Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Mitsuhide Kato

Norio Nakajima

Teruhisa Tsuru

Koji Furutani

Koji Tanaka

Ken Tonegawa

Tatsuya Ueda

Harufumi Mandai

Keiji Ogawa

Takashi Watanabe

Tetsuo Taniguchi

Hiromichi Kitajima

Hisatake Okamura

Hideki Muto

Takahiro Watanabe

Yoshikazu Chigodo

Junya Shimakawa

Kazuto Ogawa

Toshiaki Kariya

Yoshinori Yamada

A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.

Method of producing electronic components and method of producing substrate-type terminals

A high-frequency switch includes a transmission terminal, an antenna terminal, a reception terminal, and a voltage-control terminal; a first diode, the cathode thereof being electrically connected to the transmission terminal, and the anode being electrically connected to the antenna terminal; a first transmission line, electrically connected between the antenna terminal and the reception terminal; a second diode, the cathode thereof being electrically connected to the reception terminal, and the anode being electrically connected to the voltage-control terminal; a second transmission line, one end thereof being electrically connected to the transmission terminal, and the other end being connected to ground; and a capacitor, electrically connected between the voltage-control terminal and ground. The above high-frequency switch can be miniaturized and has superior performance.

High-frequency switch

A laminated electronic component includes a laminated block in which a plurality of electrically insulating layers are laminated. An external conductor film is disposed on a surface of the laminated block. An additional conductor film which is at the same potential as the external conductor film is arranged such that it faces the external conductor film with an insulating layer disposed therebetween. The additional conductor film and the external conductor film are electrically connected to each other through a via-hole conductor so that they are at the same potential.

Laminated electronic component

A laminated electronic component includes a laminate having first and second major surfaces. Four predetermined indication locations are provided on the first major surface. One or more via-hole conductors are arranged at corresponding one or more of the indication locations. The locations and the number of indicating via-hole conductors allows for identification of information regarding the laminated electronic component. Each indicating via-hole conductor is exposed at the first major surface, does not reach the second major surface, and is electrically isolated from wiring conductors built into the laminate.

An integrated electronic component includes a ceramic substrate incorporating circuit elements and/or having circuit elements mounted thereon, and a metal case mounted on the ceramic substrate. Notches are formed in substrate-facing segments of the metal case at the positions opposing the corners of the top surface of the ceramic substrate. The notches have a tapered shape having obtuse angles with respect to the top surface of the substrate. The notches may have a substantially circular arc shape. The substrate-facing segments having the notches are seamlessly connected to side segments of the metal case, bent in the vicinity of the notches, and supported by the bent portions in a cantilevered fashion.

Integrated electronic component

An electronic device includes a wiring substrate, an electronic component mounted on the wiring substrate by soldering, and a case fixed to the wiring substrate so as to cover the electronic component. The case is fixed to the wiring substrate via soldering, and the case and the electronic component are adhered to each other with an adhesive resin supplied through an opening provided in the upper surface of the case. The adhesive resin is applied so as not to contact the wiring substrate such that interface separation does not occur between the adhesive resin and the wiring substrate even when the solder for mounting the electronic component on the wiring substrate is melted and expanded in a solder reflow process. As a result, the generation of short circuiting between terminal electrodes of the electronic component, which is caused by the solder flowing in the portion of the interface separation, is prevented.

Electronic device

High frequency circuit component

In a high frequency switch, first and second diodes are respectively connected between first and second ports and between first and third ports so that they are directed in the same direction with respect to the first port. Coupling capacitors are connected on both sides of the respective diodes. Distributed constant lines and capacitors are connected between points of connection between the respective diodes and the corresponding capacitors, and reference potentials. Control voltage terminals are connected to points of connection between the distributed constant lines and the capacitors. A distributed constant line and a capacitor are connected between the first port and a reference potential. A fixed voltage terminal is connected through a resistor to a point of connection between the distributed constant line and the capacitor.

A high-frequency switch having a greatly reduced occurrence of high harmonic signals includes first and second switches, and each of these two switches includes two diodes and two transmission lines. Besides, one of the two voltage control terminals is connected, via a resistor, to the intermediate connection point between the anode of one of the two diodes of the first switch and one of the two transmission lines of the first switch. The other of the voltage control terminals is connected, via another resistor, to the intermediate connection point between the anode of one of the two diodes of the second switch and one of the two transmission lines of the second switch.

A high-frequency component which requires no shielding electrodes and in which there are no limitations upon the places where plural sets of filter components can be formed. In one embodiment, a high-frequency component has first to third ports, and includes a BPF connected between the first port and the second port and a BRF connected between the first port and the third port. The BPF and BRF comprise transmission lines and capacitors formed on a plurality of laminated dielectric layers. In another embodiment, the component comprises an HPF and an LPF formed on a plurality of dielectric layers. In both cases, the passbands of the respective filters are predetermined not to substantially overlap one another.

Multilayer duplexer with no shielding electrodes

A high-frequency switch in which insertion losses can be reduced and a wiring pattern for supplying control voltages can be simplified. The high-frequency switch has first through fourth ports. A transmission line is connected between each pair of the ports, thereby connecting the pairs of ports to each other. A respective capacitor is coupled between each of the ports and a corresponding one of the nodes between the respective transmission lines. A diode is connected between each of said nodes and a reference potential. A capacitor is coupled between the reference potential and each of the diodes. First through fourth control voltage terminals are connected to respective nodes between each of the diodes and the corresponding capacitors.

A composite high-frequency component is designed to occupy a smaller area and a smaller volume when mounted in an apparatus, can be located in the apparatus with improved flexibility, and is able to operate without an impedance matching circuit. The composite high-frequency component includes a multilayer substrate, diodes constituting a high-frequency switch component, and a circuit base. External terminals for connection to a transmitting circuit, a receiving circuit and an antenna, external terminals for control and an external terminal for connection to ground potential are formed on an outer surface of the multilayer substrate. Strip lines and capacitors constituting the high-frequency switch and strip lines and capacitors constituting a low-pass filter circuit are formed in the multilayer substrate.

Composite high-frequency component

A composite high frequency apparatus includes a high frequency filter and a high frequency switch which have a substantially reduced size and do not require an impedance matching circuit. The apparatus includes a multilayered base having an outer surface with a plurality of diodes, an external ground electrode, an external electrode for a transmission circuit, an external electrode for a receiving circuit, an external electrode for an antenna circuit and external electrodes for control terminals located thereon. A plurality of strip lines, capacitor electrodes and an external grounding electrode are located within the multilayered base.

Growing community of inventors

Sabae, Japan

Mitsuhide Kato