric filter to be used for a portable telephone and the like, includes a plurality of end short-circuited strip line resonators having a length of about quarter-wavelength formed parallel and closely to each other on a first dielectric substrate and directly magnetically coupled to each other. The thus formed strip line resonators are partially bonded to parallel plane capacitor electrodes formed on a second dielectric substrate in respective overlapping areas thereby electrically coupling the strip line resonators through the parallel plane capacitors, so that the inter-resonator coupling can be reduced due to the fact that it is achieved in combination with the magnetic coupling and the electrical coupling.

Dielectric filter having inter-resonator coupling including both

An apparatus for applying liquid agent to a substrate includes a cup member for preventing liquid agent from scattering. Cleaning agent is supplied to an inner circumferential surface of the cup member through openings located at an upper portion of the inner circumferential surface. The structure for supplying the cleaning agent is integrally formed on an outer circumferential surface of the cup member. The apparatus also has a slanted surface for regulating and guiding air, liquid agent and cleaning agent downwardly through the cup member. Cleaning agent is supplied to the slanted surface through openings which are located at an upper portion thereof. Preferably, the openings are angled so that cleaning agent is directed substantially horizontally therefrom. Preferably, the apparatus has fine irregularities for spreading cleaning agent on the inner circumferential and slanted surfaces.

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Kyoto, Japan

Mitsuhiro Fujita