Fuji Corporation

Mitsuhiko Shibata

Nobuaki Minoshima

Based on the measured values of the electrical characteristics of multiple components including a component positioned in the middle among many components held on the component tape, it is possible to more accurately estimate the electrical characteristics of the many components as compared with the case based on the measured value of the electrical characteristic of a component positioned at the leading end. Also, based on the statistically processed results of these measurement values, it is possible to appropriately evaluate the electrical characteristics of many components. Further, if the electrical characteristics of all of the components are measured, the evaluation can be performed more appropriately.

Component evaluation method, electrical characteristic measurement method, component packaging machine, and machine dedicated to electrical characteristic measurement

An electronic component mounting machine includes an image-capturing device and a control device. The image-capturing device captures the images of sub-fiducial marks and main fiducial marks. When the control device can read the main fiducial marks from the images captured by the image-capturing device, the control device determines the mounting positions of the electronic components with respect to a substrate with reference to the main fiducial marks. On the other hand, when the main fiducial marks cannot be read from the images due to a print defect of the main fiducial marks, the control device determines the mounting positions of the electronic components with respect to the substrate with reference to the sub-fiducial marks which are the reference sources of the image-capturing positions of the main fiducial marks.

Electronic component mounting machine and production line

A component mounting machine includes a mounting head configured to select and execute an individual mode in which lifting and lowering is performed for each of multiple holding tools, each of which holds a component and a collective mode in which the holding tools are lifted and lowered collectively; a memory section configured to store multiple collective lifting and lowering scheduled groups in each of which the components of which the number is the same as the number of holding tools are grouped; and a control section configured to subsequently execute holding of the component by the holding tool, dipping of the component into a coating agent, and mounting of the component on a board.

Component mounting machine

In a mounting system including multiple mounting machines, there is provided a mounting system that is capable of reducing the number of measurement devices that measure electrical characteristics of an electronic component. A control device controls a switching device in order to connect a measurement device and a mounting machine that transmitted request information for measuring the electrical characteristics of the electronic component. When transmitting an instruction for starting measurement to the measurement device and receiving a characteristic measurement value from the measurement device, the control device transfers the received characteristic measurement value to the mounting machine that transmitted request information.

Mounting system

In an electronic component mounting system, a mounting management server acquires measurement information relating to a result obtained by measurement of a component which is stored in a reel, registers the acquired measured information in the device information in association with a reel ID, and outputs the measurement information corresponding to the reel to a mounting machine during a mounting process. The mounting process device receives the device information in which the measurement information that relates to the result obtained by measuring the component stored in the reel and that is associated with the reel ID is registered, when the measurement information is present in the device information of the component to be mounted, the mounting process device executes the mounting process of the component.

Growing community of inventors

Toyota, Japan

Mitsuhiko Shibata