Kyocera Corporation

Mitsuharu Sakai

Shou Yamasaki

Noritaka Niino

Yukio Morita

Toshihiro Hashimoto

Yuusuke Takei

Natsumi Ochi

Shigetoshi Inuyama

A light emitting module and the like having a higher heat-dissipation effect includes a light emitting element mounting substrate, one or more light emitting elements, a heatsink including a through-hole in a position corresponding to a screw hole, a bolt screwed in the screw hole and fastening the heatsink and a metal plate or a full thread and a nut for the fastening. In the light emitting element mounting substrate, the metal plate, an insulating layer, and an electrode layer on which the one or more light emitting elements are mountable are stacked in this order. The metal plate includes a bottomed screw hole opened at a surface opposite to a surface in contact with the insulating layer. The bolt or the full thread and the nut have a heat conductivity equal to or greater than that of the metal plate.

Light emitting element mounting substrate, light emitting device, and light emitting module

An optical element mounting package includes a substrate including a recess comprising a bottom surface on which an optical element is to be mounted, and a side wall comprising an opening. The bottom surface of the recess has a cutout adjacent to the opening.

Optical element mounting package, electronic device, and electronic module

An electronic device mounting substrate includes: a first wiring substrate shaped in a rectangular frame, an interior of the rectangular frame constituting a first through hole; a second wiring substrate shaped in a rectangular frame or plate, the second wiring substrate being disposed so as to overlie a lower surface of the first wiring substrate and be electrically connected to the first wiring substrate; a metallic plate disposed so as to overlie a lower surface of the second wiring substrate so that the second wiring substrate is sandwiched between the metallic plate and the first wiring substrate; and a lens holder secured to an outer periphery of the metallic plate. A frame interior of the first wiring substrate, or a frame interior of each of the first wiring substrate and the second wiring substrate, constitutes an electronic device mounting space.

Electronic device mounting substrate and electronic apparatus

Growing community of inventors

Kyoto, Japan

Mitsuharu Sakai