Fujifilm Corporation

Coorstek Kk

Toshiba Ceramics Co., Ltd.

Covalent Materials Corporation

Mitsuhiro Fujita

Michihiro Shirakawa

Shuko Akamine

Shuhei Yamaguchi

Hironori Oka

Akinori Shibuya

Akiyoshi Goto

Keita Kato

Tomoki Matsuda

Masaki Irie

Yasuharu Shiraishi

Keiji Morita

Tomotaka Tsuchimura

Kei Yamamoto

Takashi Kawashima

Shohei Kataoka

Akihiro Kaneko

Masafumi Kojima

Naohiro Tango

Michihiro Ogawa

Yusuke Namba

Hisamitsu Tomeba

Takumi Tanaka

Hajime Furutani

Yukiko Kikuchi

Kyohei Sakita

Akira Takada

Akira Sakaguchi

Yuki Sakamoto

Yoko Tokugawa

Haruo Murayama

Shigeko Muramatsu

Kouji Sano

Shinichiro Aonuma

Aina Ushiyama

Ramesh Vallepu

Kazunari Yagi

Yu Yokoyama

Masako Uematsu

Keishi Yamamoto

A pattern forming method produces a pattern having excellent LER performance. Additionally, an actinic ray-sensitive or radiation-sensitive composition and a method for manufacturing an electronic device, which relate to the pattern forming method are disclosed. The pattern forming method includes: exposing a resist film, the resist film including an acid-decomposable group a which reacts to generate a polar group having a pKa of 6.0 or more, an acid-decomposable group b which reacts to generate a polar group having a pKa of less than 6.0, and a photoacid-generating component, a first heating step for reacting at least a part of the acid-decomposable group a with an acid to generate the polar group having a pKa of 6.0 or more, a second heating step for reacting at least a part of the acid-decomposable group b to generate the polar group having a pKa of less than 6.0, and a development step.

Pattern forming method, actinic ray-sensitive or radiation-sensitive composition, and method for manufacturing electronic device

An actinic ray-sensitive or radiation-sensitive resin composition includes a resin X including a repeating unit derived from a compound including two or more structural moieties consisting of an anionic moiety and a cationic moiety, and a polymerizable group, in which the compound generates an acid including an acidic moiety derived from the anionic moiety in the two or more structural moieties by irradiation with actinic rays or radiation.

Active-light-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, method for manufacturing electronic device, compound, and resin

A photosensitive composition for EUV light includes a predetermined resin and a photoacid generator, or includes a predetermined resin having a repeating unit having a photoacid generating group, and satisfies Conditions 1 and 2,

Photosensitive composition for EUV light, pattern forming method, and method for manufacturing electronic device

An on-machine development lithographic printing plate precursor includes an image-recording layer on an aluminum support having an anode oxide film, wherein an end portion of the lithographic printing plate precursor has a shear droop shape, the image-recording layer contains a compound having a support adsorptive property, having a molecular weight of 1,000 or less, and not having an unsaturated double bond group in a molecule, and a content of the compound is substantially the same in a plane of the image-recording layer.

On-machine development-type lithographic printing plate precursor and method for producing lithographic printing plate

An actinic ray-sensitive or radiation-sensitive resin composition contains a resin having an acid-decomposable group whose polarity increases through decomposition by the action of an acid, an acid generator A capable of generating a first acid upon irradiation with actinic rays or radiation, and an acid generator B capable of generating a second acid upon irradiation with actinic rays or radiation, and the first acid and the second acid satisfy predetermined requirements.

Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device

The present invention relates to a glass member in which an inorganic phosphor is dispersed in a glass matrix, in which the glass member includes an SiO&#x2014;BObased glass as the glass matrix, and the SiO&#x2014;BObased glass includes SiOas a main component thereof, and includes, based on a total amount of the SiO&#x2014;BObased glass: AlOin an amount of 4 to 10 wt %; and MgO and ZnO in a total amount of 0.1 to 0.7 wt %.

Glass member

Particles for a monolithic refractory are made of a spinet porous sintered body which is represented by a chemical formula of MgAlO, wherein pores having a pore size of 0.01 &#x3bc;m or more and less than 0.8 &#x3bc;m occupy 10 vol % or more and 50 vol % or less with respect to a total volume of pores having a pore size of 10 &#x3bc;m or less in the particles, and the particles for a monolithic refractory have grain size distribution in which particles having a particle size of less than 45 &#x3bc;m occupy 60 vol % or less, particles having a particle size of 45 &#x3bc;m or more and less than 100 &#x3bc;m occupy 20 vol % or more and 60 vol % or less, and particles having a particle size of 100 &#x3bc;m or more and 1000 &#x3bc;m or less occupy 10 vol % or more and 50 vol % or less.

Particles for monolithic refractory

A heat insulating material includes a porous sintered body formed of MgAlOand having a porosity of 60% or more and less than 73%. In the heat insulating material, pores having a pore diameter of 0.8 &#x3bc;m or more and less than 10 &#x3bc;m occupy 30 vol % or more and less than 90 vol % of a total pore volume, pores having a pore diameter of 0.01 &#x3bc;m or more and less than 0.8 &#x3bc;m occupy 10 vol % or more and less than 60 vol % of the total pore volume, the thermal conductivity at 20&#xb0; C. or higher and 1500&#xb0; C. or lower is 0.45 W/(m&#xb7;K) or less, and the compressive strength is 2 MPa or more.

[object Object]

One aspect of the heat insulator of the present invention includes a porous sintered body having a porosity of 70 vol % or more and less than 91 vol %, and pores having a pore size of 0.8 &#x3bc;m or more and less than 10 &#x3bc;m occupy 10 vol % or more and 70 vol % or less of the total pore volume, while pores having a pore size of 0.01 &#x3bc;m or more and less than 0.8 &#x3bc;m occupy 5 vol % or more and 30 vol % or less of the total pore volume. The porous sintered body is formed from an MgAlO(spinel) raw material and fibers formed of an inorganic material, the heat conductivity of the heat insulator at 1000&#xb0; C. or more and 1500&#xb0; C. or less is 0.40 W/(m&#xb7;K) or less, and the weight ratio of Si relative to Mg in the porous sintered body is 0.15 or less.

Heat insulator

According to one embodiment, An actinic-ray- or radiation-sensitive resin composition comprises a basic compound (C) having n basic groups and m groups that when exposed to actinic rays or radiation, generate an acid, provided that n and m satisfy the relationships n&#x2267;1, m&#x2267;2 and n&#x3c;m.

Actinic-ray- or radiation-sensitive resin composition and method of forming pattern therewith

A heat-insulating material is provided in which thermal conductivity is controlled not to increase and good insulation properties are held even in a high temperature range. The heat-insulating material is formed of a spinel porous sintered body having a porosity of 65 to 90 vol. % and represented by a chemical formula XAlO(X=Zn, Fe, Mg, Ni, or Mn) which is arranged such that large pores having a diameter of greater than 1000 &#x3bc;m occupy 25 vol. % or less of the total pore volume, fine pores having a diameter of 0.45 &#x3bc;m or less occupy 5 to 40 vol. % of the volume of the pores having a diameter of 1000 &#x3bc;m or less, at least one pore-diameter distribution peak is within a range of 0.14 to 10 &#x3bc;m, and is formed of sintered particles having a calculated average particle diameter of 0.04 to 1 &#x3bc;m.

Heat-insulating material

Provided are an actinic-ray- or radiation-sensitive resin composition that excels in the sensitivity, roughness characteristics and exposure latitude, and a method of forming a pattern using the same. The composition includes (A) a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, and (B) a compound that when exposed to actinic rays or radiation, is decomposed to thereby generate an acid, the compound being any of compounds of general formula (1-1) below. 

Actinic-ray- or radiation-sensitive resin composition, actinic-ray- or radiation-sensitive film therefrom and method of forming pattern using the composition

Provided is an actinic-ray- or radiation-sensitive resin composition including (A) a resin that when acted on by an acid, is decomposed to thereby increase its solubility in an alkali developer, (B) an onium salt containing a nitrogen atom in its cation moiety, which onium salt when exposed to actinic rays or radiation, is decomposed to thereby generate an acid, and (C) a compound that when exposed to actinic rays or radiation, generates an acid, the compound being any of compounds of general formulae (1-1) and (1-2) below. 

The present invention relates to a ceramics composite including an inorganic material which includes: a matrix phase including a translucent ceramics; and a phosphor phase including YAG containing Ce, in which a content of the phosphor phase is from 22% by volume to 55% by volume based on the whole phase including the matrix phase and the phosphor phase, a content of Ce in the YAG is 0.005 to 0.05 in terms of an atomic ratio of Ce to Y (Ce/Y), and the ceramics composite has a thickness in a light outgoing direction of 30 &#x3bc;m to 200 &#x3bc;m.

Ceramics composite

An actinic ray-sensitive or radiation-sensitive resin composition includes: (A) a resin capable of increasing a solubility of the resin (A) in an alkali developer by an action of an acid; and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, wherein (B) the compound capable of generating an acid upon irradiation with an actinic ray or radiation is contained in an amount of 10 to 30 mass % based on the entire solid content of the actinic ray-sensitive or radiation-sensitive resin composition, and a pattern forming method uses the composition.

Growing community of inventors

Kanagawa, Japan

Mitsuhiro Fujita