Hitachi, Ltd.

Mitsugu Shirai

Shinichi Kazui

Hideaki Sasaki

Kaoru Katayama

Mitsunori Tamura

Hiroshi Fukuda

Yasuhiro Iwata

Toshihiko Ohta

Hideyuki Fukasawa

Toru Nishikawa

Toshitaka Murakawa

Keiji Fujikawa

Kenichi Hamamura

Fumio Yoshikawa

Masahide Harada

Masahito Ijuin

Hitoshi Odashima

Makoto Matsuoka

Yutaka Hashimoto

Ryohei Sato

Tsutomu Sakamoto

Kenichi Inoue

Isamu Takaoka

Osamu Yamada

Ryohei Satoh

Tetsuya Hayashida

Yuzo Taniguchi

Kosuke Inoue

Takayuki Uda

Shinya Miura

Kouzou Kanda

A laser printing apparatus is formed by a laser oscillator , galvano mirrors for scanning the laser light emitted from the laser oscillator , and an f&thgr; lens for focusing the laser light emitted from the laser oscillator on MCCs serving as the member to be printed. The laser oscillator is an YLF laser oscillator which emits the laser light of the third harmonics in the ultraviolet range. The laser printing is performed on the MCCs serving as the member to be printed by using the laser light emitted from the laser oscillator

Laser printing method and apparatus

A soldering system which reduces the numbers of steps for paste supply and soldering onto a printed circuit board. A printed circuit board has through holes through which a lead of each provided part is to be inserted. A printing mask is matched with the through holes and a paste receiving plate having holes to which solder paste is supplied corresponding to the through holes is disposed. A printing roller is swept by forcibly rotating it to fill with solder paste, then a printing squeegee follows the printing roller to further fill through holes. Parts are loaded on the through holes and reflowing is carried out on the printed circuit board and paste receiving plate, so that the parts are soldered to the printed circuit board.

Paste providing method, soldering method and apparatus and system therefor

Electric conductor patterns including antenna coils are formed on one surface of a film. Electronic components are fixed onto the film by a temporary fixing material. A cover film is laminated on the film so that the electrically conductive patterns and the electronic components are covered with the cover film. Simultaneously with the lamination, the electronic components are connected to the electric conductor patterns.

Thin electronic circuit component and method and apparatus for producing the same

An improved soldering system which reduces the numbers of steps for paste supply and soldering in soldering lead provided parts and surface mounting parts onto a printed circuit board. A printed circuit board has through holes through which a lead of each lead provided part is to be inserted and lands for surface mounting parts. A printing mask is matched with the through holes and lands and a paste receiving plate having holes to which solder paste is to be supplied corresponding to each of the through holes is disposed. A printing roller is swept by forcibly rotating it so as to fill with solder paste, then a printing squeegee is swept following that printing roller so as to further fill with solder paste. Parts are loaded on the through holes and lands of the printed circuit board loaded with solder paste and reflowing is carried out on the printed circuit board and paste receiving plate at the same time, so that the lead provided parts and surface mounting parts are soldered to the printed circuit board at the same time.

The present invention is a process for manufacturing an electronic circuit device by applying a solder material to electronic parts or electrodes on a printed circuit board; the process comprising the steps of removing an initial surface oxide film and an organic contaminant film from the surfaces of the solder material and electrode, covering the solder material and an area to which solder is to be applied which is comprised of the electrode, with a liquid vaporizing up after the bonding is completed in the step of heat-melting the solder material, to thereby prevent reoxidation of the joining area surface, and heat-melting the solder material, to carry out solder bonding without using any flux.

Process for manufacturing electronic circuit devices

Laser printing method and apparatus for printing characters

The process for manufacturing an electronic circuit includes disposing an electronic device on a circuit substrate and hot melting a solder formed on the electronic device or the circuit substrate to bond the electronic device and the circuit substrate. The process includes the steps of feeding a liquid onto lands on the circuit substrate, aligning and mounting the electronic device on the lands, placing the circuit substrate in a treating vessel and heating the circuit substrate. The heating step includes controlling a pressure of an atmosphere in the treating vessel, hot-melting the solder to prevent at least a portion of the liquid from evaporating until the electronic device and the circuit substrate are bonded and to permit the liquid to evaporate after the electronic device and the circuit substrate are bonded.

Process for manufacturing electronic circuits

In a method for manufacturing a printed circuit board, this printed circuit board can be manufactured by executing a simple manufacturing step within a short time period at in low cost without requiring a complex manufacturing process. A conductive material is pattern-printed on a base board and the printed conductive material is hardened to form a first conductor layer. Subsequently, an insulating material is pattern-printed on the first conductor layer, and the printed insulating material is hardened to thereby form a first insulating layer. A manufacturing step similar to the above-described step is repeatedly performed to thereby form a second conductor layer, a second insulating layer, and a third conductor layer. Furthermore, a manufacturing step similar to the above-explained step is repeatedly performed, so that a printed circuit board having a multi-conductor layer can be manufactured.

Printed circuit board, IC card, and manufacturing method thereof

An electronic device is solder bonded properly without using fluxes nor precise positioning with respect to a substrate. A bond pad with a size about twice the size of terminal pad of the electronic device is formed in a region on the substrate where the electronic device is to be mounted. After placing the electronic device of the substrate surface, the whole unit is heated in a nitrogen atmosphere to melt a bump formed on the terminal pad of the electronic device. The molten solder wets and spreads over the bond pads formed on the substrate, thereby establishing reflow soldering between the bond pads and the terminal pads. The position of the electronic device with respect to the substrate is spontaneously corrected due to a self-alignment function induced by wetting and spreading of the molten solder over the bond pad of the substrate.

Electronic device bonding method and electronic circuit apparatus

A process for manufacturing electronic circuits, according to which soldering can be carried out without using flux by applying a metal surface treatment procedure which allows oxide film, organic matters, carbon or the like on the surface of metal to be easily removed without using a complex process nor unfavorably affecting electronic devices or circuit substrates. A process of connecting an electronic device and a circuit substrate by means of solder comprises the steps of irradiating the solder with a laser beam to clean the solder, aligning and mounting the electronic device on the circuit substrate, and hot-melting said solder in a low-oxygen content atmosphere to bond the electronic device and the circuit substrate.

Growing community of inventors

Hadano, Japan

Mitsugu Shirai